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AR0521SR2M09SURA0-DR

Onsemi

AR0521SR2M09SURA0-DR by Onsemi

Onsemi's AR0521SR2M09SURA0-DR is a 12x12x1.62mm CMOS image sensor with 2592x1944 resolution, 1/2.5" optical format, and 60fps frame rate. Ideal for surface mount applications requiring high-quality imaging in a compact square package with a 2-wire interface.

Median Price

$19.350

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

AR0521SR2M09SURA0-DR by Onsemi
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,646 parts In-Stock

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$19.350

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$19.350

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Flip Electronics (Authorized)

USA . 2,025 parts In-Stock

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2,025

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Verical

USA . 20 parts In-Stock

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$23.988

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$21.700

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20

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$23.988

$21.700

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Rochester

USA . 11 parts In-Stock

1+ parts

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100+ parts

$18.370

1k+ parts

$16.440

10k+ parts

$15.470

11

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$18.370

$16.440

$15.470

Distributors (In-Stock)

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Digiode

USA . 2,403 parts In-Stock

1+ parts

$15.086

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2,403

$15.086

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Vyrian

USA . 1,884 parts In-Stock

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$15.880

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1,884

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Flip Electronics

USA . 2,003 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 609 parts In-Stock

1+ parts

$12.620

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609

$12.620

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Northwest PG Solutions

USA . 1,391 parts In-Stock

1+ parts

$13.882

100+ parts

$12.494

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1,391

$13.882

$12.494

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Corphita

USA . 153 parts In-Stock

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$14.292

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$14.292

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Corohmni

South Africa . 429 parts In-Stock

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$15.880

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429

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TANS Electronics

Latvia . 5,623 parts In-Stock

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Kulean Microsystems

USA . 4,391 parts In-Stock

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Perfect Parts

USA . 3,718 parts In-Stock

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SupplyDigital Components

Austria . 3,150 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Problanco Electronics

Mexico . 2,055 parts In-Stock

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2,055

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UHIMA Technologies

Türkiye . 502 parts In-Stock

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Futuretech Components

Singapore . 500 parts In-Stock

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Overview

Capture the essence of every moment with the AR0521SR2M09SURA0-DR Image Sensor by Onsemi. Crafted with precision and quality, this innovative sensor offers unparalleled performance in imaging technology. Whether you're a photography enthusiast, a professional videographer, or an automotive industry expert, this sensor delivers exceptional clarity and detail in every shot. Elevate your projects to new heights with the AR0521SR2M09SURA0-DR and experience the difference in image quality and reliability that only Onsemi can provide.

Feature Benefit Bullets

Body Width: 12 inch

The wide body width allows for efficient heat dissipation, preventing the sensor from overheating during continuous use.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption and high-quality image capture, making them a popular choice for various applications.

Body Height: 1.62 mm

The slim body height enables compact integration into devices without adding bulk, ideal for space-constrained designs.

Package Shape or Style: SQUARE

The square package shape allows for easy and secure mounting on circuit boards, ensuring stability during operation.

Horizontal Pixel: 2592

High horizontal pixel count ensures detailed and sharp images, perfect for applications where image clarity is crucial.

Vertical Pixel: 1944

The vertical pixel count complements the horizontal pixels, providing a balanced resolution for high-quality image output.

Body Length/Diameter: 12 mm

The compact body length or diameter enables versatile placement within devices, allowing for flexible design options.

Optical Format (inch): 1/2.5

The optical format of 1/2.5 inch offers a good balance between sensor size and image quality, suitable for a wide range of applications.

Termination Type: SOLDER

Solder termination ensures a secure and reliable connection between the sensor and circuit board, reducing the risk of signal interference.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies connectivity and communication with other devices, facilitating seamless integration within existing systems.

Frame Rate: 60 fps

A high frame rate of 60 fps allows for smooth and fluid video recording or streaming, capturing fast-moving subjects with precision.

Array Type: FRAME

The frame array type ensures efficient image capture and processing, providing consistent and reliable performance in various operating conditions.

Mounting Feature: SURFACE MOUNT

Surface mount capability allows for easy and secure installation of the sensor on PCBs, simplifying the manufacturing process and ensuring durability.

Technical Specifications

Image Sensors AR0521SR2M09SURA0-DR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Body Width:

12 inch

Body Height:

1.62 mm

Body Length/Diameter:

12 mm

Frame Rate:

60 fps

Horizontal Pixel:

2592

Mounting Feature:

Optical Format (inch):

1/2.5

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

1944

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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