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KAF-0402-ABA-CP-AE

Onsemi

KAF-0402-ABA-CP-AE by Onsemi

The Onsemi KAF-0402-ABA-CP-AE is a CCD image sensor with 9x9 um pixel size, offering 768 horizontal and 512 vertical pixels. It operates at a supply voltage range of 14.75V to 15.5V, providing a dynamic range of 76 dB. This rectangular package sensor has a data rate of 10 Mbps and is suitable for full-frame imaging applications in various industries.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 750 parts In-Stock

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750

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Digiode

USA . 732 parts In-Stock

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732

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SupplyDigital Components

Austria . 7,921 parts In-Stock

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TANS Electronics

Latvia . 6,367 parts In-Stock

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Problanco Electronics

Mexico . 5,489 parts In-Stock

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Kulean Microsystems

USA . 4,484 parts In-Stock

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Corphita

USA . 2,006 parts In-Stock

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2,006

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UHIMA Technologies

Türkiye . 836 parts In-Stock

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836

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Corohmni

South Africa . 338 parts In-Stock

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Overview

Elevate your imaging capabilities with the KAF-0402-ABA-CP-AE by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch image sensors that are reliable and high-performing. This sensor is perfect for a wide range of applications, from industrial to medical imaging. With its exceptional pixel size, dynamic range, and data rate, this sensor offers unparalleled quality and precision in capturing images. Invest in the KAF-0402-ABA-CP-AE and experience the value it brings to your projects.

Feature Benefit Bullets

Pixel Size (um): 9X9

The small pixel size allows for higher resolution images, making this product ideal for capturing detailed images.

Maximum Supply Voltage: 15.5 V

The high maximum supply voltage ensures stable performance and reliability even under high power conditions.

Sensors or Transducers Type: IMAGE SENSOR,CCD

Being a CCD image sensor, this product offers high-quality image capturing capabilities with low noise levels.

Package Shape or Style: RECTANGULAR

The rectangular package shape makes it easy to integrate this image sensor into various devices and systems.

Minimum Supply Voltage: 14.75 V

The low minimum supply voltage ensures that this image sensor can operate efficiently even with lower power sources.

Horizontal Pixel: 768

The high horizontal pixel count allows for wide and detailed image capture, suitable for various applications.

Housing: CERAMIC

The ceramic housing provides durability and thermal stability, enhancing the reliability and longevity of the product.

Dynamic Range: 76 dB

The high dynamic range enables this image sensor to capture a wide range of light intensities, resulting in vivid and clear images.

Vertical Pixel: 512

The vertical pixel count complements the high horizontal pixel count, allowing for detailed and comprehensive image capture.

Data Rate: 10 Mbps

The high data rate enables fast image transfer and processing, making this product ideal for real-time imaging applications.

Termination Type: SOLDER

The solder termination type provides secure and reliable connections, ensuring stable performance in various operating conditions.

Array Type: FULL FRAME

Being a full-frame array, this image sensor captures images with no cropping or vignetting, providing a true representation of the scene.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature offers easy and secure installation, making this product suitable for various integration requirements.

Technical Specifications

Image Sensors KAF-0402-ABA-CP-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 10 MICRO VOLT PER ELECTRON

Array Type:

FULL FRAME

Data Rate:

10 Mbps

Dynamic Range:

76 dB

Horizontal Pixel:

768

Housing:

CERAMIC

Mounting Feature:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.75 V

Termination Type:

SOLDER

Vertical Pixel:

512

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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