Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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ASX340AT2C00XPED0-TRBR by Onsemi is a 5.6x5.6 um CMOS image sensor with 728H x 560V pixels, offering a dynamic range of 87 dB and operating at temperatures from -40 to 105 °C. It has a digital voltage output interface, operates at a max supply voltage of 1.95 V, and features a frame rate of 60 fps, making it ideal for applications requiring high-quality imaging in various environments.
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The small pixel size allows for high resolution and detailed image capture.
This ensures safe operation and reliability of the image sensor within specified voltage limits.
The high frequency master clock enables fast processing of image data, resulting in real-time performance.
The compact and slim body width makes it suitable for various applications where space is limited.
CMOS image sensors are known for their low power consumption and high image quality, making them a preferred choice in imaging devices.
The square package shape allows for easy integration into circuit boards and provides a stable mounting platform.
The low minimum supply voltage helps in conserving power and extending the battery life of devices.
With a high maximum operating temperature, the image sensor can withstand harsh environmental conditions without performance degradation.
The high number of horizontal pixels contributes to the sharpness and clarity of images captured by the sensor.
The wide output range allows for flexibility in signal processing and compatibility with different voltage levels in the system.
Digital output simplifies data transmission and processing, enhancing the overall efficiency of the image sensor.
The low minimum operating temperature ensures the image sensor functions reliably in cold environments.
The terminal finish materials provide good conductivity and corrosion resistance, ensuring long-term reliability.
The low operating current helps in minimizing power consumption and heat generation, contributing to energy efficiency.
The plastic housing offers lightweight and durable protection for the image sensor, making it suitable for portable devices.
The wide dynamic range allows the sensor to capture both bright and dark areas in the scene accurately, producing high-quality images with more details.
The vertical pixel count adds to the overall resolution and image quality, making the sensor suitable for capturing clear and detailed images.
The compact body length/diameter facilitates easy integration and mounting of the image sensor in space-constrained applications.
The 1/4 inch optical format is a popular standard in image sensor size, ensuring compatibility with various optical systems and lenses.
The high data rate enables fast and seamless transfer of image data, crucial for real-time imaging applications.
Solder termination provides a reliable and secure connection, ensuring stable operation of the image sensor in different conditions.
The 2-wire interface simplifies the connection and communication with external devices, enhancing the overall usability of the image sensor.
The high frame rate ensures smooth and fluid motion capture, making the image sensor suitable for high-speed imaging applications.
The frame array type allows for simultaneous capture of multiple image frames, enabling advanced imaging functionalities and computational processing.
The surface mount capability facilitates easy and secure attachment of the image sensor to PCBs, ensuring stable and reliable operation in various devices.
Image Sensors ASX340AT2C00XPED0-TRBR attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Data Rate:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Housing:
JESD-609 Code:
Master Clock:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Output Range:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Terminal Finish:
Termination Type:
Vertical Pixel:
PCN Design/Specification - AR01xxA/AS0149/ASX340/T3Cx/ASX34/MT9V 29/Jun/2022
PCN Assembly/Origin - Mult Dev 09/Feb/2023
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
SMBJ18CA
Mde Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
NC7WZ17P6X
Onsemi
The Onsemi NC7WZ17P6X is a logic gate with 2 functions, featuring a propagation delay of 13.1 ns at 1.8V supply voltage. Ideal for industrial applications, it operates b/w -40 to 85°C and has a max power supply current of 100mA. With Schmitt Trigger technology and small outline packaging, it suits compact electronic designs requiring fast signal processing.
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
DRV5053VAQLPG
Texas Instruments
Texas Instruments DRV5053VAQLPG is a magnetic field sensor with 2.5-38V supply voltage range, -40 to 125°C operating temperature, and 0-2V output. Ideal for applications requiring Hall effect sensors like automotive, industrial automation, and robotics due to its compact size (1.52" x 4mm) and high output current capability of 2.3A.
CRCW06030000Z0EAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06030000Z0EAHP is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating temp range -55 to 155 °C, it's SMT package style makes it ideal for automotive applications meeting AEC-Q200 standard.
Bourns
2N2222A
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
1N4148WS
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
LM358AN
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Sangdest Microelectronics (Nanjing)
North American Philips Discrete Products Div
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
BAV99
ROHM
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Kec
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
1N4148
Hitachi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
OVM9724-RADA
Omnivision Technologies
Omnivision Technologies' OVM9724-RADA is a CMOS image sensor with 1.4X1.4 um pixel size and 70.4 dB dynamic range. It operates b/w -30 to 70 °C, offering 30 fps frame rate for applications requiring high sensitivity at 0.74 V/lx.s, such as surveillance cameras and automotive vision systems.
