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KAF-0402-AAA-CP-B2

Onsemi

KAF-0402-AAA-CP-B2 by Onsemi

Onsemi's KAF-0402-AAA-CP-B2 is a CCD image sensor with 9x9 um pixel size, offering 768H x 512V resolution. It operates at supply voltages b/w 14.75V to 15.5V, providing a dynamic range of 76 dB. Ideal for applications requiring high-quality imaging in full-frame arrays with a data rate of up to 10 Mbps.

Median Price

$375.580

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

$311.000

100+ parts

$292.340

1k+ parts

$273.680

10k+ parts

-

1

$311.000

$292.340

$273.680

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DigiKey

USA . 2 parts In-Stock

1+ parts

$375.580

100+ parts

-

1k+ parts

-

10k+ parts

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2

$375.580

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-

-

Verical

USA . 1 parts In-Stock

1+ parts

$387.800

100+ parts

$364.538

1k+ parts

$341.262

10k+ parts

-

1

$387.800

$364.538

$341.262

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,886 parts In-Stock

1+ parts

$291.213

100+ parts

-

1k+ parts

-

10k+ parts

-

1,886

$291.213

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-

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Vyrian

USA . 7,479 parts In-Stock

1+ parts

-

100+ parts

-

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7,479

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,014 parts In-Stock

1+ parts

$275.886

100+ parts

-

1k+ parts

-

10k+ parts

-

2,014

$275.886

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-

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Corohmni

South Africa . 376 parts In-Stock

1+ parts

$306.540

100+ parts

-

1k+ parts

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10k+ parts

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376

$306.540

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-

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Continental Prestige Electronics

USA . 2 parts In-Stock

1+ parts

$306.540

100+ parts

-

1k+ parts

-

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2

$306.540

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-

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Kulean Microsystems

USA . 8,214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8,214

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SupplyDigital Components

Austria . 1,936 parts In-Stock

1+ parts

-

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1,936

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Problanco Electronics

Mexico . 1,709 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,709

-

-

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UHIMA Technologies

Türkiye . 636 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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636

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TANS Electronics

Latvia . 312 parts In-Stock

1+ parts

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312

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Overview

Unlock the power of crystal-clear imaging with the KAF-0402-AAA-CP-B2 by Onsemi. Crafted by a trusted manufacturer, this image sensor is designed to provide superior quality and precision in capturing images. Ideal for a variety of applications, this sensor offers unmatched value and benefits to customers looking to enhance their imaging capabilities. Elevate your projects and achieve stunning results with the KAF-0402-AAA-CP-B2.

Feature Benefit Bullets

Pixel Size (um): 9X9

The small pixel size of 9X9 um allows for high resolution images to be captured with detail and clarity.

Maximum Supply Voltage: 15.5 V

The high maximum supply voltage of 15.5 V ensures stable and reliable performance of the image sensor even under varying voltage conditions.

Sensors or Transducers Type: IMAGE SENSOR, CCD

Being a CCD image sensor, it offers high-quality image reproduction with low noise and excellent light sensitivity, making it suitable for imaging applications where image quality is crucial.

Package Shape or Style: RECTANGULAR

The rectangular package shape provides easy integration and compatibility with various mounting options, making it versatile for different types of installations.

Minimum Supply Voltage: 14.75 V

The low minimum supply voltage requirement of 14.75 V ensures power efficiency and minimal power consumption for the image sensor.

Horizontal Pixel: 768

The high horizontal pixel count of 768 allows for detailed and high-resolution images to be captured, suitable for demanding imaging applications.

Housing: CERAMIC

The ceramic housing provides excellent durability and thermal stability, ensuring reliable operation of the image sensor even in harsh environments.

Dynamic Range: 76 dB

The high dynamic range of 76 dB allows for capturing a wide range of brightness levels in an image, ensuring accurate reproduction of both dark and bright areas.

Vertical Pixel: 512

With a vertical pixel count of 512, the image sensor can capture detailed images with good vertical resolution, suitable for applications where capturing height or depth is important.

Data Rate: 10 Mbps

The high data rate of 10 Mbps allows for fast and efficient transfer of image data, enabling real-time image processing and transmission.

Termination Type: SOLDER

The solder termination type provides secure and reliable connections for the image sensor, ensuring stable electrical connections for optimal performance.

Array Type: FULL FRAME

The full-frame array type offers a larger imaging area, allowing for more light to be captured and resulting in higher image quality with better sensitivity and lower noise.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature provides a sturdy and secure installation method for the image sensor, making it suitable for applications where the sensor needs to be securely mounted.

Technical Specifications

Image Sensors KAF-0402-AAA-CP-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 10 MICRO VOLT PER ELECTRON

Array Type:

FULL FRAME

Data Rate:

10 Mbps

Dynamic Range:

76 dB

Horizontal Pixel:

768

Housing:

CERAMIC

Mounting Feature:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.75 V

Termination Type:

SOLDER

Vertical Pixel:

512

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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