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AR0522SRSM09SURA0-DR

Onsemi

AR0522SRSM09SURA0-DR by Onsemi

Onsemi's AR0522SRSM09SURA0-DR is a 12x1.62mm CMOS image sensor with 2592x1944 resolution, offering digital output via a 2-wire interface at 60fps. Ideal for surface mount applications in devices requiring high-quality imaging capabilities.

Median Price

$28.650

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 985 parts In-Stock

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$28.650

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$22.863

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985

$28.650

$22.863

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Chip1Stop

Japan . 3,196 parts In-Stock

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$106.000

100+ parts

$49.800

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$33.100

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3,196

$106.000

$49.800

$33.100

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Verical

USA . 1,680 parts In-Stock

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$19.249

1,680

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$19.249

Distributors (In-Stock)

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Digiode

USA . 837 parts In-Stock

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$18.848

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837

$18.848

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Vyrian

USA . 1,999 parts In-Stock

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$19.840

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$19.840

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Chip Stock

USA . 4,226 parts In-Stock

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Flip Electronics

USA . 3,360 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 999 parts In-Stock

1+ parts

$0.354

100+ parts

-

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$0.339

999

$0.354

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$0.339

Northwest PG Solutions

USA . 44 parts In-Stock

1+ parts

$0.389

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$0.343

44

$0.389

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$0.343

Corphita

USA . 907 parts In-Stock

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$17.856

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907

$17.856

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Corohmni

South Africa . 66 parts In-Stock

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$19.840

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66

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Perfect Parts

USA . 25,860 parts In-Stock

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Kulean Microsystems

USA . 7,826 parts In-Stock

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TANS Electronics

Latvia . 5,076 parts In-Stock

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GreenTree Electronics

Israel . 3,296 parts In-Stock

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Authorized Procurement Solutions

USA . 3,201 parts In-Stock

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Problanco Electronics

Mexico . 1,623 parts In-Stock

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1,623

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UHIMA Technologies

Türkiye . 591 parts In-Stock

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591

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SupplyDigital Components

Austria . 74 parts In-Stock

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Overview

Capture the world in stunning detail with the AR0522SRSM09SURA0-DR image sensor by Onsemi. As a leading manufacturer of high-quality imaging solutions, Onsemi delivers top-notch performance and reliability. Ideal for a wide range of applications, this CMOS image sensor offers unmatched clarity and precision. From surveillance systems to automotive cameras, the AR0522SRSM09SURA0-DR provides exceptional value, ensuring you capture every moment with unparalleled quality and ease. Elevate your imaging experience with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Body Width: 12 inch

This wide body allows for more space for the image sensor and ensures better image quality and resolution.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption and high-quality image capturing capabilities, making them a great choice for various applications.

Body Height: 1.62 mm

The low body height of this image sensor allows for compact designs in devices without compromising on image quality.

Package Shape or Style: SQUARE

The square package shape provides uniformity and ease of integration into various devices and systems.

Horizontal Pixel: 2592

With a high horizontal pixel count, this image sensor can capture detailed and sharp images with high resolution.

Output Type: DIGITAL OUTPUT

Digital output allows for easy processing and transmission of image data, making it convenient for interfacing with other digital devices.

Housing: PLASTIC

Plastic housing makes the image sensor lightweight and durable, ideal for portable and long-lasting applications.

Vertical Pixel: 1944

The high vertical pixel count contributes to the overall image quality and sharpness of the captured images.

Optical Format (inch): 1/2.5

This optical format allows for compatibility with a wide range of lenses, providing flexibility in capturing different types of images.

Termination Type: SOLDER

Solder termination ensures a secure and reliable connection for the image sensor, preventing any potential connection issues.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the connection process and allows for easy communication between the image sensor and external devices.

Frame Rate: 60 fps

A high frame rate of 60 fps enables smooth and high-quality video capturing, making this image sensor suitable for fast-moving subjects.

Array Type: FRAME

The frame array type ensures efficient image capturing and processing, providing consistent and accurate results.

Mounting Feature: SURFACE MOUNT

Surface mount capability allows for easy and secure installation of the image sensor onto circuit boards or other surfaces.

Technical Specifications

Image Sensors AR0522SRSM09SURA0-DR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ROLLING SHUTTER

Array Type:

FRAME

Body Width:

12 inch

Body Height:

1.62 mm

Body Length/Diameter:

12 mm

Frame Rate:

60 fps

Horizontal Pixel:

2592

Housing:

PLASTIC

Mounting Feature:

Optical Format (inch):

1/2.5

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

1944

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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