KAE-08151-FBA-SD-EE
KAE-08151-FBA-SD-EE by Onsemi is an image sensor with 5.5x5.5 um pixel size, 66 dB dynamic range, and 2856 horizontal and vertical pixels. It operates b/w -40 to 40 °C with a supply voltage range of 14.7V to 15.3V. Ideal for applications requiring high-resolution imaging in industrial or scientific settings due to its superior technical specifications.
KAI-16000-AAA-JD-B1
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Data Rate: 30 Mbps; Array Type: INTERLINE;
KLI-4104-DAA-CB-AA
KLI-4104-DAA-CB-AA by Onsemi is an Image Sensor with 10x10 um pixel size, 4134 horizontal and vertical pixels. It operates b/w 0-70 °C, has a dynamic range of 60 dB, and outputs analog voltage in the range of 1.50-1.70V. This rectangular CCD sensor is ideal for applications requiring high-resolution imaging such as industrial machine vision systems or medical imaging devices.
KAI-1010M
KAI-1010M by Onsemi is an image sensor with 9x9 um pixel size, 1008 horizontal pixels, and 1018 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 60 dB. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.
KAI-04050-CBA-JB-AE
KAI-04050-CBA-JB-AE by Onsemi is a 5.5x5.5um CCD image sensor with 2336H x 1752V pixels, offering a dynamic range of 64dB. It features an interline array type and solder termination, suitable for applications in digital cameras, machine vision systems, and medical imaging devices.
TX253SPD-30
TX253SPD-30 by Texas Instruments is an image sensor with 7.4x7.4um pixel size, 680H x 500V resolution, and operates at -10 to 45°C. It requires a 12V power supply and features THROUGH HOLE MOUNTing. Ideal for applications requiring high-resolution imaging in varying temperature environments.
KAI-11002-CBA-CD-AE
KAI-11002-CBA-CD-AE by Onsemi is an image sensor with 9x9 um pixel size, 4008 horizontal pixels, and 2672 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 66 dB. Ideal for digital imaging applications requiring high-resolution and low-light performance.
KAI-02050-AAA-JR-BA
Onsemi's KAI-02050-AAA-JR-BA is a 5.5x5.5 um CCD image sensor with 1600H x 1200V pixels, offering a dynamic range of 64 dB. Operating b/w -50 to 70 °C, it has a supply voltage range of 14.5V to 15.5V and is ideal for digital imaging applications requiring high-quality output in a compact rectangular package.
KAI-01050-FBA-FD-AE
The Onsemi KAI-01050-FBA-FD-AE is a 5.5x5.5 um CCD image sensor with 1024x1024 pixels, offering a dynamic range of 64 dB. It operates b/w -50 to 70 °C and requires a supply voltage of 14.5-15.5 V. Ideal for surface mount applications in devices requiring high-quality imaging capabilities in an optical format of 1/2 inch.
MT9P031I12STM-DP
Onsemi's MT9P031I12STM-DP is a 2.2x2.2um CMOS image sensor with 2592Hx1944V pixels, offering a dynamic range of 70.1dB and operating at temperatures from -30 to 70°C. It has a digital voltage output interface, operates on 1.7-1.9V supply voltage, and is suitable for frame array applications in various industries like surveillance and automotive systems.
AR0323ATSB17XUEA0-DPBR-E
Onsemi's AR0323ATSB17XUEA0-DPBR-E is a CMOS image sensor with 3x3 um pixel size, 64 MHz master clock, and 1.26V max supply voltage. Ideal for digital cameras, surveillance systems, and automotive applications due to its high dynamic range of 120 dB and frame rate of 45 fps.
MT9T031C12STC-DP
Onsemi's MT9T031C12STC-DP is a 3.20x3.20 um CMOS image sensor with 2048H x 1536V pixels, offering a dynamic range of 61 dB and operating at a max clock speed of 48 MHz. This sensor, housed in ceramic, features a digital voltage output interface and is ideal for applications requiring high-resolution imaging at up to 12 fps.
TC241-80
TC241-80 by Texas Instruments is an image sensor with 754x244 pixels, pixel size of 11.5x27 um, and operates at temperatures from -10 to 45 °C. It requires a power supply of 12V and features THROUGH HOLE MOUNT for easy installation. Ideal for applications requiring high-resolution imaging in various environments.
