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ASX340AT2C00XPED0-DPBR1

Onsemi

ASX340AT2C00XPED0-DPBR1 by Onsemi

Onsemi's ASX340AT2C00XPED0-DPBR1 is a 5600x5600 pixel CMOS image sensor with 27 MHz master clock. It operates b/w -40 to 85 °C, offering a dynamic range of 87 dB. Ideal for applications requiring high-resolution imaging and fast frame rates.

Median Price

$12.740

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 30 parts In-Stock

1+ parts

$12.740

100+ parts

$11.970

1k+ parts

$10.830

10k+ parts

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30

$12.740

$11.970

$10.830

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,459 parts In-Stock

1+ parts

$12.103

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2,459

$12.103

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Nova Conductors

Japan . 48 parts In-Stock

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$13.101

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48

$13.101

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Flip Electronics

USA . 53 parts In-Stock

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$14.450

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53

$14.450

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Vyrian

USA . 8,979 parts In-Stock

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8,979

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VNN

France . 2,532 parts In-Stock

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2,532

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Sunrise Surplus Inc.

USA . 159 parts In-Stock

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159

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 800 parts In-Stock

1+ parts

$3.030

100+ parts

-

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800

$3.030

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AZTECH Wire

Italy . 499 parts In-Stock

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$9.746

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499

$9.746

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Semicontronic

India . 30 parts In-Stock

1+ parts

$10.830

100+ parts

$10.559

1k+ parts

$10.505

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30

$10.830

$10.559

$10.505

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Ampacity Inc.

Singapore . 23 parts In-Stock

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$10.830

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23

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Corphita

USA . 2,115 parts In-Stock

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$11.466

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$11.466

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Continental Prestige Electronics

USA . 1,280 parts In-Stock

1+ parts

$12.480

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$12.230

1,280

$12.480

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$12.230

Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$12.558

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$12.558

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$12.558

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350

$12.558

$12.558

$12.558

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Corohmni

South Africa . 434 parts In-Stock

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$12.740

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434

$12.740

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$13.101

100+ parts

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1k+ parts

$12.445

10k+ parts

$12.183

1,000

$13.101

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$12.445

$12.183

TANS Electronics

Latvia . 7,428 parts In-Stock

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7,428

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SupplyDigital Components

Austria . 6,149 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Problanco Electronics

Mexico . 3,332 parts In-Stock

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3,332

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Kulean Microsystems

USA . 2,485 parts In-Stock

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2,485

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Argo Parts USA

USA . 796 parts In-Stock

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UHIMA Technologies

Türkiye . 89 parts In-Stock

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89

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Overview

Capture every moment in stunning detail with the ASX340AT2C00XPED0-DPBR1 by Onsemi. As a leading manufacturer in image sensors, Onsemi delivers unparalleled quality and reliability in every product. Ideal for a wide range of applications, this image sensor offers customers exceptional value with its high performance and advanced features. Experience the benefits of crystal-clear images, precise data capture, and seamless integration with the ASX340AT2C00XPED0-DPBR1. Elevate your projects with the superior capabilities of this innovative sensor.

Feature Benefit Bullets

Pixel Size (um): 5600X5600

High pixel size results in higher image resolution and clarity, making this image sensor ideal for capturing detailed images.

Maximum Supply Voltage: 1.95 V

The higher maximum supply voltage allows for greater flexibility in powering the image sensor, ensuring stable performance in varying operating conditions.

Master Clock: 27 MHz

A high master clock frequency of 27 MHz ensures fast and efficient data processing, enabling high-speed imaging capabilities.

Body Width: 7.5 inch

The compact body width of 7.5 inches allows for easy integration into a variety of devices and systems without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

The CMOS sensor type offers high sensitivity and low noise performance, resulting in clear and high-quality image output suitable for a wide range of applications.

Body Height: 1.28 mm

The low body height of 1.28 mm enables the image sensor to be used in slim devices without adding bulk, making it a versatile choice for compact designs.

Package Shape or Style: SQUARE

The square package shape provides a simple and easy-to-mount design, ensuring efficient installation and setup in various equipment configurations.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage allows for energy-efficient operation and extends battery life in portable devices utilizing this image sensor.

Maximum Operating Temperature: 85 °C

The wide maximum operating temperature range of 85°C ensures reliable performance even in extreme environmental conditions, enhancing the product's durability.

Horizontal Pixel: 728

The specific number of horizontal pixels offers a balance between image resolution and data processing speed, making it suitable for various imaging applications.

Output Range: 0.84-1.96V

The wide output voltage range provides flexibility in signal processing, enabling compatibility with different devices and systems for seamless integration.

Output Type: DIGITAL VOLTAGE

The digital voltage output type simplifies signal interpretation and processing, ensuring accurate and reliable data transmission for effective image capture and analysis.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the image sensor to function in cold environments without compromising performance, making it suitable for a range of applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, enhancing the reliability and longevity of the image sensor in various operating conditions.

Maximum Operating Current: 50 mA

The moderate maximum operating current ensures efficient power consumption and heat dissipation, contributing to the image sensor's overall performance and reliability.

Housing: PLASTIC

The plastic housing offers lightweight and durable protection for the image sensor components, making it suitable for portable and rugged applications where resilience is essential.

Dynamic Range: 87 dB

The high dynamic range of 87 dB enables the image sensor to capture a wide range of light intensity levels accurately, resulting in detailed and true-to-life images with clear contrast.

Vertical Pixel: 560

The specific number of vertical pixels complements the horizontal pixel count, ensuring balanced image quality and resolution suitable for a variety of imaging tasks.

Body Length/Diameter: 7.5 mm

The compact body length/diameter of 7.5 mm allows for easy integration into space-constrained designs, offering versatility and flexibility in device integration.

Optical Format (inch): 1/4

The 1/4 inch optical format provides compatibility with various lenses and optical systems, allowing for customization and adaptability in different imaging setups.

Data Rate: 27 Mbps

The high data rate of 27 Mbps enables fast and efficient data transfer, ensuring smooth and continuous image capture and transmission for real-time imaging applications.

Termination Type: SOLDER

The solder termination type offers secure and reliable electrical connections, preventing signal loss and ensuring stable performance in demanding operating conditions.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface type simplifies communication and control between the image sensor and external devices, facilitating seamless integration and interoperability in diverse systems.

Frame Rate: 60 fps

The high frame rate of 60 frames per second allows for smooth and fluid video recording and imaging, capturing fast-moving subjects with clarity and accuracy.

Array Type: FRAME

The frame array type offers efficient image capturing and processing, ensuring high-quality output with consistent performance in various imaging scenarios.

Sensitivity (V/lx.s): 16.5 V/lx.s

The high sensitivity of 16.5 V/lx.s enables the image sensor to detect and amplify low light levels effectively, improving image quality in challenging lighting conditions.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies installation and integration of the image sensor onto circuit boards, saving space and facilitating assembly in compact device designs.

Technical Specifications

Image Sensors ASX340AT2C00XPED0-DPBR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER; IT ALSO OPERATES AT 2.8 V ANALOG NOMINAL SUPPLY VOLTAGE

Array Type:

FRAME

Body Width:

7.5 inch

Body Height:

1.28 mm

Body Length/Diameter:

7.5 mm

Data Rate:

27 Mbps

Dynamic Range:

87 dB

Frame Rate:

60 fps

Horizontal Pixel:

728

Housing:

PLASTIC

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

5600X5600

Sensitivity (V/lx.s):

16.5 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

TIN SILVER COPPER

Termination Type:

SOLDER

Vertical Pixel:

560

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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