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KAF-0402-AAA-CB-B1

Onsemi

KAF-0402-AAA-CB-B1 by Onsemi

Onsemi's KAF-0402-AAA-CB-B1 is a CCD image sensor with 9x9 um pixel size, offering 768 horizontal and 512 vertical pixels. It operates at a data rate of 10 Mbps, with a dynamic range of 76 dB. Ideal for full-frame applications requiring high-quality imaging in industrial or scientific settings.

Median Price

$376.278

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

$334.930

100+ parts

$314.830

1k+ parts

$294.740

10k+ parts

-

2

$334.930

$314.830

$294.740

-

Verical

USA . 2 parts In-Stock

1+ parts

$417.625

100+ parts

$392.563

1k+ parts

$367.512

10k+ parts

-

2

$417.625

$392.563

$367.512

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 488 parts In-Stock

1+ parts

$313.614

100+ parts

-

1k+ parts

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488

$313.614

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Vyrian

USA . 6,014 parts In-Stock

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-

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6,014

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,002 parts In-Stock

1+ parts

$297.108

100+ parts

-

1k+ parts

-

10k+ parts

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1,002

$297.108

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Corohmni

South Africa . 70 parts In-Stock

1+ parts

$330.120

100+ parts

-

1k+ parts

-

10k+ parts

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70

$330.120

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Continental Prestige Electronics

USA . 3 parts In-Stock

1+ parts

$330.120

100+ parts

-

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3

$330.120

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-

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Problanco Electronics

Mexico . 8,189 parts In-Stock

1+ parts

-

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8,189

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TANS Electronics

Latvia . 3,209 parts In-Stock

1+ parts

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3,209

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SupplyDigital Components

Austria . 1,762 parts In-Stock

1+ parts

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1,762

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UHIMA Technologies

Türkiye . 888 parts In-Stock

1+ parts

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888

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Kulean Microsystems

USA . 208 parts In-Stock

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208

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Overview

Capture every detail with the KAF-0402-AAA-CB-B1 by Onsemi. Crafted by a trusted manufacturer, this image sensor offers unparalleled quality and precision in capturing images. Ideal for a wide range of applications, this sensor provides exceptional value by delivering crystal-clear images with a high dynamic range. With its easy mounting feature and reliable performance, the KAF-0402-AAA-CB-B1 is the perfect choice for all your imaging needs.

Feature Benefit Bullets

Pixel Size (um): 9X9

Smaller pixel size allows for higher resolution images to be captured, making this image sensor ideal for high-quality imaging applications.

Maximum Supply Voltage: 15.5 V

Higher maximum supply voltage allows for greater flexibility in power supply options, ensuring reliable performance in a variety of operating conditions.

Sensors or Transducers Type: IMAGE SENSOR, CCD

The use of CCD technology provides excellent image quality with low noise, making this sensor well-suited for demanding imaging applications.

Package Shape or Style: RECTANGULAR

Rectangular package shape allows for easy integration into various imaging systems, providing versatility in design and installation options.

Minimum Supply Voltage: 14.75 V

Low minimum supply voltage ensures efficient power consumption, leading to longer operating times and reduced energy costs.

Horizontal Pixel: 768

High horizontal pixel count enables detailed and sharp images to be captured, making this sensor a good choice for applications requiring precise image acquisition.

Housing: CERAMIC

Ceramic housing offers excellent durability and thermal conductivity, providing a robust and reliable packaging solution for the image sensor.

Dynamic Range: 76 dB

Wide dynamic range allows for accurate capture of both bright and dark areas within the same image, enhancing overall image quality and detail.

Vertical Pixel: 512

High vertical pixel count enhances image resolution and clarity, making this sensor suitable for applications requiring detailed image reproduction.

Data Rate: 10 Mbps

High data rate ensures fast and efficient transfer of image data, enabling real-time imaging applications to operate smoothly and without delay.

Termination Type: SOLDER

Solder termination provides secure and reliable electrical connections, ensuring consistent performance and durability in various operating environments.

Array Type: FULL FRAME

Full-frame array design maximizes light sensitivity and image capture area, resulting in high-quality images with minimal noise and distortion.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting feature allows for easy and secure installation of the image sensor onto PCBs or other surfaces, simplifying the integration process.

Technical Specifications

Image Sensors KAF-0402-AAA-CB-B1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 10 MICRO VOLT PER ELECTRON

Array Type:

FULL FRAME

Data Rate:

10 Mbps

Dynamic Range:

76 dB

Horizontal Pixel:

768

Housing:

CERAMIC

Mounting Feature:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.75 V

Termination Type:

SOLDER

Vertical Pixel:

512

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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