Loading...

KAI-0340-AAA-CP-AA-DUAL

Onsemi

KAI-0340-AAA-CP-AA-DUAL by Onsemi

KAI-0340-AAA-CP-AA-DUAL by Onsemi is an image sensor with 7.4x7.4 um pixel size, 640x480 resolution, and 69 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 727 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

727

-

-

-

-

Digiode

USA . 154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

154

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 6,610 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,610

-

-

-

-

Kulean Microsystems

USA . 3,027 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,027

-

-

-

-

Corphita

USA . 2,155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,155

-

-

-

-

TANS Electronics

Latvia . 1,619 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,619

-

-

-

-

Corohmni

South Africa . 495 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

495

-

-

-

-

UHIMA Technologies

Türkiye . 360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

360

-

-

-

-

Problanco Electronics

Mexico . 188 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

188

-

-

-

-

Overview

Experience the cutting-edge technology of the KAI-0340-AAA-CP-AA-DUAL by Onsemi, a leading manufacturer in image sensors. This innovative product offers superior quality and performance, making it ideal for a wide range of applications in industries such as surveillance, medical imaging, and machine vision. With its high-resolution images and advanced features, this image sensor provides unparalleled value and benefits to customers looking for top-notch imaging solutions. Choose the KAI-0340-AAA-CP-AA-DUAL for unmatched reliability and precision in your imaging projects.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Smaller pixel size allows for higher resolution images to be captured.

Maximum Supply Voltage: 15.25 V

Wide voltage range allows for flexibility in power supply options.

Body Width: 12.45 inch

Compact size makes it easy to integrate into different systems.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensor provides high-quality image capturing capabilities.

Body Height: 5.15 mm

Low profile design suitable for space-constrained applications.

Package Shape or Style: RECTANGULAR

Common shape for easy mounting and integration.

Minimum Supply Voltage: 14.75 V

Low minimum supply voltage for energy efficiency.

Maximum Operating Temperature: 70 °C

Wide temperature range for versatility in various operating environments.

Dynamic Range: 69 dB

High dynamic range ensures accurate and detailed image capture.

Optical Format (inch): 1/3

Standard optical format for compatibility with various lenses and accessories.

Mounting Feature: THROUGH HOLE MOUNT

Secure mounting option for stable installation.

Technical Specifications

Image Sensors KAI-0340-AAA-CP-AA-DUAL attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 30 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

12.45 inch

Body Height:

5.15 mm

Body Length/Diameter:

15.87 mm

Dynamic Range:

69 dB

Horizontal Pixel:

640

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1/3

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.25 V

Minimum Supply Voltage:

14.75 V

Termination Type:

SOLDER

Vertical Pixel:

480

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20