Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MT9P031I12STC-DR by Onsemi is a 2.2x2.2 um CMOS image sensor with 2592H x 1944V pixels, offering a dynamic range of 70.1 dB and operating at temperatures from -30 to 70°C. It features a digital voltage output interface, operates at supply voltages b/w 1.7-1.9V, and has a max frame rate of 14 fps, making it ideal for applications requiring high-quality imaging in various environments.
Median Price
$22.000
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The small pixel size allows for high resolution image capture, resulting in clearer and more detailed images.
Low maximum supply voltage helps in minimizing power consumption and reducing heat generation, making the product energy-efficient.
High master clock speed enables fast data processing and image capture, resulting in smooth operation and quick response times.
Compact body width makes the product suitable for applications where space is limited, allowing for easy integration into various devices.
CMOS image sensors are known for their low power consumption, high integration capabilities, and excellent image quality, making them a popular choice for various imaging applications.
Low body height helps in ensuring a slim profile for the product, making it ideal for applications where thickness is a concern.
Square package shape offers ease of handling and mounting, ensuring efficient production processes and secure placement within devices.
Low minimum supply voltage allows for flexible power options and can help extend battery life in portable devices.
High maximum operating temperature ensures reliable performance even in demanding environmental conditions, making the product suitable for a wide range of applications.
High horizontal pixel count contributes to producing detailed and high-resolution images, making the product ideal for applications where image quality is crucial.
Wide output range allows for capturing a broad range of light intensities, ensuring accurate representation of images with varying levels of brightness.
Digital voltage output simplifies the interface with other digital systems, enabling easy integration into various devices and enhancing compatibility.
Low minimum operating temperature ensures the product can function reliably in cold environments, expanding its suitability for outdoor and challenging conditions.
Low maximum operating current helps in conserving power and reducing energy consumption, making the product cost-effective and efficient.
High dynamic range allows the sensor to capture a wide range of light intensities accurately, resulting in detailed images with enhanced contrast and vivid colors.
High vertical pixel count contributes to producing sharp and detailed images, especially in the vertical direction, enhancing overall image quality.
Compact body length or diameter makes the product easy to handle and install, suitable for applications where space is limited.
Common optical format ensures compatibility with a wide range of lenses and optical systems, making the product versatile and adaptable to different imaging setups.
Solder termination provides a reliable and secure connection, ensuring stable electrical contact and preventing signal loss, contributing to overall product reliability.
2-wire interface offers a simple and efficient way to communicate with external systems, enabling easy integration and control of the sensor within various devices.
Decent frame rate allows for capturing smooth and fluid motion in video recordings, making the product suitable for applications requiring real-time imaging and video performance.
Frame array type provides organized and structured image capture, ensuring consistent image quality and reliable operation for a wide range of applications.
Surface mount capability simplifies the installation process and allows for secure attachment to PCBs or other surfaces, ensuring efficient and reliable integration of the product.
Image Sensors MT9P031I12STC-DR attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Master Clock:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Output Range:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
PCN Obsolescence/ EOL - Mult Dev EOL 30/Sep/2022
PCN Design/Specification - Mult Dev 10/Feb/2023
PCN Assembly/Origin - AR013xCS/AR02x/ASX350/MT9P 30/Jun/2022
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
SMBJ18CA
Pro-an Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Polarity: BIDIRECTIONAL; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
LM358N
Motorola
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
First Components International
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; Config: SINGLE; No. of Elements: 1;
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
LM358M
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM317TG
Texas Instruments
LM317TG by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max output current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. The package style is flange mount, with a rectangular shape and through-hole terminals for easy installation.
MBRS1100T3G
Onsemi
MBRS1100T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.75V. It operates in temperatures ranging from -65 to 175°C, making it suitable for power applications. With a reverse test voltage of 100V, this diode is ideal for high-power circuits requiring efficient rectification.
06035C104KAT2A
KYOCERA AVX
06035C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
Hy Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRGCQ0805F10R
TE Connectivity
TE Connectivity's CRGCQ0805F10R is a 10 ohm fixed resistor with 1% tolerance and 400 ppm/°C temperature coefficient. It is a surface mount thick film resistor in an 0805 package, suitable for applications requiring precise resistance values in compact electronic circuits.
SMMBT2222ALT1G
SMMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, 0.6A IC, and 40V VCE. It has a hFE of 75, fT of 300MHz, and operates up to 150°C. Ideal for small signal applications in automotive electronics due to AEC-Q101 compliance.
