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AR0521SR2M09SURA0-DP

Onsemi

AR0521SR2M09SURA0-DP by Onsemi

Onsemi's AR0521SR2M09SURA0-DP is a 12x1.62mm CMOS image sensor with 2592x1944 resolution, 1/2.5" optical format, and 60fps frame rate. Ideal for surface mount applications requiring high-quality image capture in devices like cameras and security systems.

Median Price

$59.870

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

AR0521SR2M09SURA0-DP by Onsemi
Compare Share

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 385 parts In-Stock

1+ parts

$19.740

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385

$19.740

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Chip1Stop

Japan . 3,400 parts In-Stock

1+ parts

$100.000

100+ parts

$47.100

1k+ parts

$31.300

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-

3,400

$100.000

$47.100

$31.300

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$17.460

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10

$17.460

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Digiode

USA . 1,299 parts In-Stock

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$18.753

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1,299

$18.753

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Chip Stock

USA . 3,190 parts In-Stock

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3,190

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NAC Semi

USA . 2,806 parts In-Stock

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$29.110

2,806

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$29.110

Flip Electronics

USA . 1,680 parts In-Stock

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1,680

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Vyrian

USA . 1,479 parts In-Stock

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1,479

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VNN

France . 667 parts In-Stock

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667

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Distributors (Availability)

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Corohmni

South Africa . 67 parts In-Stock

1+ parts

$16.769

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67

$16.769

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$17.111

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$16.426

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50

$17.111

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$16.426

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Corphita

USA . 2,445 parts In-Stock

1+ parts

$17.766

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2,445

$17.766

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Ampacity Inc.

Singapore . 1,638 parts In-Stock

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$35.040

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$35.040

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Perfect Parts

USA . 29,493 parts In-Stock

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29,493

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SupplyDigital Components

Austria . 5,393 parts In-Stock

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5,393

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Problanco Electronics

Mexico . 4,570 parts In-Stock

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4,570

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GreenTree Electronics

Israel . 3,505 parts In-Stock

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3,505

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Futuretech Components

Singapore . 3,345 parts In-Stock

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3,345

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Kulean Microsystems

USA . 2,634 parts In-Stock

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2,634

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Lixinc

USA . 2,316 parts In-Stock

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2,316

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Infinite Electronics LLP (Excess)

. 1,651 parts In-Stock

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1,651

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Formix International (Excess)

India . 1,642 parts In-Stock

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1,642

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TANS Electronics

Latvia . 341 parts In-Stock

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341

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UHIMA Technologies

Türkiye . 165 parts In-Stock

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165

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Overview

Experience unparalleled image quality with the AR0521SR2M09SURA0-DP Image Sensor by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers cutting-edge technology and innovation in every product they create. This sensor's applications range from surveillance systems to automotive cameras, providing crystal-clear images and high-performance results. Elevate your projects with the value and benefits this sensor offers, making it the ideal choice for all your imaging needs. Upgrade to Onsemi and see the difference for yourself.

Feature Benefit Bullets

Body Width: 12 inch

The wide body width allows for a larger surface area for capturing high quality images, making it suitable for detailed and high resolution applications.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

The CMOS image sensor type provides high sensitivity and low noise levels, resulting in clear and sharp images even in low light conditions.

Body Height: 1.62 mm

The low body height allows for a slim design, making it suitable for compact electronic devices where space is limited.

Package Shape or Style: SQUARE

The square package shape provides a symmetrical and easy to mount design, ensuring compatibility with various devices and applications.

Horizontal Pixel: 2592

With a high horizontal pixel count, this image sensor can capture detailed and sharp images with high resolution, making it ideal for professional photography and imaging applications.

Vertical Pixel: 1944

The high vertical pixel count complements the horizontal pixel count, ensuring balanced and high-quality image output with excellent clarity and detail.

Body Length/Diameter: 12 mm

The compact body length/diameter allows for easy integration into various devices and systems without requiring significant space, making it a versatile choice for different applications.

Optical Format (inch): 1/2.5

The 1/2.5 inch optical format provides a good balance between sensor size and image quality, enabling efficient light capture while maintaining a compact form factor.

Termination Type: SOLDER

The solder termination type ensures secure and reliable electrical connections, enhancing the durability and longevity of the image sensor in different operating conditions.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface offers a simple and efficient way to communicate with the image sensor, facilitating seamless integration and control in various electronic systems.

Frame Rate: 60 fps

The high frame rate of 60 fps enables smooth and fluid video recording, making this image sensor suitable for applications requiring real-time imaging and motion capture.

Array Type: FRAME

The frame array type allows for simultaneous capture of multiple image frames, enabling advanced imaging techniques such as HDR and multi-focus imaging for superior image quality.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies the installation process and ensures secure attachment to the PCB or device, making it suitable for automated manufacturing processes and compact designs.

Technical Specifications

Image Sensors AR0521SR2M09SURA0-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Body Width:

12 inch

Body Height:

1.62 mm

Body Length/Diameter:

12 mm

Frame Rate:

60 fps

Horizontal Pixel:

2592

Mounting Feature:

Optical Format (inch):

1/2.5

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

1944

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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