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KAF-0402-ABA-CP-B2

Onsemi

KAF-0402-ABA-CP-B2 by Onsemi

Onsemi's KAF-0402-ABA-CP-B2 is a CCD image sensor with 9x9 um pixel size, offering 768H x 512V resolution. It operates at 14.75-15.5 V, providing a dynamic range of 76 dB. Ideal for high-quality imaging applications requiring full-frame array and through-hole mounting.

Median Price

$310.240

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$233.170

100+ parts

-

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1

$233.170

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Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$238.000

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1

$238.000

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Rochester

USA . 1 parts In-Stock

1+ parts

$310.240

100+ parts

$291.630

1k+ parts

$273.010

10k+ parts

-

1

$310.240

$291.630

$273.010

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DigiKey

USA . 3 parts In-Stock

1+ parts

$375.580

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3

$375.580

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Verical

USA . 1 parts In-Stock

1+ parts

$387.800

100+ parts

$364.538

1k+ parts

$341.262

10k+ parts

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1

$387.800

$364.538

$341.262

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,335 parts In-Stock

1+ parts

$221.512

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2,335

$221.512

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Vyrian

USA . 6,487 parts In-Stock

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6,487

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 655 parts In-Stock

1+ parts

$209.853

100+ parts

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655

$209.853

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Corohmni

South Africa . 147 parts In-Stock

1+ parts

$233.170

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147

$233.170

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Continental Prestige Electronics

USA . 3 parts In-Stock

1+ parts

$306.540

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3

$306.540

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TANS Electronics

Latvia . 6,860 parts In-Stock

1+ parts

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6,860

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Kulean Microsystems

USA . 6,561 parts In-Stock

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6,561

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SupplyDigital Components

Austria . 5,351 parts In-Stock

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5,351

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Problanco Electronics

Mexico . 4,430 parts In-Stock

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4,430

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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UHIMA Technologies

Türkiye . 670 parts In-Stock

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670

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Overview

Unlock the power of crystal-clear imaging with the KAF-0402-ABA-CP-B2 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in every product. This image sensor boasts a high dynamic range and fast data rate, making it perfect for applications in professional photography, medical imaging, and scientific research. Experience sharper images and better performance with the KAF-0402-ABA-CP-B2, providing unparalleled value and benefits to fulfill all your imaging needs. Elevate your projects to the next level with this cutting-edge technology.

Feature Benefit Bullets

Pixel Size (um): 9X9

Having a small pixel size of 9X9 um allows for high resolution images to be captured, making this image sensor ideal for applications requiring detailed images.

Maximum Supply Voltage: 15.5 V

The high maximum supply voltage of 15.5 V provides flexibility in power supply options and ensures reliable operation in various voltage conditions.

Sensors or Transducers Type: IMAGE SENSOR,CCD

Being a CCD image sensor, it offers high-quality image capture with low noise, making it suitable for applications where image clarity is essential.

Package Shape or Style: RECTANGULAR

The rectangular package shape allows for easy integration into electronic devices and circuit boards, making it convenient for manufacturers to incorporate into their products.

Minimum Supply Voltage: 14.75 V

The low minimum supply voltage of 14.75 V helps in conserving power and increases the efficiency of the image sensor.

Horizontal Pixel: 768

With a high horizontal pixel count of 768, this image sensor can capture detailed images with high resolution, making it suitable for demanding imaging applications.

Housing: CERAMIC

The ceramic housing provides durability and protection to the image sensor, ensuring its long-term reliability in different environments.

Dynamic Range: 76 dB

The wide dynamic range of 76 dB enables the image sensor to capture both bright and dark areas accurately in the same image, making it suitable for high-contrast scenes.

Vertical Pixel: 512

The vertical pixel count of 512 allows for capturing images with good vertical resolution, making it suitable for applications where capturing detailed vertical information is important.

Data Rate: 10 Mbps

With a high data rate of 10 Mbps, this image sensor can quickly transfer image data, making it suitable for applications requiring real-time image processing.

Termination Type: SOLDER

The solder termination type ensures secure connections and reliable performance, making it convenient for integration into electronic assemblies.

Array Type: FULL FRAME

Being a full-frame array type, this image sensor captures the full image in a single frame without cropping, allowing for detailed and accurate image reproduction.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature provides a secure and stable mounting option, ensuring the image sensor stays in place during operation, making it suitable for applications with vibration or movement.

Technical Specifications

Image Sensors KAF-0402-ABA-CP-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 10 MICRO VOLT PER ELECTRON

Array Type:

FULL FRAME

Data Rate:

10 Mbps

Dynamic Range:

76 dB

Horizontal Pixel:

768

Housing:

CERAMIC

Mounting Feature:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.75 V

Termination Type:

SOLDER

Vertical Pixel:

512

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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