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ASX340AT3C00XPED0-DPBR

Onsemi

ASX340AT3C00XPED0-DPBR by Onsemi

ASX340AT3C00XPED0-DPBR by Onsemi is an image sensor with 5.6x5.6 um pixel size, 27 MHz master clock, and 1/4 inch optical format. It operates b/w -40 to 105 °C and has a dynamic range of 87 dB. Ideal for applications requiring high-resolution imaging at a fast frame rate of 60 fps in a compact surface-mount package.

Median Price

$12.570

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 398 parts In-Stock

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$12.570

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$9.787

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Digiode

USA . 1,555 parts In-Stock

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$14.906

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$14.906

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Vyrian

USA . 621 parts In-Stock

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$15.690

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621

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Flip Electronics

USA . 7,800 parts In-Stock

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Chip Stock

USA . 2,503 parts In-Stock

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TME

Poland . 750 parts In-Stock

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$10.470

750

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Prism Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,932 parts In-Stock

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$14.121

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Corohmni

South Africa . 262 parts In-Stock

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$15.690

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262

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TANS Electronics

Latvia . 7,702 parts In-Stock

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SupplyDigital Components

Austria . 7,366 parts In-Stock

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Problanco Electronics

Mexico . 6,237 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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Northwest PG Solutions

USA . 2,374 parts In-Stock

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Kulean Microsystems

USA . 1,127 parts In-Stock

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UHIMA Technologies

Türkiye . 580 parts In-Stock

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580

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Native Components

USA . 307 parts In-Stock

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307

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GreenTree Electronics

Israel . 100 parts In-Stock

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Overview

Capture every moment in stunning clarity with the ASX340AT3C00XPED0-DPBR image sensor by Onsemi. Renowned for their superior quality and innovation, Onsemi provides cutting-edge technology that pushes boundaries in the industry. Ideal for a wide range of applications, this image sensor offers exceptional value with its high performance and reliability. Elevate your imaging experience with the ASX340AT3C00XPED0-DPBR and unlock a world of possibilities in capturing unforgettable moments with precision and detail.

Feature Benefit Bullets

Pixel Size (um): 5.6X5.6

The small pixel size allows for high resolution images to be captured with this image sensor.

Maximum Supply Voltage: 1.95 V

A higher maximum supply voltage ensures stable operation and performance of the image sensor.

Master Clock: 27 MHz

The high master clock frequency enables fast data processing and readout from the image sensor.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this image sensor suitable for use in various environments and conditions.

Dynamic Range: 87 dB

The high dynamic range allows for capturing images with a wide range of brightness levels, resulting in high-quality output.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies connectivity and communication between the image sensor and other devices, enhancing ease of use.

Technical Specifications

Image Sensors ASX340AT3C00XPED0-DPBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO HAVE ANALOG SUPPLY VOLTAGE 2.66-2.94 V, ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Body Width:

7.5 inch

Body Height:

1.28 mm

Body Length/Diameter:

7.5 mm

Data Rate:

27 Mbps

Dynamic Range:

87 dB

Frame Rate:

60 fps

Horizontal Pixel:

728

Housing:

PLASTIC

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

5.6X5.6

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

560

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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