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AMIS70700AAA

Onsemi

AMIS70700AAA by Onsemi

AMIS70700AAA by Onsemi is an image sensor with 10.6x10.6um pixel size, 3.3V power supply, and 105 °C max operating temp. It has 750 horizontal and 400 vertical pixels, suitable for surface mount applications in various industries like automotive and surveillance systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,212 parts In-Stock

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2,212

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Digiode

USA . 1,820 parts In-Stock

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1,820

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 451 parts In-Stock

1+ parts

$38.017

100+ parts

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$36.496

451

$38.017

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$36.496

Northwest PG Solutions

USA . 66 parts In-Stock

1+ parts

$41.819

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66

$41.819

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TANS Electronics

Latvia . 8,283 parts In-Stock

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8,283

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Problanco Electronics

Mexico . 5,923 parts In-Stock

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5,923

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SupplyDigital Components

Austria . 3,343 parts In-Stock

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3,343

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Corphita

USA . 2,334 parts In-Stock

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2,334

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Kulean Microsystems

USA . 1,205 parts In-Stock

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1,205

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UHIMA Technologies

Türkiye . 636 parts In-Stock

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636

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Corohmni

South Africa . 242 parts In-Stock

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242

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Overview

Unleash the power of high-quality imaging with the AMIS70700AAA by Onsemi. This top-of-the-line image sensor offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. From surveillance systems to industrial automation, this sensor delivers crisp, clear images with precision and accuracy. Experience the value and benefits of Onsemi's cutting-edge technology, and take your projects to the next level with the AMIS70700AAA.

Feature Benefit Bullets

Pixel Size (um): 10.6X10.6

Larger pixel size allows more light to be captured, resulting in better image quality and improved low-light performance.

Power Supplies (V): 3.3

Low power supply requirement of 3.3V offers energy efficiency and reduces power consumption, making it suitable for portable devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance even in extreme conditions, making it suitable for various industrial applications.

Horizontal Pixel: 750

Higher horizontal pixel count provides increased image resolution and finer details, making it ideal for demanding imaging applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the sensor to function in cold environments without any issues, making it versatile for different climatic conditions.

Vertical Pixel: 400

Vertical pixel count contributes to the overall image quality and resolution, allowing for clear and sharp images to be captured.

Mounting Feature: SURFACE MOUNT

Surface mount design simplifies the installation process and makes the sensor suitable for compact and space-constrained applications.

Technical Specifications

Image Sensors AMIS70700AAA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Horizontal Pixel:

750

Mounting Feature:

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Pixel Size (um):

10.6X10.6

Power Supplies (V):

3.3

Sub-Category:

CCD Image Sensors

Vertical Pixel:

400

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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