Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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KAI-0330-ABA-CB-BA-DUAL by Onsemi is an image sensor with 9x9 um pixel size, 648 horizontal pixels, and 484 vertical pixels. It operates at temperatures ranging from -50 to 70 °C and requires a power supply of 15V. Ideal for applications requiring high-resolution imaging in various environments.
Median Price
$179.420
Lifecycle Status
Suppliers In-Stock
4
In-Stock Inventory
1k+
Rochester
1+ parts
100+ parts
$168.650
1k+ parts
$157.890
10k+ parts
-
Digiode
$197.914
Chip Stock
Vyrian
Corphita
$187.497
Corohmni
$208.330
Problanco Electronics
SupplyDigital Components
TANS Electronics
Kulean Microsystems
UHIMA Technologies
The small pixel size of 9X9 micrometers allows for high resolution images to be captured with great detail, making this image sensor suitable for applications requiring precise imaging.
The high power supply of 15 volts provides efficient and reliable operation, ensuring that the image sensor can perform effectively in various conditions.
With a maximum operating temperature of 70 °C, this image sensor can withstand high heat environments, making it suitable for industrial or outdoor applications.
The high number of horizontal pixels (648) allows for detailed and high-resolution images to be captured, making this image sensor ideal for applications requiring precise imaging.
The low minimum operating temperature of -50 °C ensures that this image sensor can operate effectively even in extremely cold conditions, increasing its versatility and reliability.
The vertical pixel count of 484 contributes to the high-resolution capabilities of this image sensor, allowing for detailed images to be captured in both horizontal and vertical dimensions.
The through hole mount feature makes installation and integration of this image sensor easy and convenient, allowing for flexible placement in various devices or systems.
Image Sensors KAI-0330-ABA-CB-BA-DUAL attributes and parameters. Explore more Image Sensors devices from Onsemi
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Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
FDD5614P
Onsemi
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
SMBJ18CA
Changzhou Starsea Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
NE555D
Philips Semiconductors
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148
Microchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M24308/2-1F
Air Electro
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; MIL Conformity: YES; Additional Features: STANDARD: MIL-DTL-24308;
BAV99
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Itt Components
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;
LM358MX
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BSS138LT1G
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
LM358N
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Hitachi
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
NXP Semiconductors
Diotec Semiconductor Ag
LL4148-GS08
Vishay Intertechnology
The Vishay Intertechnology LL4148-GS08 is a glass diode with fast recovery time of 0.008 us and max reverse current of 5 uA. Ideal for applications requiring rectification, it has a breakdown voltage of 100 V and can handle a peak forward current of 2 A.
SS14
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
M39029/58-360
Molex
CONNECTOR ACCESSORY; Alternate Contact Sources: MILITARY; Removal Tool Sources: MILITARY; Material: COPPER ALLOY; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354;
KLI-2104-DAA-ED-AE
The Onsemi KLI-2104-DAA-ED-AE is a CCD image sensor with 14x7 um pixel size, offering a dynamic range of 80 dB. Housed in ceramic, it operates b/w -25 to 80 °C and features through-hole mounting. Ideal for applications requiring high-quality linear array imaging with precise solder terminations.
AR0234CSSC00SUKA0-CP
The Onsemi AR0234CSSC00SUKA0-CP image sensor features 1920x1200 resolution, 3x3 um pixel size, and a 54 MHz master clock. Ideal for applications requiring high-quality digital imaging with a frame rate of up to 120 fps.
AR0221SR2C00SUEA0-DPBR1
Onsemi's AR0221SR2C00SUEA0-DPBR1 is a 1928x1088 CMOS image sensor with 1/1.7" optical format, offering 60 fps frame rate. Ideal for surface mount applications, it features a 2-wire interface and solder termination type.
AR0132AT6R00XPEA0-DPBR1
Onsemi's AR0132AT6R00XPEA0-DPBR1 is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 115dB dynamic range. Ideal for applications requiring high-quality digital imaging at up to 60fps frame rate in a compact surface-mount package.
AR0132AT6B00XPW90
Onsemi AR0132AT6B00XPW90 Image Sensor features 3.75um Pixel Size, 50 MHz Master Clock, and 115 dB Dynamic Range. Ideal for applications requiring high-resolution imaging with a frame rate of 60 fps in automotive cameras, surveillance systems, and industrial machine vision.
KAI-2020-ABA-CR-BA
Onsemi's KAI-2020-ABA-CR-BA image sensor features 7.4x7.4 um pixel size, 1600H x 1200V resolution, and 60 dB dynamic range. Ideal for applications requiring high-quality imaging with a rectangular package style, through-hole mounting, and analog voltage output.
CMV2000-3E5C1PP
Ams Ag
CMV2000-3E5C1PP by Ams Ag is a 2/3-inch CMOS image sensor with 2048x1088 pixels, offering a high dynamic range of 90 dB. With a pixel size of 5.5um, it operates b/w -30°C to 70°C and features an SPI interface for fast data transfer. Ideal for applications requiring high-speed imaging such as machine vision and industrial inspection.
AR0135AT2M25XUEA0-TPBR
The Onsemi AR0135AT2M25XUEA0-TPBR is a 1/3 inch CMOS image sensor with 3.75x3.75 um pixel size and 54 fps frame rate. It is ideal for applications requiring high-quality imaging in a compact form factor, such as surveillance cameras and industrial machine vision systems.
OV09714-A49A
Omnivision Technologies
OV09714-A49A by Omnivision Technologies is an image sensor with 3x3 um pixel size, 1.5V power supply, and max operating temp of 85°C. With 1296H x 812V pixels, it's ideal for applications requiring high-resolution imaging in a wide temperature range from -30°C to 85°C.
