Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
The Onsemi KAF-8300-AXC-CD-AA is a CCD image sensor with 5.4X5.4 um pixel size, offering a dynamic range of 64.4 dB and 3326 horizontal pixels. It operates b/w -10 to 70 °C, with a data rate of 28 Mbps, making it ideal for high-resolution imaging applications in various industries.
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Smaller pixel size allows for higher resolution and sharper image quality.
Allows for higher voltage input which can result in better performance and signal quality.
Larger body width may indicate better durability and stability in the product design.
The use of CCD sensors ensures high-quality image capture and low noise levels.
Compact body height enables easy integration into various devices and applications.
Rectangular package shape provides efficient use of space and easier mounting options.
Lower minimum supply voltage can result in energy efficiency and better power management.
High maximum operating temperature ensures reliable performance even in harsh conditions.
Higher number of horizontal pixels means better image resolution and detail.
Analog voltage output allows for seamless integration with other analog systems and components.
Wide range of operating temperatures ensures functionality in both hot and cold environments.
Ceramic housing provides durability and protection for the sensitive sensor components.
High dynamic range allows for capturing a wide range of light intensities for balanced images.
Higher number of vertical pixels enhances image resolution and clarity.
Compact body length/diameter allows for versatile mounting options and easy integration.
High data rate ensures fast and efficient transfer of image data for real-time applications.
Solder termination provides secure and reliable connection for long-lasting performance.
Full-frame array type captures a larger image area for comprehensive image capture.
Through-hole mounting feature allows for secure and stable attachment to PCBs or other surfaces.
Image Sensors KAF-8300-AXC-CD-AA attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Data Rate:
Dynamic Range:
Horizontal Pixel:
Housing:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
LM358N
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM358AN
LM107H/883C
National Semiconductor
LM107H/883C by National Semiconductor is a MILITARY-grade Operational Amplifier with +-5/+-15V supplies. Featuring 2000uV max input offset voltage, it operates from -55 to 125 °C. Ideal for applications requiring VOLTAGE-FEEDBACK architecture and frequency compensation.
MMBT3906LT1G
Onsemi
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
1N4148WT
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Weitron Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb);
SMBJ18CA
Fagor Electronica S Coop
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Non Repetitive Peak Forward Current: 40 A; Technology: SCHOTTKY; No. of Elements: 1;
2N7002
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Maximum Drain Current (ID): .34 A;
1N4148WS
Synsemi
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; JESD-609 Code: e0; Terminal Position: SINGLE; Adjustability: ADJUSTABLE; Maximum Load Regulation (%): 1.5 %;
MMBT2907ALT1G
MMBT2907ALT1G by Onsemi is a PNP BJT transistor with 100 min hFE, 60V VCEO, and 200MHz fT. Ideal for switching applications, it has a small outline package with Gull Wing terminals and can handle up to 0.6A of collector current.
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
BAV99
Electronic Devices
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Kec
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Output Current-1: 1.5 A; No. of Outputs: 1; Qualification Status: Not Qualified;
Toshiba
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
AR0135AT2M25XUEA0-DPBR
Onsemi's AR0135AT2M25XUEA0-DPBR is a 1/3 inch CMOS image sensor with 3.75x3.75 um pixel size, offering 54 fps frame rate for high-speed imaging applications. Its square package shape and surface mounting feature make it ideal for compact camera designs in various industries.
MT9V024IA7XTM
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Dynamic Range: 100 dB; Vertical Pixel: 480; Minimum Operating Temperature: -40 Cel;
KAF-3200-AAA-CB-B1
Image Sensors;
AR0140AT2C00XUEA0-TPBR
Onsemi's AR0140AT2C00XUEA0-TPBR is a 1/4 inch CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 96 dB dynamic range. Ideal for applications requiring high-quality digital imaging in automotive cameras, surveillance systems, and drones at temperatures ranging from -40 to 105 °C.
KAF-0402-ABA-CD-B1
Onsemi's KAF-0402-ABA-CD-B1 is a CCD image sensor with 9x9 um pixel size, offering 768 horizontal and 512 vertical pixels. It operates at a supply voltage range of 14.75V to 15.5V, providing a dynamic range of 76 dB. Ideal for applications requiring high-resolution imaging with a data rate of up to 10 Mbps.
TSL1401
Ams-taos Usa
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.60-2.40V; Horizontal Pixel: 128;
NOIX2SN9400B-LTI1
NOIX2SN9400B-LTI1 by Onsemi is an Image Sensor with 3.2X3.2 um pixel size, 32.4 MHz master clock, and 3072 horizontal pixels. It operates b/w -40 to 85 °C and outputs digital voltage via I2C/SPI interface. Ideal for applications requiring high-resolution imaging at a fast frame rate like surveillance systems or industrial cameras.
AR0220AT4R00XUEA1-DPBM
Onsemi's AR0220AT4R00XUEA1-DPBM is a 1/1.8 inch CMOS image sensor with 1828x948 pixels, offering digital output via a 2-wire interface at 60 fps. Ideal for surface mount applications in frame arrays, this sensor provides high-quality imaging solutions in compact devices.
NOIM2SM9600A-QDC
NOIM2SM9600A-QDC by Onsemi is a 3840x2500 CMOS image sensor with 2.4x2.4 um pixel size, ideal for high-resolution imaging applications. It operates at 1.6-2V, with a master clock of 62 MHz and offers a dynamic range of 54 dB. The sensor has an SPI interface, supports up to 62 Mbps data rate, and can achieve a frame rate of 20 fps in a compact square package suitable for surface mounting.
