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AR0134CSSM25SPCA0-TPBR

Onsemi

AR0134CSSM25SPCA0-TPBR by Onsemi

Onsemi's AR0134CSSM25SPCA0-TPBR is a 1/3-inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 64dB dynamic range. It operates at -30 to 70 °C, with a max supply voltage of 1.95V and a data rate of 700Mbps. Ideal for applications requiring high-resolution imaging in varying environmental conditions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,573 parts In-Stock

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Digiode

USA . 1,124 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 251 parts In-Stock

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$0.297

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$0.285

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Northwest PG Solutions

USA . 375 parts In-Stock

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$0.327

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$0.288

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AZTECH Wire

Italy . 788 parts In-Stock

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$9.520

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TANS Electronics

Latvia . 6,607 parts In-Stock

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SupplyDigital Components

Austria . 3,170 parts In-Stock

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Kulean Microsystems

USA . 2,965 parts In-Stock

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Problanco Electronics

Mexico . 1,499 parts In-Stock

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Corphita

USA . 384 parts In-Stock

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UHIMA Technologies

Türkiye . 309 parts In-Stock

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Corohmni

South Africa . 61 parts In-Stock

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Overview

Experience the pinnacle of imaging technology with the AR0134CSSM25SPCA0-TPBR by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in all their products. This image sensor is perfect for a wide range of applications, from automotive to surveillance systems. With its high performance and cutting-edge features, this product provides unparalleled value and benefits to customers. Upgrade your projects with the AR0134CSSM25SPCA0-TPBR and see the difference for yourself.

Feature Benefit Bullets

Pixel Size (um): 3.75

A smaller pixel size of 3.75um allows for higher resolution and better image quality in the captured images.

Maximum Supply Voltage: 1.95 V

Operating with a lower maximum supply voltage of 1.95V ensures energy efficiency and reduces power consumption.

Master Clock: 50 MHz

A high master clock frequency of 50 MHz enables fast signal processing and high-speed data transfer.

Body Width: 10 inch

The compact body width of 10 inches allows for easy integration into various devices and systems.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors offer high sensitivity and low noise, resulting in clear and sharp images.

Body Height: 1.25 mm

The slim body height of 1.25mm facilitates compact and sleek designs for the end product.

Package Shape or Style: SQUARE

The square package shape provides a uniform surface area for mounting and ensures stability during operation.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage requirement of 1.7V enhances energy efficiency and prolongs battery life.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the image sensor can withstand high heat conditions.

Horizontal Pixel: 1280

A high horizontal pixel count of 1280 results in detailed and high-resolution images with more clarity.

Output Range: -22-22mA

The wide output range of -22 to 22mA allows for flexibility in signal modulation and compatibility with various systems.

Output Type: DIGITAL CURRENT

The digital current output type ensures accurate and reliable data transmission for precise image capture.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C enables the image sensor to function in cold environments.

Maximum Operating Current: 60 mA

Operating within a maximum current of 60mA ensures efficient power usage and prevents overheating of the sensor.

Dynamic Range: 64 dB

A dynamic range of 64 dB allows the image sensor to capture a wide range of light intensities with detailed and accurate results.

Vertical Pixel: 960

With 960 vertical pixels, the image sensor can capture images with good depth and detail in the vertical direction.

Body Length/Diameter: 10 mm

The compact body length/diameter of 10mm allows for easier integration and space-saving design options.

Optical Format (inch): 1/3

The 1/3 inch optical format provides a good balance between image sensor size and resolution for various applications.

Data Rate: 700 Mbps

A high data rate of 700 Mbps enables fast and efficient data transfer for high-speed image processing and transmission.

Termination Type: SOLDER

The solder termination type ensures secure and stable connections for reliable operation and longevity.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface type offers a simple and efficient way to connect the image sensor to external devices for data exchange.

Frame Rate: 60 fps

With a frame rate of 60 fps, the image sensor can capture smooth and real-time video footage for optimal user experience.

Array Type: SINGLE FRAME

The single frame array type simplifies image processing and data handling, making it suitable for a wide range of applications.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy and secure attachment to circuit boards or other surfaces for convenient installation.

Technical Specifications

Image Sensors AR0134CSSM25SPCA0-TPBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.5-3.1V

Array Type:

SINGLE FRAME

Body Width:

10 inch

Body Height:

1.25 mm

Body Length/Diameter:

10 mm

Data Rate:

700 Mbps

Dynamic Range:

64 dB

Frame Rate:

60 fps

Horizontal Pixel:

1280

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Current:

60 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.75

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

960

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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