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AR1335CSSC32SMD20

Onsemi

AR1335CSSC32SMD20 by Onsemi

The Onsemi AR1335CSSC32SMD20 is a 1/3.2 inch CMOS image sensor with a pixel size of 1.1um. It operates at a max supply voltage of 1.3V and has a master clock of 48 MHz. This sensor is commonly used in applications that require high-resolution imaging with a frame rate of up to 30 fps.

Median Price

$4.270

Lifecycle Status

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1k+

AR1335CSSC32SMD20 by Onsemi
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Flip Electronics (Authorized)

USA . 76,616 parts In-Stock

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Vyrian

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Ampacity Inc.

Singapore . 76,159 parts In-Stock

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Lixinc

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Continental Prestige Electronics

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Overview

Capture the world in stunning detail with the AR1335CSSC32SMD20 by Onsemi. As a leader in image sensor technology, Onsemi brings unparalleled quality and reliability to every product. The AR1335CSSC32SMD20 is no exception. Designed for exceptional performance, this image sensor boasts a pixel size of 1.1um and a dynamic range of 69dB, ensuring crystal-clear images even in challenging lighting conditions. With its full-frame array type and 30fps frame rate, this sensor is perfect for applications such as surveillance cameras, automotive vision systems, and industrial inspections. Experience the value and benefits this cutting-edge sensor offers and unlock endless possibilities in imaging technology.

Feature Benefit Bullets

Pixel Size (um): 1.1

A smaller pixel size allows for higher resolution images to be captured, making this product ideal for high-quality imaging applications.

Maximum Supply Voltage: 1.3 V

The low maximum supply voltage ensures that the sensor operates efficiently and with minimal power consumption, making it suitable for portable devices.

Master Clock: 48 MHz

The high master clock frequency enables fast data processing and transmission, leading to real-time image capturing and processing capabilities.

Output Type: DIGITAL VOLTAGE

The digital voltage output simplifies interfacing with other digital systems, enhancing compatibility and ease of integration within different setups.

Dynamic Range: 69 dB

A high dynamic range allows for capturing a wide range of light intensities in a single image, ensuring detailed and accurate representation of the scene.

Technical Specifications

Image Sensors AR1335CSSC32SMD20 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FULL FRAME

Dynamic Range:

69 dB

Frame Rate:

30 fps

Horizontal Pixel:

4208

Master Clock:

48 MHz

Maximum Operating Current:

130 mA

Optical Format (inch):

1/3.2

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Pixel Size (um):

1.1

Sensors or Transducers Type:

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.14 V

Vertical Pixel:

3120

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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