AR0330CM1C12SHAA0-DP1
The Onsemi AR0330CM1C12SHAA0-DP1 is a 2.2x2.2 um CMOS image sensor with 2304 horizontal pixels and 1536 vertical pixels. It operates at a max supply voltage of 1.9V, has a master clock of 27 MHz, and offers a dynamic range of 69.5 dB. Ideal for applications requiring high-resolution imaging with digital output interface and surface mounting feature at temperatures ranging from -30 to 70 °C.
KAE-04471-FBA-SP-EE
KAE-04471-FBA-SP-EE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 2096 horizontal and vertical pixels, and a dynamic range of 72 dB. It operates b/w -30 to 40 °C, has a max supply voltage of 15.3 V, and outputs voltage data at a rate of 40 Mbps. Ideal for applications requiring high-quality imaging in various lighting conditions.
MT9M001C12STM-TP
Onsemi's MT9M001C12STM-TP is a 1/2 inch CMOS image sensor with 1280x1024 resolution, offering a pixel size of 5.2um. Operating at up to 70°C, it has a max supply voltage of 3.6V and supports a master clock of 48MHz. Ideal for applications requiring high-resolution imaging in compact devices.
KAF-16801-AAA-DP-AE
The Onsemi KAF-16801-AAA-DP-AE is a square image sensor with 4096x4096 pixels, offering a pixel size of 9x9 µm and a dynamic range of 76 dB. It operates b/w -60 to 60 °C, suitable for high-resolution imaging applications requiring precise color capture and low light sensitivity. The sensor features a full-frame array design and can achieve data rates up to 10 Mbps, making it ideal for professional digital photography and scientific imaging projects.
AR0134CSSC00SUEA0-TPBR
Onsemi's AR0134CSSC00SUEA0-TPBR is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 64dB dynamic range. It operates at -30 to 70 °C, with a max supply voltage of 1.95V and a data rate of 700Mbps. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
KAI-11002-AAA-CR-B2
Onsemi's KAI-11002-AAA-CR-B2 is a 9x9 um pixel size CCD image sensor with 4008 horizontal and 2672 vertical pixels. It operates at a supply voltage range of 14.5V to 15.5V, offering an analog voltage output type and a dynamic range of 28 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-11002-CBA-CD-AE
KAI-11002-CBA-CD-AE by Onsemi is an image sensor with 9x9 um pixel size, 4008 horizontal pixels, and 2672 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 66 dB. Ideal for digital imaging applications requiring high-resolution and low-light performance.
KAE-02152-FBB-SD-FA
The Onsemi KAE-02152-FBB-SD-FA is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 86dB dynamic range. It operates b/w -40 °C to +40°C and features current output. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
MT9V0221A7ATC
The Onsemi MT9V0221A7ATC is a CMOS image sensor with 6x6 um pixel size, 752H x 480V resolution, and 26.6 MHz master clock. It operates at -40 to 85 °C, has a dynamic range of 54.4 dB, and outputs in the range of 0.30-2.60V. Ideal for applications requiring high-quality imaging at a frame rate of up to 60 fps such as surveillance cameras or industrial machine vision systems.
MT9V032C12STM-DP
Onsemi's MT9V032C12STM-DP is a 1/3-inch CMOS image sensor with 6x6 um pixel size. It operates at 26.6 MHz master clock, offering 752 (H) x 480 (V) resolution for applications requiring high-quality digital imaging at up to 60 fps frame rate. Ideal for surface mounting in devices needing -30 to 70 °C temperature range and a dynamic range of 54.4 dB.
ASX340CS2C00SPED0-DRBR
ASX340CS2C00SPED0-DRBR by Onsemi is a 5.6x5.6 um CMOS image sensor with 728H x 560V pixels, offering a dynamic range of 74.8 dB and sensitivity of 16.5 V/lx.s. It operates at temperatures from -30 to 70 °C, with a max supply voltage of 1.95V and output range of 0.40-2.50V, suitable for frame array applications in various industries like automotive and surveillance systems due to its high performance capabilities.
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KAF-8300-AXC-CP-AA
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Pixel Size (um): 5.4X5.4;
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 23 MICRO V/ELECTRON; Maximum Operating Temperature: 70 Cel;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -10 Cel; Body Length/Diameter: 29.21 mm;
KAF-8300-AXC-CD-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 23 MICRO V/ELECTRON; Minimum Operating Temperature: -10 Cel;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 23 MICRO V/ELECTRON; Housing: CERAMIC;
KAF-8300-AAB-CB-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 14.5 V; Horizontal Pixel: 3326;
KAF-8300-AAB-CB-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Vertical Pixel: 2504; Termination Type: SOLDER;
KAF-8300-AXC-CB-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 14.5 V; Data Rate: 28 Mbps;
KAF-8300-AXC-CB-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Array Type: FULL FRAME;
KAF-8300-AXC-CD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Body Width: 20.32 inch;
KAF-8300-AXC-CP-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 70 Cel; Dynamic Range: 64.4 dB;
KAF-8300CE
KAF-8300-CXB-CB-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 64.4 dB; Maximum Operating Temperature: 60 Cel; Pixel Size (um): 5.4X5.4;
KAF-8300-CXB-CB-AA-OFFSET
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 14.5 V; Body Length/Diameter: 29.21 mm;
KAF-8300-CXB-CB-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 14.5 V; Body Length/Diameter: 29.21 mm; Termination Type: SOLDER;
KAF-8300-CXB-CB-AE-OFFSET
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Maximum Operating Temperature: 70 Cel;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Vertical Pixel: 2504; Maximum Supply Voltage: 15.5 V;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Data Rate: 28 Mbps; Minimum Operating Temperature: -10 Cel;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 70 Cel; Data Rate: 28 Mbps;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 3326; Maximum Supply Voltage: 15.5 V;
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