Loading...

KAI-0330-ABA-CB-BA-DUAL

Onsemi

KAI-0330-ABA-CB-BA-DUAL by Onsemi

KAI-0330-ABA-CB-BA-DUAL by Onsemi is an image sensor with 9x9 um pixel size, 648 horizontal pixels, and 484 vertical pixels. It operates at temperatures ranging from -50 to 70 °C and requires a power supply of 15V. Ideal for applications requiring high-resolution imaging in various environments.

Median Price

$178.990

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

$178.990

100+ parts

$168.250

1k+ parts

$157.510

10k+ parts

-

1

$178.990

$168.250

$157.510

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,063 parts In-Stock

1+ parts

$197.914

100+ parts

-

1k+ parts

-

10k+ parts

-

1,063

$197.914

-

-

-

Vyrian

USA . 8,685 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,685

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,386 parts In-Stock

1+ parts

$187.497

100+ parts

-

1k+ parts

-

10k+ parts

-

2,386

$187.497

-

-

-

Corohmni

South Africa . 439 parts In-Stock

1+ parts

$208.330

100+ parts

-

1k+ parts

-

10k+ parts

-

439

$208.330

-

-

-

Problanco Electronics

Mexico . 7,831 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,831

-

-

-

-

SupplyDigital Components

Austria . 4,911 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,911

-

-

-

-

TANS Electronics

Latvia . 2,556 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,556

-

-

-

-

Kulean Microsystems

USA . 2,181 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,181

-

-

-

-

UHIMA Technologies

Türkiye . 328 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

328

-

-

-

-

Overview

Capture the world in stunning detail with the KAI-0330-ABA-CB-BA-DUAL image sensor from Onsemi. Known for their superior quality and cutting-edge technology, Onsemi delivers top-of-the-line imaging solutions for a variety of applications. Whether you're in the medical, automotive, or industrial field, this sensor offers unmatched performance and reliability. With its high pixel resolution and wide operating temperature range, this sensor provides exceptional value and precision for your imaging needs. Upgrade your projects with the best in the industry - choose Onsemi.

Feature Benefit Bullets

Pixel Size (um): 9X9

The small pixel size of 9X9 micrometers allows for high resolution images to be captured with great detail, making this image sensor suitable for applications requiring precise imaging.

Power Supplies (V): 15

The high power supply of 15 volts provides efficient and reliable operation, ensuring that the image sensor can perform effectively in various conditions.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this image sensor can withstand high heat environments, making it suitable for industrial or outdoor applications.

Horizontal Pixel: 648

The high number of horizontal pixels (648) allows for detailed and high-resolution images to be captured, making this image sensor ideal for applications requiring precise imaging.

Minimum Operating Temperature: -50 °C

The low minimum operating temperature of -50 °C ensures that this image sensor can operate effectively even in extremely cold conditions, increasing its versatility and reliability.

Vertical Pixel: 484

The vertical pixel count of 484 contributes to the high-resolution capabilities of this image sensor, allowing for detailed images to be captured in both horizontal and vertical dimensions.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mount feature makes installation and integration of this image sensor easy and convenient, allowing for flexible placement in various devices or systems.

Technical Specifications

Image Sensors KAI-0330-ABA-CB-BA-DUAL attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Horizontal Pixel:

648

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Pixel Size (um):

9X9

Power Supplies (V):

15

Sub-Category:

CCD Image Sensors

Vertical Pixel:

484

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20