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KAF-0402-ABA-CP-B1

Onsemi

KAF-0402-ABA-CP-B1 by Onsemi

Onsemi's KAF-0402-ABA-CP-B1 is a CCD image sensor with 9x9 um pixel size, offering 768H x 512V resolution. It operates at 14.75-15.5 V supply voltage range, providing a dynamic range of 76 dB. Ideal for full-frame applications requiring high-quality imaging with a data rate of 10 Mbps.

Median Price

$438.510

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

$350.810

100+ parts

$329.760

1k+ parts

$308.710

10k+ parts

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1

$350.810

$329.760

$308.710

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DigiKey

USA . 1 parts In-Stock

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$438.510

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$438.510

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Verical

USA . 1 parts In-Stock

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$438.512

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1

$438.512

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 954 parts In-Stock

1+ parts

$387.932

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954

$387.932

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Vyrian

USA . 6,612 parts In-Stock

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6,612

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Distributors (Availability)

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Corphita

USA . 533 parts In-Stock

1+ parts

$367.515

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533

$367.515

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Corohmni

South Africa . 497 parts In-Stock

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$408.350

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497

$408.350

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Problanco Electronics

Mexico . 3,161 parts In-Stock

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SupplyDigital Components

Austria . 2,415 parts In-Stock

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2,415

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Kulean Microsystems

USA . 1,712 parts In-Stock

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TANS Electronics

Latvia . 630 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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UHIMA Technologies

Türkiye . 185 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Onsemi with the KAF-0402-ABA-CP-B1 Image Sensor. This cutting-edge technology offers exceptional performance in a wide range of applications, from surveillance systems to medical imaging. With a dynamic range of 76 dB and a pixel size of 9X9 um, this sensor delivers crystal-clear images with incredible detail. Trust Onsemi to provide you with top-of-the-line products that exceed your expectations and elevate your projects to new heights. Choose the KAF-0402-ABA-CP-B1 for superior results every time.

Feature Benefit Bullets

Pixel Size (um): 9X9

A smaller pixel size allows for higher resolution images and better detail in the captured images.

Maximum Supply Voltage: 15.5 V

The higher maximum supply voltage provides flexibility in power supply options and can accommodate higher power requirements.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD image sensors are known for their high-quality image capture capabilities and low noise performance, making this product suitable for applications where image quality is crucial.

Package Shape or Style: RECTANGULAR

Rectangular packages are easy to integrate into various system designs and offer a compact form factor for space-constrained applications.

Minimum Supply Voltage: 14.75 V

The low minimum supply voltage ensures efficient power consumption and can help extend the battery life in portable devices.

Horizontal Pixel: 768

A higher number of horizontal pixels result in wider image capture, allowing for more detailed and expansive images.

Housing: CERAMIC

Ceramic housings offer durability and thermal stability, making them ideal for operation in harsh environments and ensuring long-term reliability.

Dynamic Range: 76 dB

A high dynamic range allows for capturing a wide range of light intensities, resulting in clear and detailed images in both bright and dark conditions.

Vertical Pixel: 512

The vertical resolution of 512 pixels provides sufficient detail in the vertical direction, enhancing image clarity and sharpness.

Data Rate: 10 Mbps

A high data rate of 10 Mbps enables fast image capture and transfer, making this sensor suitable for applications that require real-time image processing.

Termination Type: SOLDER

Solder termination ensures secure and reliable electrical connections, reducing the risk of signal loss or disconnections during operation.

Array Type: FULL FRAME

Full-frame array design allows for capturing the entire image in a single exposure, resulting in high-quality, evenly illuminated images with minimal distortion.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting provides mechanical stability and easy installation, ensuring secure positioning of the sensor in the system.

Technical Specifications

Image Sensors KAF-0402-ABA-CP-B1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 10 MICRO VOLT PER ELECTRON

Array Type:

FULL FRAME

Data Rate:

10 Mbps

Dynamic Range:

76 dB

Horizontal Pixel:

768

Housing:

CERAMIC

Mounting Feature:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.75 V

Termination Type:

SOLDER

Vertical Pixel:

512

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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