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KAI-0340-AAA-CF-AA-SINGLE

Onsemi

KAI-0340-AAA-CF-AA-SINGLE by Onsemi

KAI-0340-AAA-CF-AA-SINGLE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 640x480 resolution, and 69 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,961 parts In-Stock

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Digiode

USA . 250 parts In-Stock

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Kulean Microsystems

USA . 8,143 parts In-Stock

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TANS Electronics

Latvia . 6,896 parts In-Stock

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SupplyDigital Components

Austria . 4,945 parts In-Stock

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Problanco Electronics

Mexico . 4,495 parts In-Stock

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Corohmni

South Africa . 405 parts In-Stock

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Corphita

USA . 285 parts In-Stock

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UHIMA Technologies

Türkiye . 119 parts In-Stock

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Overview

Elevate your imaging capabilities with the KAI-0340-AAA-CF-AA-SINGLE image sensor by Onsemi. Crafted with precision and expertise, this sensor is designed to deliver exceptional quality and performance in a variety of applications. With its advanced technology and reliable design, this sensor offers unparalleled value and benefits to customers looking to capture stunning images with ease. Explore new possibilities and elevate your projects with the KAI-0340-AAA-CF-AA-SINGLE image sensor today.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

The small pixel size allows for high resolution images to be captured with fine details.

Maximum Supply Voltage: 15.25 V

Higher supply voltage allows for efficient power utilization and optimal performance of the image sensor.

Body Width: 12.45 inch

The compact body width makes it suitable for integration in various devices and systems with limited space.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensors are known for their high-quality image capture and low noise levels, making them a reliable choice for imaging applications.

Body Height: 5.15 mm

The low body height adds to the compactness of the image sensor, allowing for versatile installation options.

Package Shape or Style: RECTANGULAR

Rectangular packaging simplifies the integration process and ensures a secure fit within the device.

Minimum Supply Voltage: 14.75 V

The lower minimum supply voltage ensures energy efficiency and reliable operation even under varying power conditions.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows for use in a variety of environments without affecting performance.

Horizontal Pixel: 640

Higher horizontal pixel count enables the sensor to capture detailed images with superior clarity.

Minimum Operating Temperature: -50 °C

The wide range of minimum operating temperature ensures the sensor's functionality in extreme cold conditions.

Housing: CERAMIC

Ceramic housing provides durability and protection to the image sensor, ensuring long-term reliability.

Dynamic Range: 69 dB

The high dynamic range allows the sensor to capture images with a wide range of brightness levels accurately.

Vertical Pixel: 480

The vertical pixel count contributes to the sensor's ability to capture images with good resolution and detail.

Body Length/Diameter: 15.87 mm

The moderate body length provides a balance between compactness and operational efficiency in various setups.

Optical Format (inch): 1/3

The 1/3 inch optical format is a common standard for image sensors, ensuring compatibility with a wide range of imaging devices.

Termination Type: SOLDER

Solder termination allows for secure electrical connection and reduces the risk of signal loss in the image sensor.

Array Type: INTERLINE

Interline array type enhances the sensor's sensitivity and reduces noise levels, resulting in high-quality image capture.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting facilitates easy and secure installation of the image sensor on PCBs or other electronic components.

Technical Specifications

Image Sensors KAI-0340-AAA-CF-AA-SINGLE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 30 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

12.45 inch

Body Height:

5.15 mm

Body Length/Diameter:

15.87 mm

Dynamic Range:

69 dB

Horizontal Pixel:

640

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1/3

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.25 V

Minimum Supply Voltage:

14.75 V

Termination Type:

SOLDER

Vertical Pixel:

480

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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