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MT9P031I12STC-DR

Onsemi

MT9P031I12STC-DR by Onsemi

MT9P031I12STC-DR by Onsemi is a 2.2x2.2 um CMOS image sensor with 2592H x 1944V pixels, offering a dynamic range of 70.1 dB and operating at temperatures from -30 to 70°C. It features a digital voltage output interface, operates at supply voltages b/w 1.7-1.9V, and has a max frame rate of 14 fps, making it ideal for applications requiring high-quality imaging in various environments.

Median Price

$21.670

Lifecycle Status

Suppliers In-Stock

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1k+

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DigiKey

USA . 21,827 parts In-Stock

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Nova Conductors

Japan . 20 parts In-Stock

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$29.040

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Vyrian

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Chip Stock

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Digiode

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Sensible Micro Corp

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Cyclops Electronics Ltd

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Aztec Data Supply Inc.

USA . 333 parts In-Stock

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$2.070

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Ampacity Inc.

Singapore . 16,691 parts In-Stock

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$18.420

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Semicontronic

India . 16,448 parts In-Stock

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$18.420

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$17.960

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$17.867

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Continental Prestige Electronics

USA . 4,606 parts In-Stock

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$18.480

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Corohmni

South Africa . 373 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$28.459

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Lixinc

USA . 11,548 parts In-Stock

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Perfect Parts

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Kulean Microsystems

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Authorized Procurement Solutions

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Futuretech Components

Singapore . 4,800 parts In-Stock

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S.R.D Solutions

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Problanco Electronics

Mexico . 3,810 parts In-Stock

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GreenTree Electronics

Israel . 2,264 parts In-Stock

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TANS Electronics

Latvia . 1,945 parts In-Stock

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Argo Parts USA

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Corphita

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SupplyDigital Components

Austria . 514 parts In-Stock

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UHIMA Technologies

Türkiye . 404 parts In-Stock

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Overview

Capture the beauty of the world in stunning detail with the MT9P031I12STC-DR image sensor by Onsemi. Crafted with precision and expertise, this cutting-edge technology offers unparalleled quality and performance. From capturing vibrant landscapes to crystal-clear portraits, this sensor delivers exceptional results. Experience the value and benefits of superior imaging capabilities, making it the perfect choice for a wide range of applications. Elevate your projects with the MT9P031I12STC-DR and see the world in a whole new light.

Feature Benefit Bullets

Pixel Size (um): 2.2X2.2

The small pixel size allows for high resolution image capture, resulting in clearer and more detailed images.

Maximum Supply Voltage: 1.9 V

Low maximum supply voltage helps in minimizing power consumption and reducing heat generation, making the product energy-efficient.

Master Clock: 96 MHz

High master clock speed enables fast data processing and image capture, resulting in smooth operation and quick response times.

Body Width: 10 inch

Compact body width makes the product suitable for applications where space is limited, allowing for easy integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption, high integration capabilities, and excellent image quality, making them a popular choice for various imaging applications.

Body Height: 1.25 mm

Low body height helps in ensuring a slim profile for the product, making it ideal for applications where thickness is a concern.

Package Shape or Style: SQUARE

Square package shape offers ease of handling and mounting, ensuring efficient production processes and secure placement within devices.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage allows for flexible power options and can help extend battery life in portable devices.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in demanding environmental conditions, making the product suitable for a wide range of applications.

Horizontal Pixel: 2592

High horizontal pixel count contributes to producing detailed and high-resolution images, making the product ideal for applications where image quality is crucial.

Output Range: 0.60-2.30V

Wide output range allows for capturing a broad range of light intensities, ensuring accurate representation of images with varying levels of brightness.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies the interface with other digital systems, enabling easy integration into various devices and enhancing compatibility.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature ensures the product can function reliably in cold environments, expanding its suitability for outdoor and challenging conditions.

Maximum Operating Current: 35 mA

Low maximum operating current helps in conserving power and reducing energy consumption, making the product cost-effective and efficient.

Dynamic Range: 70.1 dB

High dynamic range allows the sensor to capture a wide range of light intensities accurately, resulting in detailed images with enhanced contrast and vivid colors.

Vertical Pixel: 1944

High vertical pixel count contributes to producing sharp and detailed images, especially in the vertical direction, enhancing overall image quality.

Body Length/Diameter: 10 mm

Compact body length or diameter makes the product easy to handle and install, suitable for applications where space is limited.

Optical Format (inch): 1/2.5

Common optical format ensures compatibility with a wide range of lenses and optical systems, making the product versatile and adaptable to different imaging setups.

Termination Type: SOLDER

Solder termination provides a reliable and secure connection, ensuring stable electrical contact and preventing signal loss, contributing to overall product reliability.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface offers a simple and efficient way to communicate with external systems, enabling easy integration and control of the sensor within various devices.

Frame Rate: 14 fps

Decent frame rate allows for capturing smooth and fluid motion in video recordings, making the product suitable for applications requiring real-time imaging and video performance.

Array Type: FRAME

Frame array type provides organized and structured image capture, ensuring consistent image quality and reliable operation for a wide range of applications.

Mounting Feature: SURFACE MOUNT

Surface mount capability simplifies the installation process and allows for secure attachment to PCBs or other surfaces, ensuring efficient and reliable integration of the product.

Technical Specifications

Image Sensors MT9P031I12STC-DR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, GLOBAL RESET RELEASE, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.6-3.1V

Array Type:

FRAME

Body Width:

10 inch

Body Height:

1.25 mm

Body Length/Diameter:

10 mm

Dynamic Range:

70.1 dB

Frame Rate:

14 fps

Horizontal Pixel:

2592

Master Clock:

96 MHz

Mounting Feature:

Maximum Operating Current:

35 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/2.5

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

2.2X2.2

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

1944

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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