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KAI-16000-AXA-JD-BX

Onsemi

KAI-16000-AXA-JD-BX by Onsemi

KAI-16000-AXA-JD-BX by Onsemi is an image sensor with 7.4x7.4 um pixel size, 65 dB dynamic range, and 4872 horizontal pixels. It operates b/w -50 to 70 °C and has a data rate of 30 Mbps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,342 parts In-Stock

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Vyrian

USA . 1,674 parts In-Stock

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Problanco Electronics

Mexico . 7,191 parts In-Stock

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SupplyDigital Components

Austria . 6,776 parts In-Stock

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Kulean Microsystems

USA . 5,877 parts In-Stock

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Corphita

USA . 1,537 parts In-Stock

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TANS Electronics

Latvia . 838 parts In-Stock

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UHIMA Technologies

Türkiye . 191 parts In-Stock

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Corohmni

South Africa . 107 parts In-Stock

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Overview

Capture every detail with the KAI-16000-AXA-JD-BX image sensor by Onsemi. As a leader in the industry, Onsemi ensures top-notch quality and reliability in all their products. This powerful image sensor is perfect for a variety of applications, from industrial automation to medical imaging. With its high performance and advanced features, this sensor provides unparalleled value to customers looking to take their projects to the next level. Trust Onsemi to deliver cutting-edge technology that will exceed your expectations.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Higher pixel size allows for more light to be captured, resulting in better image quality and low noise images.

Maximum Supply Voltage: 15.5 V

Higher supply voltage ensures stable and consistent performance under varying conditions.

Body Width: 44.45 inch

Compact size makes it suitable for integration into various devices and systems.

Power Supplies (V): 15

Optimal power supply voltage for efficient performance and energy consumption.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensors provide high-quality images with accurate color reproduction and low noise levels.

Body Height: 4.88 mm

Low profile design allows for easy integration and installation in tight spaces.

Package Shape or Style: RECTANGULAR

Rectangular shape provides versatility in mounting and placement options.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage ensures power efficiency and reliability.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for use in various environmental conditions.

Horizontal Pixel: 4872

High pixel count provides detailed and sharp images with high resolution.

Minimum Operating Temperature: -50 °C

Low operating temperature allows for use in extreme cold conditions without compromising performance.

Dynamic Range: 65 dB

Wide dynamic range ensures accurate representation of both dark and bright areas in the image.

Vertical Pixel: 3248

High vertical pixel count enhances the image quality and allows for detailed capturing of scenes.

Body Length/Diameter: 45.34 mm

Compact and portable design for easy integration into various systems and devices.

Optical Format (inch): 4/2.9

Optical format compatible with various lenses and optical systems for versatile application.

Data Rate: 30 Mbps

High data rate allows for fast and efficient image capture and transmission.

Termination Type: SOLDER

Solder termination ensures secure and reliable connection for long-term use.

Array Type: INTERLINE

Interline array design allows for faster readout and improved performance in high-speed imaging applications.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting for secure and stable installation in various devices and systems.

Technical Specifications

Image Sensors KAI-16000-AXA-JD-BX attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 30 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

44.45 inch

Body Height:

4.88 mm

Body Length/Diameter:

45.34 mm

Data Rate:

30 Mbps

Dynamic Range:

65 dB

Horizontal Pixel:

4872

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

4/2.9

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

3248

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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