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MT9P014D00STCMC28CC1

Onsemi

MT9P014D00STCMC28CC1 by Onsemi

MT9P014D00STCMC28CC1 by Onsemi is a 2.2x2.2 um CMOS image sensor with 2592x1944 resolution, 70 fps frame rate, and 69 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor, such as surveillance cameras and industrial machine vision systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

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1k+

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Digiode

USA . 1,396 parts In-Stock

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Vyrian

USA . 411 parts In-Stock

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Problanco Electronics

Mexico . 5,681 parts In-Stock

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Kulean Microsystems

USA . 5,649 parts In-Stock

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SupplyDigital Components

Austria . 2,965 parts In-Stock

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TANS Electronics

Latvia . 1,266 parts In-Stock

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UHIMA Technologies

Türkiye . 221 parts In-Stock

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Corphita

USA . 208 parts In-Stock

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Corohmni

South Africa . 52 parts In-Stock

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Overview

Capture vivid and detailed images with the MT9P014D00STCMC28CC1 by Onsemi, a cutting-edge image sensor designed to deliver unparalleled quality and reliability. Manufactured by industry leader Onsemi, this sensor is ideal for a wide range of applications in areas such as surveillance, automotive, and industrial imaging. With its advanced features and high performance capabilities, this sensor provides customers with exceptional value and benefits, making it the perfect choice for all your imaging needs.

Feature Benefit Bullets

Pixel Size (um): 2.2X2.2

Smaller pixel size allows for higher resolution and better image quality.

Maximum Supply Voltage: 1.9 V

Low supply voltage helps in reducing power consumption and heat generation.

Master Clock: 27 MHz

High master clock frequency enables fast data processing and high frame rates.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS sensor type provides high sensitivity and low noise for improved image quality.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage ensures efficient power usage and extends battery life.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for usage in various environmental conditions.

Horizontal Pixel: 2592

High horizontal pixel count results in detailed and sharp images.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature ensures reliable performance even in cold environments.

Dynamic Range: 69 dB

High dynamic range enables the sensor to capture a wide range of light intensities accurately.

Vertical Pixel: 1944

High vertical pixel count complements the horizontal resolution for well-balanced images.

Optical Format (inch): 1/2.5

The optical format represents the sensor size, which is ideal for compact camera designs.

Output Interface Type: 2-WIRE INTERFACE

Simple two-wire interface for easy connectivity and data transfer.

Frame Rate: 70 fps

High frame rate allows for smooth video recording and fast image capture.

Array Type: FRAME

Frame array type is suitable for capturing static images with high resolution.

Sensitivity (V/lx.s): 1.17 V/lx.s

High sensitivity enables the sensor to produce quality images even in low light conditions.

Mounting Feature: SURFACE MOUNT

Surface mount option for easy and secure installation in electronic devices.

Technical Specifications

Image Sensors MT9P014D00STCMC28CC1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER; IT ALSO OPERATES AT 2.8 V NOMINAL ANALOG SUPPLY VOLTAGE

Array Type:

FRAME

Dynamic Range:

69 dB

Frame Rate:

70 fps

Horizontal Pixel:

2592

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/2.5

Output Interface Type:

2-WIRE INTERFACE

Pixel Size (um):

2.2X2.2

Sensitivity (V/lx.s):

1.17 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Vertical Pixel:

1944

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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