Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NOIV1SN012KA-GDI by Onsemi is a CMOS image sensor with 4.5X4.5 um pixel size, 340 MHz master clock, and 4096 horizontal pixels. It operates b/w -40 to 85 °C and has a dynamic range of 56 dB. Ideal for high-speed imaging applications requiring precise color reproduction and low light sensitivity.
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Corohmni
The small pixel size offers high resolution images with sharp details.
Allows for stable and efficient power supply operation.
High clock frequency enables fast data processing and transmission.
Compact body width for easy integration into various devices.
CMOS sensor technology offers low power consumption and high sensitivity.
Rectangular shape allows for efficient utilization of space in devices.
Provides flexibility in power supply options while maintaining performance.
Wide operating temperature range for versatility in different environments.
High horizontal pixel count for detailed and high-resolution images.
Current output type for accurate signal transmission and processing.
Capable of functioning in extreme cold temperatures without performance loss.
Supports high operating current for demanding applications.
Durable ceramic housing for protection and longevity of the sensor.
Wide dynamic range for capturing details in both bright and dark areas of an image.
High vertical pixel count for clear and detailed images.
Optimal size for easy installation and integration in devices.
Wide spectral response range for capturing a variety of wavelengths.
Standard optical format suitable for various imaging applications.
Solder termination type for secure and reliable connections.
4-wire interface for convenient communication with other devices.
High frame rate for capturing fast-moving objects with clarity.
Frame array type for organized and efficient image capture.
Through hole mounting feature for secure and stable installation.
Image Sensors NOIV1SN012KA-GDI attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Housing:
Master Clock:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Spectral Response (nm):
Sub-Category:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
DS18B20Z/T&R
Maxim Integrated
DS18B20Z/T&R by Maxim Integrated is a 12-bit digital temperature sensor with a max supply voltage of 5.5V and an accuracy of 0.50°C. It features a 1-Wire interface, operates b/w -55°C to 125°C, and is ideal for applications requiring precise temperature monitoring in compact spaces.
1N4148
Gulf Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WT
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Eic Semiconductor
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
LM358M
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SS14
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDLL4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Fairchild Semiconductor
2N2222A
Allegro MicroSystems
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
Dc Components
OPA2227UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148WS-7-F
Diodes Incorporated
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
CRGCQ0805F10R
TE Connectivity
TE Connectivity's CRGCQ0805F10R is a 10 ohm fixed resistor with 1% tolerance and 400 ppm/°C temperature coefficient. It is a surface mount thick film resistor in an 0805 package, suitable for applications requiring precise resistance values in compact electronic circuits.
M39029/58360
Esterline Technologies
CONNECTOR ACCESSORY; Terminal Type: CRIMP; Removal Tools: M81969/14-01; Associated Military - Specifications: MIL-DTL-38999; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT;
LL4148
BSS84-7-F
SPC TECHNOLOGY/ MULTICOMP
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
SMBJ18CA
Transpro Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Breakdown Voltage: 21.1 V; Maximum Clamping Voltage: 29.2 V;
KAF-09001-ABA-DD-BA
The Onsemi KAF-09001-ABA-DD-BA image sensor features 3024x3024 pixels with a pixel size of 12x12 um. It operates b/w -50 to 60 °C and offers a dynamic range of 84 dB. Ideal for applications requiring high-resolution imaging in industrial and scientific fields.
KAI-02150-ABA-FD-BA
Onsemi's KAI-02150-ABA-FD-BA is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 64dB dynamic range. It operates b/w -50 to 70 °C, suitable for industrial imaging applications requiring high-resolution and low-light performance.
AR0237ATSC00SUEA0-DR
Onsemi's AR0237ATSC00SUEA0-DR is a 3x3 um CMOS image sensor with 1928H x 1088V pixels, offering a dynamic range of 96 dB. Operating at -30 to 105 °C, it has a max supply voltage of 1.95 V and outputs digital voltage from 0.40-1.50V. Ideal for applications requiring high-resolution imaging at up to 60 fps in a compact square package shape for surface mounting.
