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AR0238CSSC12SHRA0-DP

Onsemi

AR0238CSSC12SHRA0-DP by Onsemi

Onsemi's AR0238CSSC12SHRA0-DP image sensor features 3x3 um pixel size, 48 MHz master clock, and 1/2.7 inch optical format. Ideal for applications requiring high-resolution imaging with a frame rate of 60 fps in a compact square package suitable for surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,490 parts In-Stock

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Digiode

USA . 2,354 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 890 parts In-Stock

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$7.830

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890

$7.830

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Northwest PG Solutions

USA . 943 parts In-Stock

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$8.613

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$7.752

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943

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Kulean Microsystems

USA . 7,376 parts In-Stock

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SupplyDigital Components

Austria . 6,941 parts In-Stock

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Problanco Electronics

Mexico . 5,805 parts In-Stock

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TANS Electronics

Latvia . 3,588 parts In-Stock

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Corphita

USA . 364 parts In-Stock

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UHIMA Technologies

Türkiye . 217 parts In-Stock

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Corohmni

South Africa . 167 parts In-Stock

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Overview

Experience exceptional image quality and superior performance with the AR0238CSSC12SHRA0-DP Image Sensor by Onsemi. As a leading manufacturer in the industry, Onsemi ensures reliability and innovation in every product. Ideal for a wide range of applications, this sensor offers unmatched value and benefits to customers seeking top-notch imaging solutions. Upgrade your projects with the AR0238CSSC12SHRA0-DP and discover the difference quality makes.

Feature Benefit Bullets

Pixel Size (um): 3X3

Smaller pixel size allows for higher resolution and better image quality.

Maximum Supply Voltage: 1.95 V

Higher maximum supply voltage allows for better performance and flexibility in usage.

Master Clock: 48 MHz

Higher master clock allows for faster data processing and overall better performance.

Body Width: 11.3 inch

Compact body width makes it suitable for various applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS image sensors are known for their low power consumption and high-quality image output.

Body Height: 1.62 mm

Low body height allows for easy integration into slim devices and applications.

Package Shape or Style: SQUARE

Square package shape is commonly used and provides ease of mounting and integration.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage ensures efficient power usage and extends battery life.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for usage in various environmental conditions.

Horizontal Pixel: 1928

High horizontal pixel count enables detailed and high-resolution imaging.

Output Range: -22-22mA

Wide output range allows for output customization and flexibility in signal processing.

Output Type: DIGITAL CURRENT

Digital current output ensures accurate and reliable data transmission.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows for usage in cold environments.

Maximum Operating Current: 130 mA

High maximum operating current allows for power-hungry applications and ensures stable performance.

Housing: PLASTIC

Plastic housing is lightweight, durable, and cost-effective.

Dynamic Range: 96 dB

High dynamic range enables capture of both bright and dark areas in a scene with detail.

Vertical Pixel: 1088

High vertical pixel count contributes to overall image sharpness and clarity.

Body Length/Diameter: 11.3 mm

Compact body length/diameter allows for easy integration and mounting.

Optical Format (inch): 1/2.7

Common optical format size provides compatibility with various lenses and optical systems.

Termination Type: SOLDER

Solder termination ensures secure and reliable electrical connections.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies communication and integration with other systems.

Frame Rate: 60 fps

High frame rate enables smooth and real-time image capture.

Array Type: FRAME

Frame array type allows for efficient image capture and processing.

Mounting Feature: SURFACE MOUNT

Surface mounting feature provides easy and secure installation on PCBs.

Technical Specifications

Image Sensors AR0238CSSC12SHRA0-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER; IT ALSO OPERATES AT 2.8V NOMINAL ANALOG SUPPLY VOLTAGE

Array Type:

FRAME

Body Width:

11.3 inch

Body Height:

1.62 mm

Body Length/Diameter:

11.3 mm

Dynamic Range:

96 dB

Frame Rate:

60 fps

Horizontal Pixel:

1928

Housing:

PLASTIC

Master Clock:

48 MHz

Mounting Feature:

Maximum Operating Current:

130 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/2.7

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3X3

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

1088

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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