Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NOIV1SN1300A-XXC by Onsemi is a 1280x1024 CMOS image sensor with 4.80um pixel size and 62 MHz master clock. It operates b/w -40 to 85 °C, offering a dynamic range of 53 dB. Ideal for frame array applications in various industries due to its square package shape and 1/2 inch optical format.
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UHIMA Technologies
The small pixel size allows for detailed and high-resolution images to be captured, making this sensor ideal for applications requiring sharp image quality.
The high master clock frequency enables fast data readout and processing, resulting in quick and efficient image capture and transfer.
The compact body width makes the sensor suitable for integration into various devices and equipment without taking up much space.
CMOS image sensors are known for their low power consumption, high sensitivity, and fast readout speeds, making them a versatile and reliable choice for imaging applications.
The square package shape provides a symmetrical and efficient design, allowing for easy integration and mounting within electronic systems.
The high maximum operating temperature ensures the sensor can withstand extended use in various environmental conditions without overheating or malfunctioning.
The high horizontal pixel count enables capturing wide and detailed images, making this sensor suitable for applications requiring a large field of view.
The low minimum operating temperature allows the sensor to function in cold environments without performance degradation, ensuring reliable operation in a wide range of conditions.
The high dynamic range provides a wide range of tonal values in captured images, allowing for accurate representation of both low and high-light scenes.
The vertical pixel count contributes to the overall image resolution and quality, enabling precise and detailed image capture for various applications.
The small body length or diameter makes the sensor compact and easy to integrate into space-constrained devices or systems.
The optical format of 1/2 inch provides a good balance between sensor size and image quality, making this sensor suitable for a wide range of imaging applications.
The 4-wire interface allows for fast and efficient data transfer between the sensor and external devices, facilitating seamless integration and communication in imaging systems.
The frame array type organizes the sensor pixels in a structured grid pattern, enabling efficient image capture and processing for various imaging tasks.
Image Sensors NOIV1SN1300A-XXC attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Length/Diameter:
Dynamic Range:
Horizontal Pixel:
Master Clock:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
CSNF651
Honeywell Sensing And Control
CSNF651 by Honeywell Sensing And Control is an industrial-grade analog circuit with 3 terminals. It operates b/w -40 to 85°C, supporting supply voltages from -15V to 15V. Ideal for applications requiring a special shape rectangular package style and through-hole terminal form.
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H/883
Texas Instruments
LM107H/883 by Texas Instruments is a MIL-STD-883 compliant operational amplifier with 3000uV max input offset voltage, 80dB common mode reject ratio, and 250kHz unity gain bandwidth. Ideal for military applications due to its -55 to 125 °C operating temperature range and robust metal package body material.
BAV99
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
MBR0520LT3G
Onsemi
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
SMBJ18CA
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Daco Semiconductor
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
EU2B-YS2J03C
Idec
ROTARY SWITCH;
1552200168
Molex
WIRE AND CABLE;
M39029/56-351
TE Connectivity
TE Connectivity's M39029/56-351 is a CRIMP contact type backshell accessory with rated voltage of 115V. It operates b/w -65 to 175 °C, suitable for MIL-C-39029/56 connectors with wire gauge ranging from 28 to 22 AWG. Ideal for military applications requiring female contacts and copper alloy material.
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel; Terminal Form: GULL WING;
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
1N4148WS-7-F
Diodes Incorporated
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
BSS84-7-F
Diodes Inc. BSS84-7-F is a P-channel FET with 50V DS breakdown voltage, 0.13A max drain current, and 10 ohm RDS(on). Ideal for switching applications, it features a single configuration with built-in diode in a small outline package. Operating in enhancement mode at up to 150°C, it has Gull Wing terminals and matte tin finish.
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
KAI-08051-ABA-JD-AE
KAI-08051-ABA-JD-AE by Onsemi is a 5.5X5.5 um CCD image sensor with 3364Hx2520V pixels, offering a dynamic range of 66 dB. Operating b/w -50 to 70 °C, it has a supply voltage range of 14.5V to 15.5V and comes in a rectangular package style for applications in imaging systems requiring high-quality image capture.