KAF-3200-AAA-CB-B1
Image Sensors;
MT9M001C12STM-TR
The Onsemi MT9M001C12STM-TR is a CMOS image sensor with 5.2x5.2 um pixel size, 1280x1024 resolution, and 48 MHz master clock. It is used in applications requiring digital voltage output, such as frame arrays for imaging systems.
NOIP1SN5000A-LTI
NOIP1SN5000A-LTI by Onsemi is an image sensor with 4.8x4.8 um pixel size, 360 MHz master clock, and 2592 horizontal pixels. It operates b/w -40 to 85 °C and has a dynamic range of 60 dB. Ideal for applications requiring high-resolution imaging at a fast frame rate of 100 fps.
KAF-31600-CXA-DD-AA
The Onsemi KAF-31600-CXA-DD-AA is a CCD image sensor with 6.8X6.8 um pixel size, offering a max supply voltage of 15.5 V and a master clock of 24 MHz. With a full-frame array type, it is ideal for high-resolution imaging applications requiring a dynamic range of 70.5 dB and spectral response from 400-700 nm.
MT9M413C36STM
The Onsemi MT9M413C36STM is a 12x12 um CMOS image sensor with 1280H x 1024V pixels. Operating at 66 MHz, it has a max supply voltage of 3.6 V and frame rate of 500 fps. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.
AR0234CSSM28SUKA0-CP1
The Onsemi AR0234CSSM28SUKA0-CP1 is a CMOS image sensor with 1920x1200 resolution, 3x3 um pixel size, and 71.4 dB dynamic range. It operates at -40 to 85 °C and has a frame rate of 120 fps. Ideal for applications requiring high-quality digital imaging in automotive, surveillance, and industrial systems.
NOIL1SM4000A-GDC
NOIL1SM4000A-GDC by Onsemi is an image sensor with 2048x2048 pixels, 12x12 um pixel size, and 33 MHz master clock. It operates b/w 0-60 °C and has a dynamic range of 90 dB. Ideal for digital output applications requiring high-resolution imaging in a compact form factor.
AMIS-710205-A4
Image Sensors; Horizontal Pixel: 1728; Minimum Operating Temperature: 0 Cel; Maximum Operating Temperature: 50 Cel; Power Supplies (V): 5; Vertical Pixel: 1;
AR0239ATSC00XUEA0-DPBR
IMAGE SENSOR,CMOS; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);
MT9V111D00STC
The Onsemi MT9V111D00STC image sensor features a pixel size of 5.60x5.60 um, operates at a max supply voltage of 3.05 V, and has a master clock of 27 MHz. This CMOS sensor is commonly used in applications requiring digital voltage output interfaces, with an optical format of 1/4 inch and a frame rate of 15 fps.
KAE-02152-QBB-SD-FA
KAE-02152-QBB-SD-FA by Onsemi is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 86dB dynamic range. It operates b/w -40 °C to +40°C and is ideal for applications requiring current output in imaging systems.
AR0220AT4R00XUEA2-DRBR
Onsemi's AR0220AT4R00XUEA2-DRBR is a 1/1.8 inch CMOS image sensor with 1828x948 resolution, offering digital output via a 2-wire interface at 60 fps. Ideal for surface mount applications in frame arrays, this sensor measures 9" x 12mm x 1.7mm and features Tin/Silver/Copper terminal finish for solder connections.
KAI-04050-ABA-JP-BA
Onsemi's KAI-04050-ABA-JP-BA is a 5.5x5.5um CCD image sensor with 2336H x 1752V pixels, offering a dynamic range of 64dB. Operating b/w -50 °C to 70°C and powered by a 15V supply, it is ideal for applications requiring high-quality imaging in various environments.
MT9T031C12STC
Onsemi's MT9T031C12STC is a 3.20x3.20 um CMOS image sensor with 2048H x 1536V pixels, operating at 48 MHz clock speed and offering a dynamic range of 61 dB. It has a digital voltage output interface, operates b/w 0-60°C, and is commonly used in frame array applications for capturing images with high resolution and clarity.
