Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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KLI-2104-DAA-EB-AA by Onsemi is an image sensor with 14X7 um pixel size, 2098 horizontal pixels, and 80 dB dynamic range. It operates at temperatures from -25 to 80 °C and uses a ceramic housing. Ideal for applications requiring high-quality imaging in various environments.
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The small pixel size allows for high resolution images to be captured with fine details, making this image sensor ideal for applications requiring high image quality.
The required power supply of 12V provides a stable voltage for the sensor to operate efficiently, ensuring reliable performance.
CCD image sensors are known for their high image quality and sensitivity, making this sensor a good choice for applications where image accuracy is critical.
The rectangular package shape allows for easy integration into various devices and systems, providing flexibility in design and placement.
The high maximum operating temperature of 80 °C ensures that the sensor can be used in a wide range of environments without overheating, increasing its versatility.
With a high number of horizontal pixels, this sensor can capture detailed images with high resolution, making it suitable for applications where image clarity is essential.
The low minimum operating temperature of -25 °C allows the sensor to function reliably in cold environments, expanding its applicability to various conditions.
The ceramic housing provides durability and thermal stability, protecting the sensor from environmental factors and ensuring long-term performance.
The high dynamic range of 80 dB allows the sensor to capture both bright and dark areas in an image accurately, resulting in high-quality images with excellent contrast.
While the vertical pixel count is low, the high horizontal pixel count compensates for it, allowing for detailed images to be captured with good resolution overall.
The solder termination type ensures a secure and reliable connection between the sensor and other components, preventing signal interference and maintaining consistent performance.
The linear array type enables the sensor to capture images in a sequential manner, allowing for precise image reconstruction and accurate representation of the scene being captured.
The through hole mounting feature simplifies the installation process and provides stability during operation, making this sensor easy to integrate into various systems and devices.
Image Sensors KLI-2104-DAA-EB-AA attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Dynamic Range:
Horizontal Pixel:
Housing:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Shape or Style:
Pixel Size (um):
Power Supplies (V):
Sensors or Transducers Type:
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Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
BAV99
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Freescale Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS138LT3G
Onsemi
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
Allegro MicroSystems
RECTIFIER DIODE; Terminal Position: END; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LAN8720AI-CP-TR
LAN8720AI-CP-TR by Microchip is an Ethernet transceiver with 100 Mbps data rate, operating at -40 to 85 °C. It features a 3.3 V supply voltage, 54 mA supply current, and TS 16949 screening level. Ideal for network interfaces in industrial applications due to its compact square package and low profile design.
LM7805CT
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Min): 0 Cel; Technology: BIPOLAR;
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
ERJ3GEY0R00V
Panasonic
ERJ3GEY0R00V by Panasonic is a SMT fixed resistor with 0 ohm resistance, suitable for jumper applications. It features a metal glaze/thick film technology, rated for temperatures b/w -55 to 155 °C. With a compact rectangular construction and matte tin over nickel terminal finish, it is ideal for surface mount installations in various electronic devices.
LFXTAL025159REEL
Iqd Frequency Products
LFXTAL025159REEL by IQD Frequency Products is a 32.768 kHz crystal oscillator with 20 ppm frequency tolerance and 40,000 ohm series resistance. It is ideal for applications requiring precise timekeeping, such as real-time clocks in IoT devices or microcontrollers in wearables. The surface-mount design with a drive level of 1 uW makes it suitable for compact electronic systems.
General Semiconductor
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
ECA2DHG4R7
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
1N4148
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148W-7-F
1N4148W-7-F by Diodes Inc. is a single rectifier diode with 0.715V max forward voltage and 100V max reverse voltage. Ideal for applications requiring fast switching speeds, it has a small outline package style and matte tin terminal finish, making it suitable for surface mount PCB designs.
Hy Electronic
LM358DR2G
LM358DR2G by Onsemi is a dual operational amplifier with 7000uV max input offset voltage and 70dB nominal CMRR. Ideal for applications requiring low bias current such as sensor interfaces, signal conditioning circuits, and audio amplifiers. Package style: Small Outline, Technology: Bipolar, Unity Gain Bandwidth: 1000 kHz.
