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KAI-02150-ABA-JP-AE

Onsemi

KAI-02150-ABA-JP-AE by Onsemi

KAI-02150-ABA-JP-AE by Onsemi is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 64dB dynamic range. It operates b/w -50 to 70 °C, with supply voltage ranging from 14.5V to 15.5V. Ideal for applications requiring high-resolution imaging in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,641 parts In-Stock

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1,641

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Digiode

USA . 1,095 parts In-Stock

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1,095

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 5,620 parts In-Stock

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5,620

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Problanco Electronics

Mexico . 4,684 parts In-Stock

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4,684

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Kulean Microsystems

USA . 3,361 parts In-Stock

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3,361

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TANS Electronics

Latvia . 3,145 parts In-Stock

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3,145

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Corphita

USA . 1,824 parts In-Stock

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Corohmni

South Africa . 283 parts In-Stock

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283

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UHIMA Technologies

Türkiye . 120 parts In-Stock

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Overview

Unleash the power of crystal-clear imaging with the KAI-02150-ABA-JP-AE by Onsemi. As a leading manufacturer in the industry, Onsemi has crafted this top-of-the-line Image Sensor to deliver unmatched quality and precision in every application. Whether you're capturing stunning visuals for security systems, medical imaging, or industrial inspection, this sensor's advanced technology and impressive dynamic range of 64 dB ensure every detail is captured with unparalleled clarity. Elevate your projects to the next level with the KAI-02150-ABA-JP-AE and experience the difference that superior image sensing can make.

Feature Benefit Bullets

Pixel Size (um) 5.5X5.5

The small pixel size allows for high resolution images with fine details.

Maximum Supply Voltage 15.5 V

The high maximum supply voltage ensures stable and reliable performance.

Sensors or Transducers Type IMAGE SENSOR,CCD

CCD sensors provide high-quality image capture with low noise levels.

Package Shape or Style RECTANGULAR

Rectangular package shape makes it easy to integrate into various devices and setups.

Minimum Supply Voltage 14.5 V

The low minimum supply voltage helps in energy efficiency and power saving.

Maximum Operating Temperature 70 °C

High maximum operating temperature allows for use in various environmental conditions.

Horizontal Pixel 1920

High horizontal pixel count provides sharp and detailed images.

Minimum Operating Temperature -50 °C

Low minimum operating temperature ensures functionality in cold environments.

Dynamic Range 64 dB

Good dynamic range allows for capturing a wide range of light intensities accurately.

Vertical Pixel 1080

High vertical pixel count contributes to the overall image quality and resolution.

Optical Format (inch) 2/3

The 2/3 inch optical format is a commonly used standard in imaging, ensuring compatibility with various lenses.

Termination Type SOLDER

Solder termination ensures secure and reliable connection in the assembly process.

Array Type INTERLINE

Interline array type provides fast readout speeds and efficient image capture.

Mounting Feature THROUGH HOLE MOUNT

Through hole mounting feature enables easy and secure installation in electronic devices.

Technical Specifications

Image Sensors KAI-02150-ABA-JP-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Dynamic Range:

64 dB

Horizontal Pixel:

1920

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

2/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1080

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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