2N7002
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
08055C104KAT2A
08055C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
LM107H
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
FDV303N
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
2N2222A
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
08055C104KAT4A
08055C104KAT4A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance, rated for 50V. With X7R temperature characteristics and -55 to 125 °C operating range, it's ideal for SMT applications requiring compact size and high reliability. The wraparound terminals and multi-layer design make it suitable for various electronic circuits.
AR0221SR2C00SUEA0-DPBR1
Onsemi's AR0221SR2C00SUEA0-DPBR1 is a 1928x1088 CMOS image sensor with 1/1.7" optical format, offering 60 fps frame rate. Ideal for surface mount applications, it features a 2-wire interface and solder termination type.
KAI-02150-AAA-JP-AE
Onsemi's KAI-02150-AAA-JP-AE is a 5.5X5.5 um CCD image sensor with 1920x1080 resolution, 64 dB dynamic range, and 2/3 inch optical format. It operates b/w -50 to 70 °C, with supply voltage ranging from 14.5V to 15.5V. Ideal for high-quality imaging applications requiring precise color reproduction and low-light performance.
MT9V022IA7ATM
MT9V022IA7ATM by Onsemi features 6x6 um pixel size, 26.6 MHz master clock, and 752 horizontal pixels. Ideal for image sensing applications with a frame rate of 60 fps and an optical format of 1/3 inch.
KAI-08670-AXA-JD-B1
Onsemi's KAI-08670-AXA-JD-B1 image sensor features 7.4x7.4 um pixel size, 40 MHz master clock, and 3600 horizontal pixels. Ideal for applications requiring high-quality imaging with a max supply voltage of 15.5 V and operating temperature range from -50 to 70 °C.
MT9P031I12STC
The Onsemi MT9P031I12STC image sensor features 2.2x2.2 um pixel size, 96 MHz master clock, and 2592 horizontal pixels. Ideal for applications requiring a digital voltage output interface, such as surveillance cameras and industrial imaging systems.
CYIL1SC4000AA-GDC
CYIL1SC4000AA-GDC by Onsemi is an image sensor with 2048x2048 pixels, 12x12 um pixel size, and a max supply voltage of 2.75V. Ideal for applications requiring high-resolution imaging at a frame rate of 15 fps, such as surveillance systems or industrial cameras.
AR0135CS2C19SUEA0-DPBR1
The Onsemi AR0135CS2C19SUEA0-DPBR1 is a 1/3 inch CMOS image sensor with a square package. It features tin/silver/copper terminal finish, suitable for surface mount applications. With dimensions of 9mm x 9mm x 1.55mm, it is ideal for frame array imaging in various devices.
KAI-0340-AAA-CP-AE-DUAL
The Onsemi KAI-0340-AAA-CP-AE-DUAL is a 640x480 CCD image sensor with 7.4um pixel size, offering a dynamic range of 69dB. It operates b/w -50 to 70 °C, suitable for industrial imaging applications requiring high-quality images in varying conditions. The rectangular package style and through-hole mounting feature make it easy to integrate into systems.
AR0132AT6C00XPEA0-DPBR1
Onsemi's AR0132AT6C00XPEA0-DPBR1 image sensor features 3.75um pixel size, 50MHz master clock, and 115dB dynamic range. Ideal for applications requiring high-resolution imaging with a frame rate of 60fps in a compact square package.
KAF-09000-ABA-DP-AA
Image Sensors;
AR0237ATSC00SUEA0-DR
Onsemi's AR0237ATSC00SUEA0-DR is a 3x3 um CMOS image sensor with 1928H x 1088V pixels, offering a dynamic range of 96 dB. Operating at -30 to 105 °C, it has a max supply voltage of 1.95 V and outputs digital voltage from 0.40-1.50V. Ideal for applications requiring high-resolution imaging at up to 60 fps in a compact square package shape for surface mounting.
AR1820HSSC12SHEA0-DP1
Onsemi's AR1820HSSC12SHEA0-DP1 is a 1/2.3" CMOS image sensor with 1.25um pixel size, offering 24fps frame rate. It features Tin/Silver/Copper terminal finish and is ideal for applications requiring high-quality imaging in consumer electronics and industrial devices.
MT9V024IA7XTM
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Dynamic Range: 100 dB; Vertical Pixel: 480; Minimum Operating Temperature: -40 Cel;
KAI-0340-FBA-CB-AA-D
IMAGE SENSOR,CCD;
OV10635-N29Y-PB
Omnivision Technologies
Image Sensors; Screening Level: AEC-Q100;
NOIP1SN2000A-QDI
NOIP1SN2000A-QDI by Onsemi is a 1920x1200 CMOS image sensor with 4.8um pixel size, 360MHz master clock, and 60dB dynamic range. Ideal for high-speed imaging applications requiring a frame rate of up to 230fps.
