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AR0330CM1C12SHKA0-CP

Onsemi

AR0330CM1C12SHKA0-CP by Onsemi

The Onsemi AR0330CM1C12SHKA0-CP is a 1/3-inch CMOS image sensor with 2304 (H) x 1296 (V) pixels. It operates at a max supply voltage of 1.9V and has a master clock of 27 MHz, offering a dynamic range of 69.5 dB. Ideal for applications requiring high-resolution imaging at up to 60 fps, such as surveillance cameras and industrial machine vision systems.

Median Price

$17.820

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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DigiKey

USA . 2,070 parts In-Stock

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$17.820

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$14.031

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$13.143

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$17.820

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Flip Electronics (Authorized)

USA . 32,000 parts In-Stock

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Digiode

USA . 720 parts In-Stock

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$16.929

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Vyrian

USA . 375 parts In-Stock

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$17.820

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Native Components

USA . 978 parts In-Stock

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$1.753

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Northwest PG Solutions

USA . 1,277 parts In-Stock

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$1.928

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Corphita

USA . 1,519 parts In-Stock

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$16.038

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Corohmni

South Africa . 497 parts In-Stock

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$23.140

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Formix International (Excess)

India . 30,200 parts In-Stock

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Problanco Electronics

Mexico . 6,725 parts In-Stock

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SupplyDigital Components

Austria . 6,357 parts In-Stock

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TANS Electronics

Latvia . 3,908 parts In-Stock

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Kulean Microsystems

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Perfect Parts

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Infinite Electronics LLP (Excess)

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Authorized Procurement Solutions

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UHIMA Technologies

Türkiye . 150 parts In-Stock

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Overview

Capture every moment in vivid detail with the AR0330CM1C12SHKA0-CP image sensor by Onsemi. As a leader in the industry, Onsemi ensures top-notch quality and reliability in all their products. This sensor is perfect for applications requiring high-resolution imaging, offering customers unparalleled value and performance. Whether you're in automotive, security, or consumer electronics, this sensor delivers exceptional results, making it the ideal choice for all your imaging needs. Unlock the potential of your projects with the AR0330CM1C12SHKA0-CP and experience the difference that Onsemi brings to the table.

Feature Benefit Bullets

Pixel Size (um): 2.2X2.2

The small pixel size allows for high resolution images with fine details.

Maximum Supply Voltage: 1.9 V

The low maximum supply voltage helps in reducing power consumption and heat generation.

Master Clock: 27 MHz

The high master clock frequency enables fast data processing and image capture.

Body Width: 6.253 inch

The compact body width makes it suitable for integration into various devices without taking up much space.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

Being a CMOS image sensor ensures low noise and high sensitivity for accurate image reproduction.

Minimum Operating Temperature: -30 °C

The wide operating temperature range allows for use in various environmental conditions.

Dynamic Range: 69.5 dB

The high dynamic range enables capturing both bright and dark areas in the same image without losing details.

Frame Rate: 60 fps

The high frame rate ensures smooth and fast image capture, ideal for applications requiring real-time imaging.

Technical Specifications

Image Sensors AR0330CM1C12SHKA0-CP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.7-2.9V

Array Type:

FRAME

Body Width:

6.253 inch

Body Height:

.745 mm

Body Length/Diameter:

6.623 mm

Dynamic Range:

69.5 dB

Frame Rate:

60 fps

Horizontal Pixel:

2304

Housing:

PLASTIC

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

137 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

2.2X2.2

Sensitivity (V/lx.s):

2 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

TIN SILVER COPPER

Termination Type:

SOLDER

Vertical Pixel:

1296

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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