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AR0135CS2C19SUEA0-DRBR

Onsemi

AR0135CS2C19SUEA0-DRBR by Onsemi

The Onsemi AR0135CS2C19SUEA0-DRBR is a 1/3 inch CMOS image sensor with a square package style. It features dimensions of 9mm x 9mm x 1.55mm and uses Tin/Silver/Copper terminal finish for soldering. Ideal for surface mount applications, this sensor offers high-quality imaging capabilities in a compact form factor.

Median Price

$59.810

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

AR0135CS2C19SUEA0-DRBR by Onsemi
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,648 parts In-Stock

1+ parts

$27.120

100+ parts

$21.637

1k+ parts

-

10k+ parts

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4,648

$27.120

$21.637

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Chip1Stop

Japan . 4,320 parts In-Stock

1+ parts

$92.500

100+ parts

$43.300

1k+ parts

$28.800

10k+ parts

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4,320

$92.500

$43.300

$28.800

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$21.493

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50

$21.493

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Digiode

USA . 1,217 parts In-Stock

1+ parts

$30.628

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1,217

$30.628

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Vyrian

USA . 4,328 parts In-Stock

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4,328

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VNN

France . 4,130 parts In-Stock

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4,130

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Chip Stock

USA . 3,200 parts In-Stock

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SPM Sales

USA . 14 parts In-Stock

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14

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Distributors (Availability)

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Corohmni

South Africa . 377 parts In-Stock

1+ parts

$20.642

100+ parts

-

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377

$20.642

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Ampacity Inc.

Singapore . 4,051 parts In-Stock

1+ parts

$27.400

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4,051

$27.400

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Corphita

USA . 1,701 parts In-Stock

1+ parts

$29.016

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1,701

$29.016

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Problanco Electronics

Mexico . 7,334 parts In-Stock

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7,334

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SupplyDigital Components

Austria . 6,870 parts In-Stock

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6,870

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Kepictronics

USA . 4,500 parts In-Stock

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4,500

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Authorized Procurement Solutions

USA . 2,450 parts In-Stock

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2,450

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Kulean Microsystems

USA . 2,324 parts In-Stock

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2,324

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TANS Electronics

Latvia . 1,625 parts In-Stock

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1,625

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$21.063

1k+ parts

$20.418

10k+ parts

$19.988

500

-

$21.063

$20.418

$19.988

UHIMA Technologies

Türkiye . 34 parts In-Stock

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34

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Overview

Capture every moment in stunning detail with the AR0135CS2C19SUEA0-DRBR image sensor by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers cutting-edge technology that surpasses industry standards. Ideal for a wide range of applications, this CMOS image sensor offers unmatched performance and clarity. Whether used in security cameras, automotive systems, or medical imaging devices, this sensor ensures exceptional image quality and accuracy. Experience the difference with Onsemi's AR0135CS2C19SUEA0-DRBR - where innovation meets excellence.

Feature Benefit Bullets

Body Width: 9 inch

The large width of the body allows for more surface area for the image sensor to capture high-quality images with greater detail and clarity.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption and high image quality, making them a popular choice for various applications.

Body Height: 1.55 mm

The slim design of the body height allows for easy integration into compact electronic devices without taking up much space.

Package Shape or Style: SQUARE

The square shape provides a symmetrical and efficient layout for the image sensor, maximizing space utilization and enhancing performance.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of high-quality terminal finishes such as Tin, Silver, and Copper ensures reliable electrical connections and long-term durability of the image sensor.

Body Length/Diameter: 9 mm

The diameter of 9mm provides a compact form factor for easy installation and placement within electronic devices.

Optical Format (inch): 1/3

The 1/3 inch optical format allows for high resolution and clarity in image capture, making it suitable for a wide range of applications.

Termination Type: SOLDER

The solder termination type ensures secure and stable connections, reducing the risk of signal loss and interference in transmission.

Array Type: FRAME

The frame array type provides a structured layout for the image sensor, enabling efficient data capture and processing for superior image quality.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy and secure installation of the image sensor on PCBs, enabling seamless integration into electronic devices.

Technical Specifications

Image Sensors AR0135CS2C19SUEA0-DRBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.55 mm

Body Length/Diameter:

9 mm

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/3

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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