KAI-4021-AAA-CR-BA
The Onsemi KAI-4021-AAA-CR-BA is a 2048x2048 CCD image sensor with 7.4um pixel size, offering a dynamic range of 60dB. It operates b/w -50 °C to 70°C and has a data rate of 40Mbps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
TCD1208AP
Toshiba
Toshiba TCD1208AP is a 2160-pixel linear CCD image sensor with 14x14 um pixel size. Operating at 4.7-5.3V, it offers an output range of 3-4.50V and sensitivity of 110 V/lx.s. Ideal for applications requiring high-resolution imaging in industrial automation and scientific instrumentation due to its ceramic glass-sealed housing and through-hole mounting feature.
KAI-29050-AXA-JR-B1
KAI-29050-AXA-JR-B1 by Onsemi is an image sensor with 5.5X5.5 um pixel size, 15.5 V max supply voltage, and 6576 horizontal pixels. It is ideal for applications requiring a dynamic range of 64 dB, such as industrial machine vision systems or surveillance cameras.
CMV4000-3E5M1PP
Ams Ag
CMV4000-3E5M1PP by Ams Ag is an IMAGE SENSOR with a 60 dB dynamic range and 37 fps frame rate. It operates b/w -30°C to 70°C, featuring SPI INTERFACE output and THROUGH HOLE MOUNT for easy installation. Ideal for applications requiring high sensitivity at 5.56 V/lx.s, such as industrial imaging systems.
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MT9P031I12STM-DP1
MT9P031I12STM-DP1 by Onsemi is a 2.2x2.2 um CMOS image sensor with 2592x1944 pixels, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring high-resolution imaging at frame rates up to 14 fps in a compact square package suitable for surface mounting.
MT9P031I12STM-DP
Onsemi's MT9P031I12STM-DP is a 2.2x2.2um CMOS image sensor with 2592Hx1944V pixels, offering a dynamic range of 70.1dB and operating at temperatures from -30 to 70°C. It has a digital voltage output interface, operates on 1.7-1.9V supply voltage, and is suitable for frame array applications in various industries like surveillance and automotive systems.
MT9P031I12STC-DP
MT9P031I12STC-DP by Onsemi is an image sensor with 2.2x2.2 um pixel size, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring a square CMOS image sensor with a digital voltage output interface and frame array type at temperatures ranging from -30 to 70 °C.
MT9P031I12STM-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.35-2.30V; Minimum Operating Temperature: -30 Cel;
MT9P031I12STC-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Master Clock: 96 MHz;
MT9P031I12STM
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Array Type: FULL FRAME;
MT9P031I12STM-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.16-1.82V; Horizontal Pixel: 2592;
MT9P031I12STC-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Pixel Size (um): 2.2X2.2;
MT9P031I12STM-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.35-2.30V; Horizontal Pixel: 2592;
Micron Technology
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Additional Features: ELECTRONIC ROLLING SHUTTER, GLOBAL RESET RELEASE, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.6-3.1V; Horizontal Pixel: 2592; Output Interface Type: 2-WIRE INTERFACE;
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Body Height: 1.25 mm;
MT9P001I12STC-B-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Output Range: 2.60-22.30mA; Maximum Operating Current: 35 mA; Pixel Size (um): 2.20X2.20;
MT9P006I12STCU-DP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.16-1.82V; Termination Type: SOLDER;
MT9P001I12-N4005-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Output Range: 2.60-22.30mA; Master Clock: 48 MHz; Array Type: FRAME;
MT9P011D00STC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: UNSPECIFIED; Maximum Supply Voltage: 1.9 V; Vertical Pixel: 1944;
MT9P031D00STMC18BC1-200
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Output Range: 0.35-2.30V; Array Type: FRAME; Maximum Supply Voltage: 1.9 V;
MT9P014D00STC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: UNSPECIFIED; Optical Format (inch): 1/2.5; Frame Rate: 15 fps;
MT9P006I12STCU
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.16-1.82V; Minimum Supply Voltage: 1.7 V;
MT9P031I12STCES
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.35-1.3V; Vertical Pixel: 1944;
Supply Digital Components
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12,000 In-Stock
Total price ≈ $80,197.29
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