11KAI-04070-FBA-JD-AE
The Onsemi 11KAI-04070-FBA-JD-AE is an image sensor with 2048x2048 pixels, 7.4um pixel size, and 70.5dB dynamic range. It operates b/w -50 to 70 °C and has a max supply voltage of 15.5V. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
MT9V022I77ATC
MT9V022I77ATC by Onsemi is a 1/3-inch CMOS image sensor with 752x480 pixels. It operates at 26.6 MHz master clock, offers a dynamic range of 54.4 dB, and supports a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in industrial and automotive sectors.
AS0140AT2C00XUSM0-DPBR-E
Onsemi AS0140AT2C00XUSM0-DPBR-E is a 3x3 um CMOS image sensor with 1280H x 800V pixels. It operates at 1.7-1.98V, has a master clock of 27 MHz, and outputs digital voltage from 0.56-2.24V. Ideal for frame array applications with a frame rate of 60 fps in an optical format of 1/4 inch, suitable for surface mounting features.
KAI-01050-ABA-JD-BA
KAI-01050-ABA-JD-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 1024x1024 resolution, and 64 dB dynamic range. It is ideal for digital voltage output applications in industrial cameras due to its rectangular shape, CCD technology, and solder termination type.
MT9D115EB3STC-CR
MT9D115EB3STC-CR by Onsemi is an image sensor with 1.75x1.75 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It operates at a max supply voltage of 1.95 V and has a master clock of 85 MHz. This CMOS sensor with a dynamic range of 63.9 dB is ideal for digital imaging applications requiring a frame rate of up to 15 fps.
NOIP1SN5000A-QDI
NOIP1SN5000A-QDI by Onsemi is a CMOS image sensor with 2592x2048 pixels, 4.80x4.80 um pixel size, and 72 MHz master clock. It operates at -40 to 85 °C with a dynamic range of 60 dB. Ideal for applications requiring high-resolution imaging at up to 100 fps frame rate.
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ASX340AT2C00XPED0-DPBR
ASX340AT2C00XPED0-DPBR by Onsemi is a 5.6x5.6 um CMOS image sensor with 728H x 560V pixels, offering a dynamic range of 87 dB and operating temperature range from -40 to 105°C. It features a digital voltage output interface, operates at a max supply voltage of 1.95V, and has a frame rate of 60 fps, making it ideal for applications in digital cameras and surveillance systems.
ASX340AT2C00XPED0-DPBR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.84-1.96V; Sensitivity (V/lx.s): 16.5 V/lx.s;
ASX340AT2C00XPED0-DPBR2
ASX340AT2C00XPED0-DPBR2 by Onsemi is a 5.6x5.6 um CMOS image sensor with 728H x 560V pixels, offering a dynamic range of 87 dB and sensitivity of 16.5 V/lx.s. It operates at temperatures from -40 to 85 °C, with a max supply voltage of 1.95 V and data rate of 27 Mbps. Ideal for applications requiring high-resolution imaging at up to 60 fps.
ASX340AT2C00XPED0-DRBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.84-1.96V; Maximum Operating Current: 50 mA;
ASX340CS2C00SPED0-DRBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.40-2.50V; Sensitivity (V/lx.s): 16.5 V/lx.s;
ASX340CS2C00SPED0-TRBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.40-2.50V; Housing: PLASTIC;
ASX340AT3C00XPED0-DPBR-E
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.84-1.96V; Dynamic Range: 87 dB;
ASX342ATSC00XPED0-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.84-1.96V; Maximum Supply Voltage: 1.95 V;
ASX342ATSC00XPED0-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.84-1.96V; Array Type: FRAME;
ASX340AT2C00XPED0-DRBR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.84-1.96V; Vertical Pixel: 560;
ASX340AT3C00XPED0-DRBR-E
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.84-1.96V; Body Length/Diameter: 7.5 mm;
ASX340CS2C00SPED0-TPBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.40-2.50V; Maximum Operating Temperature: 70 Cel;
ASX340AT3C00XPED0-DPBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.84-1.96V; Maximum Operating Temperature: 105 Cel;
ASX342ATSC00XPED0-DP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.84-1.96V; Pixel Size (um): 5.6X5.6;
ASX340AT3C00XPED0-TPBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.84-1.96V; Termination Type: SOLDER;
ASX340AT3C00XPED0-DRBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.84-1.96V; Data Rate: 27 Mbps;
ASX340AT2C00XPED0-TPBR
ASX340AT3C00XPED0-TRBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.84-1.96V; Frame Rate: 60 fps;
ASX340CS2C00SPED0-DPBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.40-2.50V; JESD-609 Code: e1;
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