MMBT3904-7-F
Diodes Inc. MMBT3904-7-F is a NPN BJT transistor for switching applications. Features include VCEsat of 0.3V, hFE of 30, and IC of 0.2A. With a max operating temp of 150°C, it's ideal for small outline SMT designs in automotive electronics.
Kec
MS3V-T1R32.768KHZ+/-20PPM12.5PF
Golledge Electronics
MS3V-T1R32.768KHZ+/-20PPM12.5PF by Golledge Electronics is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 12.5 pF load capacitance. It is ideal for applications requiring precise timing in temperature-sensitive environments due to its -40 to 85 °C operating range.
KAI-08051-ABA-JP-BA
KAI-08051-ABA-JP-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 3364 horizontal pixels, and 2520 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-0340SM
Image Sensors;
KAE-04471-FBA-SP-EE
KAE-04471-FBA-SP-EE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 2096 horizontal and vertical pixels, and a dynamic range of 72 dB. It operates b/w -30 to 40 °C, has a max supply voltage of 15.3 V, and outputs voltage data at a rate of 40 Mbps. Ideal for applications requiring high-quality imaging in various lighting conditions.
KAI-08050-AAA-JR-BA
KAI-08050-AAA-JR-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 15.5V max supply voltage, and 3296 horizontal pixels. Ideal for applications requiring a CCD image sensor with a dynamic range of 64 dB, such as industrial machine vision systems or medical imaging devices.
NOIP1SE0300A-QDI
NOIP1SE0300A-QDI by Onsemi is an image sensor with 4.80X4.80 um pixel size, 72 MHz master clock, and 640x480 resolution. It operates at a voltage range of 1.7-1.9V and is ideal for digital imaging applications requiring high frame rates up to 815 fps in a compact square package.
KAE-02150-ABB-SD-EE
KAE-02150-ABB-SD-EE by Onsemi is an image sensor with 5.5X5.5 um pixel size, 40 MHz master clock, and 1920x1080 resolution. Ideal for high-speed imaging applications due to its 60 fps frame rate and 68 dB dynamic range.
NOIP1SN0480A-STI
NOIP1SN0480A-STI by Onsemi features 4.80X4.80 um pixel size, 68 MHz master clock, and 808 (H) x 608 (V) resolution. This image sensor is ideal for applications requiring high-speed imaging with a frame rate of up to 120 fps in a compact surface-mount package.
KAC-06040-ABA-JD-AA
The Onsemi KAC-06040-ABA-JD-AA is a CMOS image sensor with 4.70x4.70 um pixel size, 2832 horizontal pixels, and 2128 vertical pixels. It operates at temperatures from -50 to 80 °C and has a frame rate of 160 fps. Ideal for applications requiring high-resolution imaging in various environments.
KAF-39000-AAA-DD-AA
The Onsemi KAF-39000-AAA-DD-AA image sensor features 6.8X6.8 um pixel size, 7216 horizontal pixels, and 5412 vertical pixels. Operating at temperatures from 0 to 60 °C, with a power supply of 15V, it is ideal for high-resolution imaging applications requiring THROUGH HOLE MOUNTing.
AR0135CS2M00SUEA0-DRBR1
Onsemi's AR0135CS2M00SUEA0-DRBR1 is a 1/3 inch CMOS image sensor with 1280x960 pixels, offering a dynamic range of 71.1 dB and operating at temperatures from -30 to 70°C. With a max supply voltage of 1.95V and output interface type of 2-WIRE INTERFACE, it is ideal for applications requiring high-resolution imaging at up to 54 fps.
AMIS-710324-A4
Image Sensors; Maximum Operating Temperature: 50 Cel; Power Supplies (V): 5; Horizontal Pixel: 2592; Minimum Operating Temperature: 0 Cel;
MT9P031I12STM-DP1
MT9P031I12STM-DP1 by Onsemi is a 2.2x2.2 um CMOS image sensor with 2592x1944 pixels, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring high-resolution imaging at frame rates up to 14 fps in a compact square package suitable for surface mounting.
