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KAF-8300-CXB-CB-AE

Onsemi

KAF-8300-CXB-CB-AE by Onsemi

The Onsemi KAF-8300-CXB-CB-AE is a CCD image sensor with 5.4x5.4 um pixel size, offering a dynamic range of 64.4 dB and 3448 (H) x 2574 (V) resolution. It operates b/w 0 to 60 °C, with data rate up to 28 Mbps, making it ideal for high-resolution imaging applications in various industries.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,845 parts In-Stock

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Digiode

USA . 526 parts In-Stock

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Problanco Electronics

Mexico . 7,649 parts In-Stock

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SupplyDigital Components

Austria . 7,406 parts In-Stock

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Kulean Microsystems

USA . 6,749 parts In-Stock

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TANS Electronics

Latvia . 3,073 parts In-Stock

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UHIMA Technologies

Türkiye . 858 parts In-Stock

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Corphita

USA . 477 parts In-Stock

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Corohmni

South Africa . 287 parts In-Stock

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Overview

Capture the beauty of every moment with the KAF-8300-CXB-CB-AE by Onsemi. As a leading manufacturer of image sensors, Onsemi brings unparalleled quality and innovation to the table. This cutting-edge sensor offers crystal-clear images with a dynamic range of 64.4 dB, making it perfect for a wide range of applications such as astronomy, microscopy, and industrial imaging. Elevate your projects with the value and benefits that only Onsemi can deliver. Choose the KAF-8300-CXB-CB-AE and see the world in a whole new light.

Feature Benefit Bullets

Pixel Size (um): 5.4X5.4

Small pixel size allows for precise imaging and sharp details in photos.

Maximum Supply Voltage: 15.5 V

Higher supply voltage ensures stable and reliable performance of the image sensor.

Body Width: 20.07 inch

Compact body width makes it easy to integrate the sensor into various devices and systems.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensor type provides high-quality images with accurate color reproduction.

Package Shape or Style: RECTANGULAR

Rectangular package shape provides easy mounting and integration capabilities.

Minimum Supply Voltage: 14.5 V

Low minimum supply voltage helps in minimizing power consumption and heat generation.

Maximum Operating Temperature: 60 °C

High maximum operating temperature allows for use in a wide range of environmental conditions.

Horizontal Pixel: 3448

High pixel count in the horizontal direction provides detailed and high-resolution images.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable performance even in cold environments.

Housing: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed housing provides durability and protection for the sensitive components.

Dynamic Range: 64.4 dB

Wide dynamic range allows for capturing a wide range of tones and details in images.

Vertical Pixel: 2574

High pixel count in the vertical direction ensures detailed and high-resolution images.

Body Length/Diameter: 29.21 mm

Compact body length/diameter makes the sensor suitable for small and compact devices.

Data Rate: 28 Mbps

High data rate ensures fast and smooth transmission of image data.

Termination Type: SOLDER

Solder termination provides a secure and reliable connection for the sensor.

Array Type: FULL FRAME

Full-frame array type ensures maximum image coverage without any cropping or loss of details.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting feature provides secure and stable mounting of the sensor on printed circuit boards.

Technical Specifications

Image Sensors KAF-8300-CXB-CB-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FULL FRAME

Body Width:

20.07 inch

Body Length/Diameter:

29.21 mm

Data Rate:

28 Mbps

Dynamic Range:

64.4 dB

Horizontal Pixel:

3448

Housing:

CERAMIC, GLASS-SEALED

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Package Shape or Style:

Pixel Size (um):

5.4X5.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

2574

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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