KAI-08050-ABA-JD-AE
The Onsemi KAI-08050-ABA-JD-AE is a 5.5x5.5 um CCD image sensor with 3296 (H) x 2472 (V) pixels, offering a dynamic range of 64 dB. It operates b/w -50 °C to 70°C and has an optical format of 4/3 inch. Ideal for applications requiring high-quality imaging in industrial and scientific fields at a frame rate of 16 fps.
MT9V022IA7ATC
MT9V022IA7ATC by Onsemi is an image sensor with 6x6 um pixel size, 26.6 MHz master clock, and 752 horizontal pixels. Ideal for applications requiring a digital current output interface, such as frame arrays in cameras or surveillance systems.
VG6640CB1M
STMicroelectronics
STMicroelectronics VG6640CB1M is a 3.75X3.75 um CMOS image sensor with 132 dB dynamic range and 60 fps frame rate. It operates b/w -40 to 125 °C, suitable for surface mount applications in devices requiring high-quality imaging capabilities.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
NOIV1SN025KA-GDC
NOIV1SN025KA-GDC by Onsemi is a CMOS image sensor with 4.50x4.50 um pixel size, 310 MHz master clock, and 56.2 dB dynamic range. It is used in applications requiring high-resolution imaging at 53 fps, such as surveillance cameras and industrial machine vision systems.
NOIV1SE1300A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Power Supplies (V): 3.3; Minimum Supply Voltage: 1.6 V; Maximum Operating Current: 75 mA;
NOIV1SN1300A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Maximum Operating Temperature: 85 Cel; Maximum Operating Current: 75 mA; Dynamic Range: 53 dB;
NOIV2SN1300A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Body Height: 2.2 mm; Array Type: FRAME; Body Length/Diameter: 14.22 mm;
NOIV1SN2000A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Minimum Supply Voltage: 1.6 V; Housing: CERAMIC; Optical Format (inch): 2/3;
NOIV1SN025KA-GWC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 85 Cel; Spectral Response (nm): 400-1000; Body Length/Diameter: 43.1 mm;
NOIV1SE2000A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Array Type: FRAME; Maximum Operating Temperature: 70 Cel; Output Interface Type: 4-WIRE INTERFACE;
NOIV1SN1300A-XXC
IMAGE SENSOR,CMOS; Package Shape or Style: SQUARE; Horizontal Pixel: 1280; Dynamic Range: 53 dB; Additional Features: GLOBAL SHUTTER, ROLLING SHUTTER; Body Length/Diameter: 10.617 mm;
NOIV1SE5000A-QDC
NOIV1SE5000A-QDC by Onsemi is an image sensor with 4.80x4.80 um pixel size, 62 MHz master clock, and 2592 horizontal pixels. Ideal for applications requiring high-resolution imaging at a max supply voltage of 2V and operating temperature up to 70°C.
NOIV1SE012KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Vertical Pixel: 3072;
NOIV1SE025KA-GDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Spectral Response (nm): 400-1000; Minimum Operating Temperature: -40 Cel; Array Type: FRAME;
NOIV1SN025KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: FRAME; Maximum Operating Temperature: 85 Cel; Housing: CERAMIC;
NOIV1SN012KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Master Clock: 340 MHz; Maximum Supply Voltage: 2 V;
NOIV1SE016KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Output Interface Type: 4-WIRE INTERFACE; Vertical Pixel: 4096;
NOIV1SE025KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 85 Cel; Array Type: FRAME; Maximum Supply Voltage: 2 V;
NOIV1SN016KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Spectral Response (nm): 400-1000;
NOIV1SE012KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Master Clock: 340 MHz;
NOIV1SE016KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 915 mA; Body Length/Diameter: 43.1 mm;
NOIV1SE025KA-GWC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 2 V; Maximum Operating Temperature: 85 Cel; Maximum Operating Current: 775 mA;
Supply Digital Components
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