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AR0143ATSC00XUEA0-DRBR

Onsemi

AR0143ATSC00XUEA0-DRBR by Onsemi

Onsemi's AR0143ATSC00XUEA0-DRBR is a 9mm x 1.55mm CMOS image sensor with 1344x968 resolution, suitable for frame array applications. It features a 1/4" optical format, Tin/Silver/Copper terminal finish, and operates at 30 fps with a 2-wire interface for surface mount installation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,192 parts In-Stock

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Digiode

USA . 2,160 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 393 parts In-Stock

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$0.340

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$0.326

393

$0.340

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$0.326

Northwest PG Solutions

USA . 290 parts In-Stock

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$0.374

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$0.330

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$0.330

AZTECH Wire

Italy . 198 parts In-Stock

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$21.100

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Authorized Procurement Solutions

USA . 10,500 parts In-Stock

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Problanco Electronics

Mexico . 3,966 parts In-Stock

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Kulean Microsystems

USA . 3,527 parts In-Stock

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Corphita

USA . 1,298 parts In-Stock

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TANS Electronics

Latvia . 955 parts In-Stock

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Corohmni

South Africa . 388 parts In-Stock

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SupplyDigital Components

Austria . 117 parts In-Stock

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UHIMA Technologies

Türkiye . 39 parts In-Stock

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Overview

Capture every moment with crystal-clear precision using the AR0143ATSC00XUEA0-DRBR image sensor by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and performance in all their products. This image sensor is perfect for a wide range of applications, from security cameras to automotive systems, ensuring sharp and detailed images every time. Experience unparalleled value and reliability with the AR0143ATSC00XUEA0-DRBR, making it the perfect choice for all your imaging needs.

Feature Benefit Bullets

Body Width: 9 inch

The large body width ensures stable mounting and helps in accommodating the high number of horizontal pixels, resulting in high-quality image capture.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors provide high sensitivity and low noise operation, making them ideal for capturing clear and detailed images.

Body Height: 1.55 mm

The slim body height allows for compact integration into various devices without adding bulk, making it versatile for different applications.

Package Shape or Style: SQUARE

The square package shape offers efficient use of space and easy alignment during mounting, contributing to overall product reliability.

Horizontal Pixel: 1344

The high number of horizontal pixels results in sharp and detailed image resolution, making it suitable for applications where image quality is crucial.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of these terminal finishes enhances the product's reliability and conductivity, ensuring consistent performance over time.

Vertical Pixel: 968

The vertical pixel count complements the horizontal pixels, providing a balanced aspect ratio for capturing images with accurate proportions.

Body Length/Diameter: 9 mm

The compact body length allows for space-efficient design integration, making it suitable for small-sized devices or systems.

Optical Format (inch): 1/4

The 1/4-inch optical format is commonly used in cameras and provides a good balance between sensor size and image quality, making it a reliable choice for various imaging applications.

Termination Type: SOLDER

The solder termination offers secure and reliable connection points, ensuring stable performance and ease of assembly during product integration.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the connectivity setup and allows for easy data transfer, making it user-friendly and compatible with different systems.

Frame Rate: 30 fps

The high frame rate of 30 frames per second enables smooth video capture and playback, ideal for applications requiring real-time imaging or video recording.

Array Type: FRAME

The frame array type ensures efficient image sensor organization, enabling seamless image capture and processing for high-quality output.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy and secure installation on PCBs or other surfaces, enhancing product durability and reliability.

Technical Specifications

Image Sensors AR0143ATSC00XUEA0-DRBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

AEC-Q100, ROLLING SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.55 mm

Body Length/Diameter:

9 mm

Frame Rate:

30 fps

Horizontal Pixel:

1344

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

968

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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