Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Onsemi's KAI-02150-ABA-FD-BA is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 64dB dynamic range. It operates b/w -50 to 70 °C, suitable for industrial imaging applications requiring high-resolution and low-light performance.
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UHIMA Technologies
The small pixel size allows for high-resolution images to be captured with great detail, making this image sensor ideal for applications requiring high image quality.
The high maximum supply voltage provides flexibility in power supply options, allowing for efficient performance and operation in various voltage environments.
CCD sensors are known for their high-quality image capture and low noise levels, making them suitable for demanding imaging applications.
The rectangular package shape offers a compact design that can easily fit into different camera setups, making it a versatile choice for various applications.
With a low minimum supply voltage requirement, this image sensor can operate efficiently even in low-power situations, ensuring reliable performance under various conditions.
The high maximum operating temperature range allows this image sensor to function in harsh environments with elevated temperatures, making it suitable for a wide range of industrial applications.
The high number of horizontal pixels enables this image sensor to capture detailed and sharp images with high resolution, making it ideal for applications where image clarity is crucial.
With a low minimum operating temperature, this image sensor can withstand extremely cold conditions, ensuring reliable performance even in freezing environments.
The ceramic housing provides durability and protection for the internal components, making this image sensor suitable for rugged environments or long-term use.
The high dynamic range of 64 dB allows this image sensor to capture both bright and dark areas in a scene with great detail, producing images with excellent contrast and color accuracy.
The high number of vertical pixels contributes to the overall image quality by providing sharp and detailed images in the vertical direction, making this image sensor suitable for various imaging applications.
The 2/3-inch optical format offers compatibility with a wide range of lenses and optical systems, providing flexibility in designing camera setups for different applications.
The solder termination type ensures secure and reliable connections for the image sensor, enhancing its overall performance and longevity in use.
The interline array type enhances the speed and efficiency of image capture, making this image sensor suitable for applications requiring fast imaging processes.
The through-hole mounting feature offers easy and secure installation of the image sensor onto circuit boards or camera systems, ensuring a stable and reliable connection for optimal performance.
Image Sensors KAI-02150-ABA-FD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Dynamic Range:
Horizontal Pixel:
Housing:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
SS14
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FDN5618P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
SMBJ18CA
Weitron Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
MBR0520LT3G
Onsemi
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
2N2222A
Boca Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Pro-an Electronic
LM358AN
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
1552200253
Molex
WIRE AND CABLE;
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
MBRS340T3G
MBRS340T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 4A. It operates b/w -65°C to 150°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package. The diode's matte tin terminal finish and dual position make it ideal for surface mount PCB designs.
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
1N4148WT
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
INA826AIDGKR
Texas Instruments
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
1N4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MT9V011P11STC-B-DP
MT9V011P11STC-B-DP by Onsemi is a 640x480 CMOS image sensor with 5.60um pixel size, 27 MHz master clock, and 60dB dynamic range. Ideal for digital cameras, surveillance systems, and automotive applications due to its high resolution and low power consumption.
KAI-02170-FBA-JD-BA
KAI-02170-FBA-JD-BA by Onsemi is an image sensor with 1920x1080 resolution, 7.4um pixel size, and 70.2dB dynamic range. It operates b/w -50 to 70 °C and has a supply voltage range of 14.5V to 15.5V. Ideal for applications requiring high-quality imaging in various environmental conditions.
AR0330CM1C21SUD20
The Onsemi AR0330CM1C21SUD20 is a 2.2x2.2 um CMOS image sensor with 2304 horizontal pixels and 1536 vertical pixels. It operates at a max supply voltage of 1.9V, has a master clock of 24 MHz, and offers a dynamic range of 69.5 dB. Ideal for applications requiring high-resolution imaging at frame rates up to 60 fps in automotive cameras and surveillance systems.
KAI-08051-AXA-JD-AE
Onsemi's KAI-08051-AXA-JD-AE image sensor features 5.5um pixel size, 3296H x 2472V resolution, and 66dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor, such as industrial cameras or medical devices.
MT9P031I12STM-DP1
MT9P031I12STM-DP1 by Onsemi is a 2.2x2.2 um CMOS image sensor with 2592x1944 pixels, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring high-resolution imaging at frame rates up to 14 fps in a compact square package suitable for surface mounting.
AMIS-710252-A6
Image Sensors; Power Supplies (V): 5; Horizontal Pixel: 832; Minimum Operating Temperature: 0 Cel; Maximum Operating Temperature: 50 Cel;
NOIP1SN0500A-QTI
NOIP1SN0500A-QTI by Onsemi is an Image Sensor with 4.80X4.80 um pixel size, 72 MHz master clock, and 800x600 resolution. Ideal for digital imaging applications requiring high frame rates up to 545 fps in a compact SQUARE package suitable for SURFACE mounting.
KAI-08051-ABA-JP-BA
KAI-08051-ABA-JP-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 3364 horizontal pixels, and 2520 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
NOIP1SN5000A-LTI
NOIP1SN5000A-LTI by Onsemi is an image sensor with 4.8x4.8 um pixel size, 360 MHz master clock, and 2592 horizontal pixels. It operates b/w -40 to 85 °C and has a dynamic range of 60 dB. Ideal for applications requiring high-resolution imaging at a fast frame rate of 100 fps.
KAI-2020-ABA-CP-AE
KAI-2020-ABA-CP-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 68 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
AR1335CSSC11SMD20
Onsemi's AR1335CSSC11SMD20 is a 1/3.2-inch CMOS image sensor with 4208x3120 pixels, offering a pixel size of 1.1μm and a max supply voltage of 1.3V. With a master clock of 48MHz, it provides digital voltage output via a 2-wire interface, making it ideal for applications requiring high-resolution imaging at up to 30fps.
