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KAF-8300-CXB-CB-AA-OFFSET

Onsemi

KAF-8300-CXB-CB-AA-OFFSET by Onsemi

The Onsemi KAF-8300-CXB-CB-AA-OFFSET is a CCD image sensor with 5.4x5.4 um pixel size, offering a dynamic range of 64.4 dB and 3326 horizontal pixels. It operates b/w -10 to 70 °C, with a data rate of 28 Mbps, making it ideal for high-resolution imaging applications in various industries.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Cyclops Electronics Ltd

UK . 24,836 parts In-Stock

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Vyrian

USA . 2,251 parts In-Stock

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Digiode

USA . 213 parts In-Stock

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TANS Electronics

Latvia . 6,403 parts In-Stock

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Problanco Electronics

Mexico . 3,145 parts In-Stock

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Corphita

USA . 2,288 parts In-Stock

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Kulean Microsystems

USA . 1,873 parts In-Stock

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UHIMA Technologies

Türkiye . 714 parts In-Stock

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SupplyDigital Components

Austria . 540 parts In-Stock

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Corohmni

South Africa . 337 parts In-Stock

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Overview

Capture stunning images with the KAF-8300-CXB-CB-AA-OFFSET by Onsemi, a leading manufacturer of high-quality image sensors. Ideal for a variety of applications, this image sensor offers superior performance and reliability, ensuring crisp and clear images every time. With a wide range of features and benefits, including a high dynamic range and digital voltage output, this product provides exceptional value to customers looking for top-notch image quality. Experience the difference with the KAF-8300-CXB-CB-AA-OFFSET and elevate your imaging capabilities today.

Feature Benefit Bullets

Pixel Size (um): 5.4X5.4

Smaller pixel size allows for higher resolution imaging and better image quality.

Maximum Supply Voltage: 15.5 V

Higher supply voltage allows for better performance and signal integrity.

Body Width: 20.07 inch

Compact size makes it easy to integrate into various devices or systems.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors provide high-quality image capture with low noise and excellent color reproduction.

Package Shape or Style: RECTANGULAR

Rectangular shape allows for efficient placement and mounting within systems or devices.

Minimum Supply Voltage: 14.5 V

The minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

High operating temperature range allows for reliable performance in various environments.

Horizontal Pixel: 3326

High horizontal pixel count enables detailed and sharp image capture.

Output Type: DIGITAL VOLTAGE

Digital output simplifies data processing and integration with digital systems.

Minimum Operating Temperature: -10 °C

Wide operating temperature range ensures functionality in harsh or extreme conditions.

Housing: CERAMIC

Ceramic housing provides durability and protection for the sensor components.

Dynamic Range: 64.4 dB

High dynamic range allows for capturing both bright and dark areas in a scene with detail.

Vertical Pixel: 2504

Vertical pixel count contributes to the overall resolution and image quality.

Body Length/Diameter: 29.21 mm

Compact body size makes it suitable for integration into small devices or systems.

Data Rate: 28 Mbps

Fast data rate enables real-time image capture and transmission.

Termination Type: SOLDER

Solder termination ensures secure and reliable connections for data transfer.

Array Type: FULL FRAME

Full frame array offers maximum image capturing capability without cropping or distortion.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting provides secure and stable placement within a device or system.

Technical Specifications

Image Sensors KAF-8300-CXB-CB-AA-OFFSET attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 23 MICRO VOLT PER ELECTRON

Array Type:

FULL FRAME

Body Width:

20.07 inch

Body Length/Diameter:

29.21 mm

Data Rate:

28 Mbps

Dynamic Range:

64.4 dB

Horizontal Pixel:

3326

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Output Type:

Package Shape or Style:

Pixel Size (um):

5.4X5.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

2504

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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