MT9V011D00STCC82SC1-305
MT9V011D00STCC82SC1-305 by Onsemi is an image sensor with 5.60X5.60 um pixel size, 27 MHz master clock, and 640x480 resolution. It operates b/w -20 to 60 °C and has a dynamic range of 60 dB. Ideal for digital cameras, surveillance systems, and automotive applications due to its high-quality imaging capabilities at a max supply voltage of 3.05 V.
IMX290LQR-C
Sony
Sony's IMX290LQR-C image sensor features 2.9x2.9 um pixel size, 74.25 MHz master clock, and 120 fps frame rate. Ideal for applications requiring high-quality imaging in a compact form factor such as surveillance cameras or industrial machine vision systems.
AR0522SRSC09SURA0-DP
Onsemi's AR0522SRSC09SURA0-DP is a 12x1.62mm CMOS image sensor with 2592x1944 resolution, 1/2.5" optical format, and 60fps frame rate. It offers digital output via a 2-wire interface and is housed in a plastic package for surface mount applications.
AR0230CSSC00SUEA0-DRBR
AR0230CSSC00SUEA0-DRBR by Onsemi is a CMOS image sensor with 1928x1088 resolution, 3x3 um pixel size, and 96 dB dynamic range. It operates at -30 to 85 °C and has a digital voltage output interface. Ideal for applications requiring high-quality imaging at 60 fps frame rate.
NOIP1SN2000A-QTI
NOIP1SN2000A-QTI by Onsemi features 4.8x4.8 um pixel size, 360 MHz master clock, and 1920x1200 resolution. This image sensor is ideal for high-speed imaging applications requiring a dynamic range of 60 dB and a frame rate of 230 fps in an optical format of 2/3 inch.
MT9V125IA7XTC-DR
MT9V125IA7XTC-DR by Onsemi is a 640x480 CMOS image sensor with 5.60um pixel size and 71.7dB dynamic range. It operates at -40 to 85 °C, has a max supply voltage of 3.1V, and uses a digital current output interface. Ideal for applications requiring high-quality imaging in compact devices like smartphones and surveillance cameras.
KAI-43140-AXA-JP-B1
Onsemi's KAI-43140-AXA-JP-B1 is a 4.5x4.5 um CCD image sensor with 8040 (H) x 5360 (V) pixels, offering a dynamic range of 60 dB. It operates b/w -50 to 70 °C and requires a supply voltage of 14.5-15.5 V, making it suitable for high-resolution imaging applications in industrial and scientific fields.
MT9V024IA7XTM
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Dynamic Range: 100 dB; Vertical Pixel: 480; Minimum Operating Temperature: -40 Cel;
KAI-02050-AAA-JP-AE
Onsemi's KAI-02050-AAA-JP-AE is a 5.5x5.5 um CCD image sensor with 1684H x 1264V pixels, offering a dynamic range of 64 dB. Operating b/w -50 to 70 °C, it has a supply voltage range of 14.5V to 15.5V and is ideal for industrial imaging applications due to its high resolution and wide temperature tolerance.
NOIP1SE012KA-GTI
NOIP1SE012KA-GTI by Onsemi is an image sensor with 4.5x4.5 um pixel size, 360 MHz master clock, and 4096 horizontal pixels. It is ideal for applications requiring high-speed imaging with a frame rate of 160 fps and a dynamic range of 59 dB in a compact rectangular package measuring 43.1mm x 36.1mm x 3.5mm.
KAI-08050-AAA-JP-BA
Onsemi's KAI-08050-AAA-JP-BA is a 5.5x5.5um CCD image sensor with 3296H x 2472V pixels, offering a dynamic range of 64dB. Operating b/w -50 °C to 70°C, it requires a 15V power supply and comes in a rectangular package. Ideal for applications requiring high-quality imaging in various environmental conditions.
AR0144CSSC20SUKA0-CRBR
Onsemi's AR0144CSSC20SUKA0-CRBR is a 1/4 inch CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 60 fps frame rate. It features a solder termination type and 2-wire interface for surface mount applications in various imaging devices.
AR0135AT2M00XUEA0-TRBR
The Onsemi AR0135AT2M00XUEA0-TRBR image sensor features 1280x960 resolution, 3.75um pixel size, and 67.7dB dynamic range. Ideal for applications requiring high-quality digital imaging with a frame rate of 54fps in a compact square package.
