Loading...

KLI-2104-DAA-ED-AE

Onsemi

KLI-2104-DAA-ED-AE by Onsemi

The Onsemi KLI-2104-DAA-ED-AE is a CCD image sensor with 14x7 um pixel size, offering a dynamic range of 80 dB. Housed in ceramic, it operates b/w -25 to 80 °C and features through-hole mounting. Ideal for applications requiring high-quality linear array imaging with precise solder terminations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,248

-

-

-

-

Digiode

USA . 112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

112

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 6,468 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,468

-

-

-

-

Kulean Microsystems

USA . 6,346 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,346

-

-

-

-

Problanco Electronics

Mexico . 3,371 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,371

-

-

-

-

TANS Electronics

Latvia . 3,222 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,222

-

-

-

-

Corphita

USA . 1,218 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,218

-

-

-

-

Corohmni

South Africa . 344 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

344

-

-

-

-

UHIMA Technologies

Türkiye . 212 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

212

-

-

-

-

Overview

Capture every detail with the KLI-2104-DAA-ED-AE by Onsemi. This top-of-the-line image sensor offers unparalleled quality and precision, making it ideal for a wide range of applications. From high-resolution imaging to advanced surveillance systems, this CCD sensor delivers exceptional performance in any environment. Trust in Onsemi's reputation for excellence and innovation, and experience the value and benefits this product brings to your projects. Elevate your technology with the KLI-2104-DAA-ED-AE – where clarity meets reliability.

Feature Benefit Bullets

Pixel Size (um): 14X7

The small pixel size allows for high resolution images to be captured, ideal for applications where clarity is important such as medical imaging or industrial inspections.

Sensors or Transducers Type: IMAGE SENSOR, CCD

The use of CCD image sensors provides high-quality images with low noise, making this product suitable for applications requiring precise image capture.

Package Shape or Style: RECTANGULAR

The rectangular shape of the package allows for easy integration into different devices and systems, providing flexibility in design and installation.

Maximum Operating Temperature: 80 °C

With a high maximum operating temperature, this image sensor can withstand harsh environments without compromising performance, making it reliable in a variety of applications.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature ensures that this image sensor can function even in cold conditions, expanding its usability in different environments.

Housing: CERAMIC

The ceramic housing provides durability and thermal stability, protecting the image sensor from external factors and ensuring long-term performance.

Dynamic Range: 80 dB

The high dynamic range allows the image sensor to capture both bright and dark areas in a scene accurately, providing detailed and realistic images in various lighting conditions.

Termination Type: SOLDER

The use of solder as a termination type ensures a secure connection, reducing the risk of disconnection or signal loss, making the image sensor reliable in operation.

Array Type: LINEAR

The linear array type allows for precise imaging of objects in a straight line, making this product suitable for applications such as barcode scanning or document scanning where linear image capture is essential.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature provides a secure and stable installation of the image sensor onto a PCB or other surfaces, ensuring proper alignment and functionality in a system.

Technical Specifications

Image Sensors KLI-2104-DAA-ED-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 12 MICRO VOLT PER ELECTRON

Array Type:

LINEAR

Dynamic Range:

80 dB

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-25 Cel

Package Shape or Style:

Pixel Size (um):

14X7

Sensors or Transducers Type:

Termination Type:

SOLDER

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 16