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NOII4SM014KA-GEC

Onsemi

NOII4SM014KA-GEC by Onsemi

NOII4SM014KA-GEC by Onsemi is an 8x8 um CMOS image sensor with a max supply voltage of 3.6V and output range of 0-3.3V. It operates b/w 0-70 °C, offering a dynamic range of 65.4 dB. Ideal for applications requiring a frame rate of 3.25 fps, such as surveillance cameras or industrial imaging systems.

Median Price

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Lifecycle Status

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In-Stock Inventory

1k+

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Digiode

USA . 2,358 parts In-Stock

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Vyrian

USA . 1,520 parts In-Stock

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Problanco Electronics

Mexico . 6,105 parts In-Stock

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Kulean Microsystems

USA . 3,840 parts In-Stock

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SupplyDigital Components

Austria . 3,768 parts In-Stock

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TANS Electronics

Latvia . 1,721 parts In-Stock

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Corphita

USA . 411 parts In-Stock

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Corohmni

South Africa . 284 parts In-Stock

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UHIMA Technologies

Türkiye . 232 parts In-Stock

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Overview

Capture the essence of every moment with the NOII4SM014KA-GEC by Onsemi. Crafted with precision and expertise, this high-quality image sensor is designed to deliver unparalleled performance in a compact package. Ideal for a wide range of applications, this sensor offers crisp and clear images with a dynamic range of 65.4 dB. With a maximum supply voltage of 3.6 V and an output range of 0-3.3V, this sensor provides reliable results every time. Elevate your projects with the superior technology and exceptional value of the Onsemi NOII4SM014KA-GEC.

Feature Benefit Bullets

Pixel Size (um): 8X8

Small pixel size allows for high resolution imaging with great detail.

Maximum Supply Voltage: 3.6 V

Efficient power usage and compatibility with most power sources.

Body Width: 32.4 inch

Compact size for easy integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensor technology provides high-quality images with low power consumption.

Body Height: 2.55 mm

Low profile design for sleek and slim devices.

Package Shape or Style: RECTANGULAR

Standard shape for easy handling and mounting.

Maximum Operating Temperature: 70 °C

Can withstand relatively high temperatures for versatile application environments.

Output Range: 0-3.3V

Wide output range for flexibility in signal processing.

Output Type: ANALOG VOLTAGE

Analog output provides accurate representation of image data.

Minimum Operating Temperature: 0 °C

Can operate in low temperature conditions without issues.

Housing: CERAMIC

Durable and reliable ceramic housing for long-term use.

Dynamic Range: 65.4 dB

High dynamic range for capturing both bright and dark areas in images.

Body Length/Diameter: 45.5 mm

Moderate size for balance between functionality and portability.

Optical Format (inch): 1.37

Compatible with standard optical formats for easy integration.

Termination Type: SOLDER

Secure solder termination for stable connections.

Output Interface Type: SPI INTERFACE

SPI interface for efficient data transfer and communication.

Frame Rate: 3.25 fps

Decent frame rate for smooth video recording and motion capture.

Array Type: FRAME

Frame array design for capturing multiple frames at once.

Mounting Feature: THROUGH HOLE MOUNT

Secure mounting option for stable placement in devices.

Technical Specifications

Image Sensors NOII4SM014KA-GEC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Body Width:

32.4 inch

Body Height:

2.55 mm

Body Length/Diameter:

45.5 mm

Dynamic Range:

65.4 dB

Frame Rate:

3.25 fps

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Optical Format (inch):

1.37

Output Interface Type:

SPI INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

8X8

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Termination Type:

SOLDER

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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