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ASX340AT3C00XPED0-TPBR

Onsemi

ASX340AT3C00XPED0-TPBR by Onsemi

ASX340AT3C00XPED0-TPBR by Onsemi is an image sensor with 5.6x5.6 um pixel size, 27 MHz master clock, and 1/4 inch optical format. It operates b/w -40 to 105 °C and has a digital voltage output range of 0.84-1.96V. Ideal for applications requiring high-resolution imaging at a frame rate of 60 fps in a compact square package design for surface mount installation.

Median Price

$12.570

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,860 parts In-Stock

1+ parts

$12.570

100+ parts

$9.787

1k+ parts

$8.893

10k+ parts

$8.990

1,860

$12.570

$9.787

$8.893

$8.990

Flip Electronics (Authorized)

USA . 733 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

733

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,803 parts In-Stock

1+ parts

$14.906

100+ parts

-

1k+ parts

-

10k+ parts

-

1,803

$14.906

-

-

-

Vyrian

USA . 1,187 parts In-Stock

1+ parts

$15.690

100+ parts

-

1k+ parts

-

10k+ parts

-

1,187

$15.690

-

-

-

Flip Electronics

USA . 733 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

733

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,788 parts In-Stock

1+ parts

$14.121

100+ parts

-

1k+ parts

-

10k+ parts

-

1,788

$14.121

-

-

-

Corohmni

South Africa . 361 parts In-Stock

1+ parts

$15.690

100+ parts

-

1k+ parts

-

10k+ parts

-

361

$15.690

-

-

-

Native Components

USA . 422 parts In-Stock

1+ parts

$539.475

100+ parts

$528.685

1k+ parts

$523.291

10k+ parts

$517.896

422

$539.475

$528.685

$523.291

$517.896

Northwest PG Solutions

USA . 1,680 parts In-Stock

1+ parts

$593.422

100+ parts

-

1k+ parts

-

10k+ parts

-

1,680

$593.422

-

-

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TANS Electronics

Latvia . 8,290 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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8,290

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Kulean Microsystems

USA . 2,540 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,540

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SupplyDigital Components

Austria . 1,995 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,995

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Problanco Electronics

Mexico . 645 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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645

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UHIMA Technologies

Türkiye . 80 parts In-Stock

1+ parts

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80

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Overview

Discover a world of vibrant imaging possibilities with the ASX340AT3C00XPED0-TPBR Image Sensor by Onsemi. Boasting cutting-edge technology and superior quality, this sensor is perfect for a wide range of applications. From security cameras to industrial automation, this sensor offers exceptional value with its high performance and reliability. Elevate your imaging experience with Onsemi's top-of-the-line product and see the difference for yourself.

Feature Benefit Bullets

Pixel Size (um): 5.6X5.6

The small pixel size allows for detailed images to be captured, making this image sensor suitable for high-resolution applications.

Maximum Supply Voltage: 1.95 V

The high maximum supply voltage provides flexibility in the power supply options for the sensor, ensuring stable operation.

Master Clock: 27 MHz

The high master clock frequency enables fast data processing and high frame rates, making it ideal for applications requiring real-time image capture.

Body Width: 7.5 inch

The compact body width makes it easy to integrate this image sensor into various devices without taking up much space.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

The CMOS sensor type offers low power consumption and high sensitivity, making it a reliable choice for imaging applications.

Body Height: 1.28 mm

The slim body height allows for easy mounting and integration into small and thin devices.

Package Shape or Style: SQUARE

The square package shape provides a standardized form factor for easy handling and integration into various systems.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage ensures efficient power usage and compatibility with a wide range of power sources.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows for reliable operation in harsh environments or under high temperature conditions.

Horizontal Pixel: 728

The high number of horizontal pixels results in high-resolution images with fine details, making this image sensor suitable for professional imaging applications.

Output Range: 0.84-1.96V

The wide output voltage range allows for flexibility in signal processing and compatibility with different types of output devices.

Output Type: DIGITAL VOLTAGE

The digital voltage output simplifies signal processing and transmission, ensuring accurate and reliable data transfer.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance even in cold environments or under extreme temperature conditions.

Maximum Operating Current: 50 mA

The low maximum operating current helps in reducing power consumption and heat generation, making this image sensor energy-efficient.

Housing: PLASTIC

The plastic housing provides a lightweight and cost-effective solution for the sensor, suitable for consumer electronics and mass production applications.

Dynamic Range: 87 dB

The high dynamic range allows for capturing a wide range of light intensities, resulting in vibrant and detailed images even in challenging lighting conditions.

Vertical Pixel: 560

The high number of vertical pixels contributes to the sensor's high resolution and image quality, making it ideal for capturing detailed images and videos.

Body Length/Diameter: 7.5 mm

The compact body length/diameter makes this sensor easy to integrate into slim and small devices, expanding its application versatility.

Optical Format (inch): 1/4

The 1/4 inch optical format is a common standard, making this image sensor compatible with a wide range of lenses and optical systems.

Data Rate: 27 Mbps

The high data rate allows for fast and efficient data transfer, ensuring smooth and real-time image processing.

Termination Type: SOLDER

The solder termination type provides secure and reliable connections, ensuring stable operation and durability of the image sensor.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies connectivity and communication with other devices, making integration and control easier for the user.

Frame Rate: 60 fps

The high frame rate allows for capturing smooth and fluid motion in videos, making this image sensor suitable for applications requiring high-speed imaging.

Array Type: FRAME

The frame array type enables efficient image capture and processing, ensuring high-quality output with minimal noise or distortion.

Mounting Feature: SURFACE MOUNT

The surface mounting feature facilitates easy and secure installation of the image sensor onto PCBs or other surfaces, simplifying the manufacturing process.

Technical Specifications

Image Sensors ASX340AT3C00XPED0-TPBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO HAVE ANALOG SUPPLY VOLTAGE 2.66-2.94 V, ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Body Width:

7.5 inch

Body Height:

1.28 mm

Body Length/Diameter:

7.5 mm

Data Rate:

27 Mbps

Dynamic Range:

87 dB

Frame Rate:

60 fps

Horizontal Pixel:

728

Housing:

PLASTIC

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

5.6X5.6

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

560

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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