NOM02A6-AR25G
NOM02A6-AR25G by Onsemi is a CMOS image sensor with a supply voltage range of 4.5V to 5.5V and operates b/w 0 °C to 50°C. It outputs analog voltage in the range of 0.90-1.1V, making it suitable for applications requiring precise image capture in various environments such as industrial automation and surveillance systems.
AR0132AT6M00XPEA0-TPBR
The Onsemi AR0132AT6M00XPEA0-TPBR is a 1/3-inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 115dB dynamic range. It operates at -40 to 105°C, has a max supply voltage of 1.95V, and uses a digital output interface. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
KAI-1003-AAA-CR-B2
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: INTERLINE; Horizontal Pixel: 1024; Minimum Operating Temperature: 0 Cel;
AS0260HQSC28SUKA0-CR
AS0260HQSC28SUKA0-CR by Onsemi is a CMOS image sensor with 1920x1080 resolution, 1.4um pixel size, and 65dB dynamic range. It operates at -30 to 70 °C, outputs digital voltage from 0.40-1.50V, and has a frame rate of 120fps. Ideal for applications requiring high-quality imaging in compact devices like smartphones and tablets.
AR0134CSSM00SUEA0-TPBR
AR0134CSSM00SUEA0-TPBR by Onsemi is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 64dB dynamic range. It operates at -30 to 70°C, has a max supply voltage of 1.95V, and uses a digital current output interface. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
KAF-8300-AXC-CD-AA
The Onsemi KAF-8300-AXC-CD-AA is a CCD image sensor with 5.4X5.4 um pixel size, offering a dynamic range of 64.4 dB and 3326 horizontal pixels. It operates b/w -10 to 70 °C, with a data rate of 28 Mbps, making it ideal for high-resolution imaging applications in various industries.
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NOIV1SN025KA-GDC
NOIV1SN025KA-GDC by Onsemi is a CMOS image sensor with 4.50x4.50 um pixel size, 310 MHz master clock, and 56.2 dB dynamic range. It is used in applications requiring high-resolution imaging at 53 fps, such as surveillance cameras and industrial machine vision systems.
NOIV1SE1300A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Power Supplies (V): 3.3; Minimum Supply Voltage: 1.6 V; Maximum Operating Current: 75 mA;
NOIV1SN1300A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Maximum Operating Temperature: 85 Cel; Maximum Operating Current: 75 mA; Dynamic Range: 53 dB;
NOIV2SN1300A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Body Height: 2.2 mm; Array Type: FRAME; Body Length/Diameter: 14.22 mm;
NOIV1SN2000A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Minimum Supply Voltage: 1.6 V; Housing: CERAMIC; Optical Format (inch): 2/3;
NOIV1SN025KA-GWC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 85 Cel; Spectral Response (nm): 400-1000; Body Length/Diameter: 43.1 mm;
NOIV1SE2000A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Array Type: FRAME; Maximum Operating Temperature: 70 Cel; Output Interface Type: 4-WIRE INTERFACE;
NOIV1SE5000A-QDC
NOIV1SE5000A-QDC by Onsemi is an image sensor with 4.80x4.80 um pixel size, 62 MHz master clock, and 2592 horizontal pixels. Ideal for applications requiring high-resolution imaging at a max supply voltage of 2V and operating temperature up to 70°C.
NOIV1SE012KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Vertical Pixel: 3072;
NOIV1SE025KA-GDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Spectral Response (nm): 400-1000; Minimum Operating Temperature: -40 Cel; Array Type: FRAME;
NOIV1SN012KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 1.6 V; Housing: CERAMIC;
NOIV1SN025KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: FRAME; Maximum Operating Temperature: 85 Cel; Housing: CERAMIC;
NOIV1SN012KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Master Clock: 340 MHz; Maximum Supply Voltage: 2 V;
NOIV1SE016KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Output Interface Type: 4-WIRE INTERFACE; Vertical Pixel: 4096;
NOIV1SE025KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 85 Cel; Array Type: FRAME; Maximum Supply Voltage: 2 V;
NOIV1SN016KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Spectral Response (nm): 400-1000;
NOIV1SE012KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Master Clock: 340 MHz;
NOIV1SE016KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 915 mA; Body Length/Diameter: 43.1 mm;
NOIV1SE025KA-GWC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 2 V; Maximum Operating Temperature: 85 Cel; Maximum Operating Current: 775 mA;
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