KAE-02152-FBB-SD-EE
KAE-02152-FBB-SD-EE by Onsemi is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 86dB dynamic range. Ideal for applications requiring high-quality imaging in industrial cameras, surveillance systems, and medical devices.
MT9J003I12STCV2-DP
MT9J003I12STCV2-DP by Onsemi is an image sensor with 3856x2764 pixels, 1.67um pixel size, and a 48MHz master clock. It is commonly used in digital cameras for its high resolution and fast frame rate of 60fps.
KAC-00401-CBC-LB-A0
Onsemi's KAC-00401-CBC-LB-A0 Image Sensor features 6.7X6.7um pixel size, 3.3V power supply, and operates b/w -40 to 105 °C. With 768x488 pixels, it is ideal for surface mount applications in various imaging systems.
KAI-02050-FBA-FD-AE
The Onsemi KAI-02050-FBA-FD-AE is a 5.5x5.5 um CCD image sensor with 1600H x 1200V pixels, offering a dynamic range of 64 dB. It operates b/w -50 to 70 °C and has a square ceramic housing, making it suitable for high-resolution imaging applications in various industries.
2H4813
The Onsemi 2H4813 image sensor features 2048x2048 resolution, 7.4um pixel size, and -50 to 70 °C operating temperature range. Ideal for industrial cameras, machine vision systems, and surveillance applications due to its high resolution and wide temperature tolerance.
KAF-0261-AAA-CP-AE
The Onsemi KAF-0261-AAA-CP-AE is a CCD image sensor with 512x512 pixels, 20x20 um pixel size, and 87 dB dynamic range. It operates b/w -70 to 50 °C and has a spectral response of 400-1000 nm. Ideal for applications requiring high-quality imaging in industrial or scientific settings.
MT9V115EBKSTC-CR
IMAGE SENSOR,CMOS; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1;
KAE-02152-FBB-SP-EE
Onsemi's KAE-02152-FBB-SP-EE is a 5.5x5.5 um CCD image sensor with 1920x1080 pixels, offering a dynamic range of 86 dB. Ideal for applications requiring high-resolution imaging in industrial and scientific fields due to its rectangular package style and through-hole mounting feature.
KAF-3200-AAA-CB-B1
Image Sensors;
KAF-0402-AAA-CB-AE
The Onsemi KAF-0402-AAA-CB-AE is a CCD image sensor with 9x9 um pixel size, offering 768 horizontal and 512 vertical pixels. It operates at a supply voltage range of 14.75V to 15.5V, providing a dynamic range of 76 dB. This rectangular package sensor has a data rate of 10 Mbps and is suitable for full-frame imaging applications.
KAF-8300-AXC-CP-AA
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 23 MICRO V/ELECTRON; Maximum Operating Temperature: 70 Cel;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
KAI-02150-CBA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; Vertical Pixel: 1080; Pixel Size (um): 5.5X5.5;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Optical Format (inch): 2/3; Pixel Size (um): 5.5X5.5; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON;
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 70 Cel; Minimum Operating Temperature: -50 Cel; Minimum Supply Voltage: 14.5 V;
KAI-02150-ABA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 64 dB; Maximum Operating Temperature: 70 Cel; Pixel Size (um): 5.5X5.5;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1080; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; Optical Format (inch): 2/3;
Onsemi's KAI-02150-ABA-JD-BA is a 2/3" CCD image sensor with 1920x1080 resolution, 5.5um pixel size, and 64dB dynamic range. It operates b/w -50 to 70°C, suitable for industrial cameras and machine vision applications.
KAI-04050-FBA-JB-B2
KAI-04050-FBA-JB-B2 by Onsemi is an image sensor with 5.5x5.5 um pixel size, 2336 horizontal pixels, and 1752 vertical pixels. It operates b/w -50 to 70°C, has a dynamic range of 64 dB, and requires a supply voltage of 14.5-15.5 V. This rectangular CCD sensor is ideal for applications requiring high-quality imaging in various environments.
KAI-02150-AAA-JP-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: INTERLINE; Vertical Pixel: 1080; Pixel Size (um): 5.5X5.5;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Minimum Operating Temperature: -50 Cel; Dynamic Range: 64 dB;
KAI-01150-CBA-FD-AE
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Dynamic Range: 64 dB; Array Type: INTERLINE;
KAI-01050-FBA-FD-AE
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Body Width: 18.29 inch; Housing: CERAMIC; Horizontal Pixel: 1024;
KAI-01150-CBA-JB-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 33.02 mm; Array Type: INTERLINE;
KAI-01150-ABA-JD-BA
KAI-01050-CBA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Pixel Size (um): 5.5X5.5; Maximum Operating Temperature: 70 Cel;
KAI-01150-CBA-FD-BA
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Horizontal Pixel: 1280; Body Length/Diameter: 18.29 mm;
KAI-01050-ABA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Array Type: INTERLINE;
KAI-01150-CBA-JB-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Optical Format (inch): 1/2;
KAI-01050-ABA-FD-BA
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Optical Format (inch): 1/2; Minimum Operating Temperature: -50 Cel;
KAI-01050-CBA-FD-AE
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Maximum Supply Voltage: 15.5 V; Minimum Operating Temperature: -50 Cel;
KAI-01050-FBA-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Additional Features: IT HAS SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; Maximum Supply Voltage: 15.5 V; Termination Type: SOLDER;
Supply Digital Components
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Quantity
12,000 In-Stock
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