KAI-16070-AXA-JD-AE
Onsemi's KAI-16070-AXA-JD-AE image sensor features 7.4x7.4 um pixel size, 40 MHz master clock, and 4864 horizontal pixels. Ideal for applications requiring high-resolution imaging with a max supply voltage of 15.5 V and an optical format of 1.37 inch.
NOIP1FN1300A-QTI
NOIP1FN1300A-QTI by Onsemi is an image sensor with 4.80x4.80 um pixel size, 72 MHz master clock, and 1/2 inch optical format. It operates b/w -40 to 85 °C and has a dynamic range of 60 dB. Ideal for high-speed imaging applications requiring a digital voltage output interface at up to 210 fps frame rate.
KAI-04050-AAA-JP-AE
KAI-04050-AAA-JP-AE by Onsemi is a 5.5x5.5um CCD image sensor with 2336H x 1752V pixels, offering a dynamic range of 64dB. It features an interline array type and through-hole mounting, suitable for applications in high-resolution imaging systems requiring precise color reproduction and low-light performance.
NOIP1SN0300A-QTI
NOIP1SN0300A-QTI by Onsemi features 4.80x4.80 um pixel size, 72 MHz master clock, and 640x480 resolution. Ideal for digital imaging applications requiring high frame rates and a wide dynamic range.
AR0135CS2M25SUEA0-DPBR1
Onsemi's AR0135CS2M25SUEA0-DPBR1 is a 1/3 inch CMOS image sensor with 1280x960 pixels, offering a pixel size of 3.75um. It operates at a max supply voltage of 1.95V and features a master clock of 50MHz. Ideal for applications requiring high-resolution imaging with a digital output interface.
MT9M034I12STC-DPBR1
MT9M034I12STC-DPBR1 by Onsemi is an image sensor with 1280x960 resolution, 3.75um pixel size, and 115dB dynamic range. It operates at -30 to 70°C, with a supply voltage of 1.7-1.95V, making it ideal for high-quality digital imaging applications requiring precise color reproduction and low-light performance.
KAF-16803-ABA-DP-BA
KAF-16803-ABA-DP-BA by Onsemi is an image sensor with 9x9 um pixel size, 4096 horizontal and vertical pixels. It operates b/w -60 to 60 °C, has a dynamic range of 80 dB, and spectral response of 300-1100 nm. Ideal for high-resolution imaging applications due to its full-frame array design and ceramic housing.
MT9V126IA3XTC-TP
MT9V126IA3XTC-TP by Onsemi is a 1/4 inch CMOS image sensor with 5.60x5.60 um pixel size, offering 680x512 resolution and 30 fps frame rate. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high dynamic range of 74.6 dB and compact square package design.
KAF-1402ME
Image Sensors;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
KAI-02150-CBA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; Vertical Pixel: 1080; Pixel Size (um): 5.5X5.5;
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Optical Format (inch): 2/3; Pixel Size (um): 5.5X5.5; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON;
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 70 Cel; Minimum Operating Temperature: -50 Cel; Minimum Supply Voltage: 14.5 V;
KAI-02150-ABA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 64 dB; Maximum Operating Temperature: 70 Cel; Pixel Size (um): 5.5X5.5;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1080; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; Optical Format (inch): 2/3;
Onsemi's KAI-02150-ABA-JD-BA is a 2/3" CCD image sensor with 1920x1080 resolution, 5.5um pixel size, and 64dB dynamic range. It operates b/w -50 to 70°C, suitable for industrial cameras and machine vision applications.
KAI-04050-FBA-JB-B2
KAI-04050-FBA-JB-B2 by Onsemi is an image sensor with 5.5x5.5 um pixel size, 2336 horizontal pixels, and 1752 vertical pixels. It operates b/w -50 to 70°C, has a dynamic range of 64 dB, and requires a supply voltage of 14.5-15.5 V. This rectangular CCD sensor is ideal for applications requiring high-quality imaging in various environments.
KAI-02150-AAA-JP-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: INTERLINE; Vertical Pixel: 1080; Pixel Size (um): 5.5X5.5;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Minimum Operating Temperature: -50 Cel; Dynamic Range: 64 dB;
KAI-01150-CBA-FD-AE
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Dynamic Range: 64 dB; Array Type: INTERLINE;
KAI-01050-FBA-FD-AE
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Body Width: 18.29 inch; Housing: CERAMIC; Horizontal Pixel: 1024;
KAI-01150-CBA-JB-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 33.02 mm; Array Type: INTERLINE;
KAI-01150-ABA-JD-BA
KAI-01050-CBA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Pixel Size (um): 5.5X5.5; Maximum Operating Temperature: 70 Cel;
KAI-01150-CBA-FD-BA
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Horizontal Pixel: 1280; Body Length/Diameter: 18.29 mm;
KAI-01050-ABA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Array Type: INTERLINE;
KAI-01150-CBA-JB-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Optical Format (inch): 1/2;
KAI-01050-ABA-FD-BA
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Optical Format (inch): 1/2; Minimum Operating Temperature: -50 Cel;
KAI-01050-CBA-FD-AE
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Maximum Supply Voltage: 15.5 V; Minimum Operating Temperature: -50 Cel;
KAI-01050-FBA-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Additional Features: IT HAS SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; Maximum Supply Voltage: 15.5 V; Termination Type: SOLDER;
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