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KAI-0373-ABA-CB-AE

Onsemi

KAI-0373-ABA-CB-AE by Onsemi

KAI-0373-ABA-CB-AE by Onsemi is an image sensor with 768x484 pixels, 11.6X13.6 um pixel size, and 60 dB dynamic range. It operates b/w -25 to +40 °C and has a supply voltage range of 14.5V to 15.5V. Ideal for applications requiring high-quality imaging in industrial automation and surveillance systems due to its CCD technology and rectangular package style.

Median Price

$86.293

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 3 parts In-Stock

1+ parts

$33.545

100+ parts

$33.545

1k+ parts

$33.545

10k+ parts

$33.545

3

$33.545

$33.545

$33.545

$33.545

Arrow

USA . 3 parts In-Stock

1+ parts

$139.041

100+ parts

$139.041

1k+ parts

$139.041

10k+ parts

$139.041

3

$139.041

$139.041

$139.041

$139.041

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,877 parts In-Stock

1+ parts

$31.868

100+ parts

-

1k+ parts

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1,877

$31.868

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Vyrian

USA . 7,128 parts In-Stock

1+ parts

-

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10k+ parts

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7,128

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,577 parts In-Stock

1+ parts

$30.190

100+ parts

-

1k+ parts

-

10k+ parts

-

1,577

$30.190

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-

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Corohmni

South Africa . 483 parts In-Stock

1+ parts

$33.545

100+ parts

-

1k+ parts

-

10k+ parts

-

483

$33.545

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Problanco Electronics

Mexico . 4,999 parts In-Stock

1+ parts

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4,999

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Kulean Microsystems

USA . 4,604 parts In-Stock

1+ parts

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4,604

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TANS Electronics

Latvia . 1,910 parts In-Stock

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1,910

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SupplyDigital Components

Austria . 1,161 parts In-Stock

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1,161

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UHIMA Technologies

Türkiye . 73 parts In-Stock

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73

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Overview

Elevate your imaging experience with the KAI-0373-ABA-CB-AE by Onsemi. As a leading manufacturer of cutting-edge image sensors, Onsemi delivers top-quality products that exceed industry standards. This CCD image sensor is perfect for a wide range of applications, from industrial inspections to medical imaging. With a focus on precision and performance, this sensor offers unparalleled value, providing customers with clear, high-resolution images that capture every detail with exceptional clarity and accuracy. Experience the difference with Onsemi's KAI-0373-ABA-CB-AE image sensor today.

Feature Benefit Bullets

Pixel Size (um): 11.6X13.6

The small pixel size allows for high resolution image capture, making this image sensor suitable for applications where detail is important.

Maximum Supply Voltage: 15.5 V

The high maximum supply voltage provides flexibility in power supply options and ensures reliable performance under varying voltage conditions.

Body Width: 20.19 inch

The compact body width makes this image sensor easy to integrate into various devices or systems without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensors are known for their high-quality image output and low noise levels, making them ideal for applications requiring excellent image clarity.

Body Height: 4.32 mm

The low body height contributes to the overall compactness of the sensor and allows for flexible mounting options in space-constrained environments.

Package Shape or Style: RECTANGULAR

The rectangular package shape makes it easy to align and integrate the sensor into existing design layouts or systems efficiently.

Minimum Supply Voltage: 14.5 V

The low minimum supply voltage ensures energy efficiency and helps minimize power consumption during operation.

Maximum Operating Temperature: 40 °C

The high maximum operating temperature range enables the sensor to function reliably in various environmental conditions without risk of overheating.

Horizontal Pixel: 768

The high horizontal pixel count allows for detailed image capture with sharp resolution, making this sensor suitable for applications where image clarity is crucial.

Minimum Operating Temperature: 25 °C

The low minimum operating temperature ensures the sensor can function effectively even in colder environments without compromising performance.

Housing: CERAMIC

The ceramic housing provides durability and thermal stability, protecting the sensor components from damage and ensuring long-term reliability.

Dynamic Range: 60 dB

The high dynamic range allows the sensor to capture a wide range of light intensities, resulting in detailed images with accurate color reproduction.

Vertical Pixel: 484

The vertical pixel count contributes to the overall image resolution, allowing for detailed image capture in both horizontal and vertical directions.

Body Length/Diameter: 30.48 mm

The compact body length/diameter makes this sensor easy to handle and install, suitable for applications where space is limited.

Optical Format (inch): 2/3

The 2/3 inch optical format provides compatibility with a wide range of lenses, allowing for flexible imaging solutions and creative possibilities.

Termination Type: SOLDER

The solder termination type ensures secure electrical connections during installation, preventing signal loss or disruption in data transmission.

Array Type: INTERLINE

The interline array type allows for fast readout speeds and efficient image capture, making this sensor ideal for applications requiring rapid data acquisition.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature provides secure attachment options, ensuring the sensor remains stable and correctly positioned during operation.

Technical Specifications

Image Sensors KAI-0373-ABA-CB-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 9 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

20.19 inch

Body Height:

4.32 mm

Body Length/Diameter:

30.48 mm

Dynamic Range:

60 dB

Horizontal Pixel:

768

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

25 Cel

Optical Format (inch):

2/3

Package Shape or Style:

Pixel Size (um):

11.6X13.6

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

484

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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