CMV2000-3E5C1PP
Ams Ag
CMV2000-3E5C1PP by Ams Ag is a 2/3-inch CMOS image sensor with 2048x1088 pixels, offering a high dynamic range of 90 dB. With a pixel size of 5.5um, it operates b/w -30°C to 70°C and features an SPI interface for fast data transfer. Ideal for applications requiring high-speed imaging such as machine vision and industrial inspection.
CYII4SM1300AA-HBC
CYII4SM1300AA-HBC by Onsemi is a 7x7 um CMOS image sensor with 1280 horizontal pixels and 1024 vertical pixels. It operates at a max supply voltage of 5V, has a dynamic range of 69 dB, and outputs digital voltage from 1-4.50V. This sensor is ideal for applications requiring high-resolution imaging in devices such as cameras and surveillance systems.
KAE-02152-ABB-SD-EE
The Onsemi KAE-02152-ABB-SD-EE is a 5.5x5.5um CCD image sensor with 1920x1080 pixels, offering a dynamic range of 86dB. It operates b/w -40 °C to +40°C and comes in a rectangular ceramic housing. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
CYIL1SC4000AA-GDC
CYIL1SC4000AA-GDC by Onsemi is an image sensor with 2048x2048 pixels, 12x12 um pixel size, and a max supply voltage of 2.75V. Ideal for applications requiring high-resolution imaging at a frame rate of 15 fps, such as surveillance systems or industrial cameras.
CYIL1SE3000AA-GZDC
CYIL1SE3000AA-GZDC by Onsemi is an 8x8 um CMOS image sensor with a max supply voltage of 3.465 V and a master clock of 206 MHz. It features a full-frame array type, digital output, and operates at temperatures ranging from 0 to 60 °C. Ideal for applications requiring high-speed imaging such as machine vision systems or industrial cameras.
AR0134CSSM00SUEA0-TPBR
AR0134CSSM00SUEA0-TPBR by Onsemi is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 64dB dynamic range. It operates at -30 to 70°C, has a max supply voltage of 1.95V, and uses a digital current output interface. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
TCD1305DG
Toshiba
Toshiba TCD1305DG is an 8X64 um CCD image sensor with a 3648 horizontal pixel array. Operating at 4.5-5.5V, it offers a spectral response of 400-1200nm and sensitivity of 64 V/lx.s. Ideal for applications requiring high-resolution imaging in industrial cameras or scientific instruments.
NOIS1SC1000A-HHC
NOIS1SC1000A-HHC by Onsemi is a 1024x1024 CMOS image sensor with 15x15 um pixel size. It outputs analog voltage at 11 fps with a max operating current of 60.8 mA. Housed in a ceramic package, it is ideal for surface mount applications in frame array setups.
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KLI-2113-RAA-ED-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: VOLTAGE OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 11.5 V; Array Type: LINEAR;
KLI-2104-DAA-EB-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -25 Cel; Dynamic Range: 80 dB; Housing: CERAMIC;
KLI-2104-DAA-ED-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Power Supplies (V): 12; Array Type: LINEAR; Maximum Operating Temperature: 80 Cel;
KLI-2104-DAA-ED-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 80 Cel; Pixel Size (um): 14X7; Dynamic Range: 80 dB;
KLI-2113
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 2V; Horizontal Pixel: 2098;
KLI-2113-AAA-ER-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Array Type: LINEAR;
KLI-2113-AAA-ER-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 12.5 V; Horizontal Pixel: 2098;
KLI-2113-AAB-ED-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -25 Cel; Power Supplies (V): 12;
KLI-2113-AAB-ED-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 80 Cel; Body Length/Diameter: 48 mm;
KLI-2113-DAA-ED-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 12.5 V; Body Length/Diameter: 48 mm;
KLI-2113-DAA-ED-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Body Width: 14.66 inch; Array Type: LINEAR;
KLI-2113-RAA-ED-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: VOLTAGE OUTPUT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Termination Type: SOLDER;
KLI-2104-DAA-EB-AA
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 80 Cel; Housing: CERAMIC; Minimum Operating Temperature: -25 Cel;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Pixel Size (um): 14X7; Array Type: LINEAR;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Maximum Operating Temperature: 80 Cel; Housing: CERAMIC;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 80 Cel; Dynamic Range: 80 dB; Minimum Operating Temperature: -25 Cel;
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