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AMIS-70700

Onsemi

AMIS-70700 by Onsemi

AMIS-70700 by Onsemi is a CMOS image sensor with 10.6x10.6 um pixel size, offering 60 dB dynamic range and 750x400 resolution. Operating at -40 to 105 °C, it has a digital voltage output type and supports up to 20 Mbps data rate. Ideal for full-frame applications in imaging systems requiring high-quality visuals.

Median Price

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Lifecycle Status

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Digiode

USA . 1,994 parts In-Stock

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Vyrian

USA . 697 parts In-Stock

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Native Components

USA . 313 parts In-Stock

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TANS Electronics

Latvia . 3,037 parts In-Stock

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Problanco Electronics

Mexico . 2,582 parts In-Stock

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Northwest PG Solutions

USA . 2,241 parts In-Stock

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Corphita

USA . 2,237 parts In-Stock

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SupplyDigital Components

Austria . 904 parts In-Stock

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Corohmni

South Africa . 437 parts In-Stock

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Kulean Microsystems

USA . 128 parts In-Stock

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UHIMA Technologies

Türkiye . 77 parts In-Stock

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Overview

Discover the next level of imaging technology with the AMIS-70700 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality image sensors that redefine clarity and precision. Ideal for a wide range of applications, this image sensor offers unparalleled value and benefits to customers looking for superior performance and reliability. Experience enhanced image quality, increased dynamic range, and seamless integration with the AMIS-70700. Elevate your imaging capabilities today with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Pixel Size (um): 10.6X10.6

Larger pixel size allows for better light sensitivity and improved image quality, making this image sensor ideal for capturing clear and detailed images.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage provides flexibility in power requirements and ensures reliable operation of the image sensor.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors offer low power consumption, high-quality images, and cost-effectiveness, making them a popular choice for various applications.

Package Shape or Style: SQUARE

The square package shape simplifies mounting and integration, making it easier to incorporate the image sensor into different systems.

Minimum Supply Voltage: 3 V

The lower minimum supply voltage ensures efficient power usage and compatibility with a wide range of power sources.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows the image sensor to withstand harsh environmental conditions and maintain performance in various applications.

Horizontal Pixel: 750

The high horizontal pixel count offers high-resolution images with detailed and sharp image quality, making this image sensor suitable for demanding imaging tasks.

Output Range: 0.40V

The consistent output range ensures accurate and reliable output signals for downstream processing and analysis of captured images.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies interfacing with external devices and systems, providing easy integration and compatibility with various platforms.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the image sensor to function in cold environments or extreme temperatures without compromising performance.

Maximum Operating Current: 0.01 mA

The low operating current ensures energy efficiency and long battery life, making this image sensor suitable for portable and battery-powered devices.

Dynamic Range: 60 dB

The wide dynamic range enables the image sensor to capture details in both bright and dark areas of the image, providing a balanced and natural-looking result.

Vertical Pixel: 400

The vertical pixel count contributes to the overall image resolution, ensuring clear and high-quality images for various imaging applications.

Optical Format (inch): 2/3

The 2/3 inch optical format provides compatibility with a wide range of lenses, allowing for flexibility in capturing different perspectives and scenes.

Data Rate: 20 Mbps

The high data rate enables fast and efficient data transfer, facilitating real-time image processing and transmission of high-resolution images.

Termination Type: SOLDER

Solder termination ensures secure and reliable connections, preventing signal loss or interruptions during operation.

Frame Rate: 60 fps

The high frame rate allows for smooth and fluid motion capture, making this image sensor suitable for video recording and fast-moving imaging applications.

Array Type: FULL FRAME

Full-frame array type provides a larger sensor area for capturing more light and details, resulting in high-quality and professional-looking images.

Mounting Feature: SURFACE MOUNT

Surface mounting feature offers easy and secure installation on PCBs or other surfaces, ensuring stable and reliable operation of the image sensor.

Technical Specifications

Image Sensors AMIS-70700 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER

Array Type:

FULL FRAME

Data Rate:

20 Mbps

Dynamic Range:

60 dB

Frame Rate:

60 fps

Horizontal Pixel:

750

Mounting Feature:

Maximum Operating Current:

.01 mA

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

2/3

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

10.6X10.6

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Vertical Pixel:

400

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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