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AR0220AT4B00XUEA2-VL-TPBR

Onsemi

AR0220AT4B00XUEA2-VL-TPBR by Onsemi

The Onsemi AR0220AT4B00XUEA2-VL-TPBR is a CMOS image sensor with 1828x948 pixels, 1/1.8" optical format, and 60 fps frame rate. It features digital output via a 2-wire interface and is ideal for applications requiring high-resolution imaging in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,340 parts In-Stock

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Vyrian

USA . 641 parts In-Stock

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641

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Problanco Electronics

Mexico . 6,946 parts In-Stock

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6,946

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TANS Electronics

Latvia . 4,896 parts In-Stock

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Kulean Microsystems

USA . 4,679 parts In-Stock

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SupplyDigital Components

Austria . 3,361 parts In-Stock

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Corphita

USA . 2,345 parts In-Stock

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Northwest PG Solutions

USA . 2,233 parts In-Stock

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Native Components

USA . 434 parts In-Stock

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$4.017

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434

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UHIMA Technologies

Türkiye . 325 parts In-Stock

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Corohmni

South Africa . 195 parts In-Stock

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Overview

Unlock a world of crystal-clear imaging with the AR0220AT4B00XUEA2-VL-TPBR by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and innovation in every product. This image sensor is perfect for a wide range of applications, from security cameras to automotive systems. Experience the value and benefits of high-resolution images with this cutting-edge CMOS sensor, offering unparalleled performance and reliability. Choose Onsemi for superior technology that elevates your projects to new heights.

Feature Benefit Bullets

Body Width: 9 inch

The compact body width of 9 inch makes this image sensor suitable for use in small devices or compact systems, allowing for versatile applications.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

The use of CMOS technology enhances the image quality and allows for efficient power consumption, making this sensor a reliable choice for high-quality image capturing.

Body Height: 1.7 mm

The low body height of 1.7 mm ensures that the sensor can be easily integrated into slim devices without adding bulk, making it a versatile option for various applications.

Package Shape or Style: RECTANGULAR

The rectangular package shape provides a stable and secure mounting option for the sensor, ensuring reliable performance in different environments.

Horizontal Pixel: 1828

The high horizontal pixel count of 1828 results in detailed and sharp images, making this image sensor ideal for applications where image clarity is paramount.

Output Type: DIGITAL OUTPUT

The digital output type simplifies the integration process, allowing for easy connectivity to various systems and devices for data transfer.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of high-quality terminal finishes like tin, silver, and copper ensures reliable connectivity and long-lasting performance of the sensor in different operating conditions.

Vertical Pixel: 948

With 948 vertical pixels, this sensor produces high-resolution images with excellent clarity, making it a suitable choice for applications requiring detailed image capture.

Body Length/Diameter: 12 mm

The compact body length of 12 mm allows for easy integration and placement of the sensor in various devices or systems, making it a versatile choice for different applications.

Optical Format (inch): 1/1.8

The 1/1.8 inch optical format provides a standard size for the sensor, ensuring compatibility with various optical systems and lenses for versatile imaging solutions.

Termination Type: SOLDER

The solder termination type provides a secure and reliable connection for the sensor, ensuring stable performance and durability in different operating conditions.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the communication process and allows for easy integration with different systems and devices, enhancing the overall versatility of the sensor.

Frame Rate: 60 fps

With a high frame rate of 60 fps, this sensor can capture fast-moving objects or scenes with smooth and clear motion, making it suitable for applications requiring real-time imaging.

Array Type: FRAME

The frame array type provides a structured layout for the pixels, resulting in uniform image quality and accurate color reproduction, making this sensor ideal for various imaging applications.

Mounting Feature: SURFACE MOUNT

The surface mount feature allows for easy and secure mounting of the sensor on PCBs or other surfaces, ensuring stability and reliability in different environments.

Technical Specifications

Image Sensors AR0220AT4B00XUEA2-VL-TPBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

AEC-Q100, ROLLING SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.7 mm

Body Length/Diameter:

12 mm

Frame Rate:

60 fps

Horizontal Pixel:

1828

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/1.8

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

948

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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