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KAF-0261-AAA-CD-BA

Onsemi

KAF-0261-AAA-CD-BA by Onsemi

The Onsemi KAF-0261-AAA-CD-BA is a CCD image sensor with 512x512 pixels, 20x20 um pixel size, and 87 dB dynamic range. Ideal for applications requiring high-quality imaging in a wide temperature range from -70 to 50 °C, such as scientific research, industrial inspection, and medical imaging.

Median Price

$1,023.260

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

$927.030

100+ parts

$871.410

1k+ parts

$815.790

10k+ parts

-

1

$927.030

$871.410

$815.790

-

DigiKey

USA . 1 parts In-Stock

1+ parts

$1,119.490

100+ parts

$1,119.490

1k+ parts

$1,119.490

10k+ parts

$1,119.490

1

$1,119.490

$1,119.490

$1,119.490

$1,119.490

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 434 parts In-Stock

1+ parts

$1,022.608

100+ parts

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434

$1,022.608

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Vyrian

USA . 2,412 parts In-Stock

1+ parts

-

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2,412

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 1 parts In-Stock

1+ parts

$913.720

100+ parts

-

1k+ parts

-

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1

$913.720

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Corphita

USA . 1,298 parts In-Stock

1+ parts

$968.787

100+ parts

-

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1,298

$968.787

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Corohmni

South Africa . 218 parts In-Stock

1+ parts

$1,076.430

100+ parts

-

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218

$1,076.430

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Kulean Microsystems

USA . 5,791 parts In-Stock

1+ parts

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5,791

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SupplyDigital Components

Austria . 4,878 parts In-Stock

1+ parts

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4,878

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Problanco Electronics

Mexico . 4,021 parts In-Stock

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4,021

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TANS Electronics

Latvia . 2,366 parts In-Stock

1+ parts

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2,366

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UHIMA Technologies

Türkiye . 603 parts In-Stock

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603

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Overview

Experience unparalleled image quality with the KAF-0261-AAA-CD-BA by Onsemi, a leading manufacturer in image sensor technology. This CCD image sensor offers exceptional performance and reliability, making it ideal for a wide range of applications. Whether you're capturing stunning photos or conducting advanced scientific research, this product delivers outstanding results. Invest in the KAF-0261-AAA-CD-BA today and see the difference for yourself.

Feature Benefit Bullets

Pixel Size (um): 20X20

The small pixel size of 20X20 um allows for high resolution images to be captured, making this image sensor perfect for applications requiring detailed image quality.

Maximum Supply Voltage: 17.5 V

The high maximum supply voltage of 17.5 V ensures that the image sensor operates efficiently and reliably, even under varying voltage conditions.

Sensors or Transducers Type: IMAGE SENSOR,CCD

Being a CCD image sensor, this product offers high sensitivity and low noise levels, resulting in high-quality image capture in low-light conditions.

Package Shape or Style: RECTANGULAR

The rectangular package design makes it easy to integrate the image sensor into a variety of devices and systems, providing flexibility in design and installation.

Minimum Supply Voltage: 15 V

The low minimum supply voltage of 15 V ensures that the image sensor operates efficiently without drawing excessive power, making it energy-efficient.

Maximum Operating Temperature: 50 °C

With a high maximum operating temperature of 50 °C, this image sensor can withstand elevated temperatures and is suitable for applications in harsh environments.

Horizontal Pixel: 512

Having 512 horizontal pixels allows for detailed and clear images to be captured, making this image sensor ideal for applications requiring high-resolution imaging.

Minimum Operating Temperature: -70 °C

The low minimum operating temperature of -70 °C ensures that the image sensor can function even in extremely cold conditions, making it suitable for a wide range of environments.

Housing: CERAMIC

The ceramic housing provides durability and protection for the image sensor, making it resistant to temperature fluctuations and environmental damage.

Dynamic Range: 87 dB

With a high dynamic range of 87 dB, this image sensor can capture images with a wide range of brightness levels, ensuring accurate and detailed image reproduction.

Vertical Pixel: 512

Having 512 vertical pixels allows for high-resolution images to be captured, making this image sensor suitable for applications requiring precise image clarity and detail.

Spectral Response (nm): 400-1000

With a spectral response range of 400-1000 nm, this image sensor is capable of capturing a broad range of wavelengths, making it versatile for various imaging applications.

Data Rate: 5 Mbps

The high data rate of 5 Mbps allows for fast and efficient transfer of image data, ensuring real-time imaging and minimal latency in image processing.

Termination Type: SOLDER

The solder termination type provides a reliable and secure connection for the image sensor, ensuring stable performance and longevity in various operating conditions.

Array Type: FULL FRAME

Being a full-frame array type, this image sensor offers a large imaging area and excellent light capture, resulting in high-quality images with minimal distortion.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature allows for easy and secure installation of the image sensor on a PCB or mounting surface, ensuring stability and reliability in operation.

Technical Specifications

Image Sensors KAF-0261-AAA-CD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 10 MICRO VOLT PER ELECTRON

Array Type:

FULL FRAME

Data Rate:

5 Mbps

Dynamic Range:

87 dB

Horizontal Pixel:

512

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

-70 Cel

Package Shape or Style:

Pixel Size (um):

20X20

Sensors or Transducers Type:

Spectral Response (nm):

400-1000

Maximum Supply Voltage:

17.5 V

Minimum Supply Voltage:

15 V

Termination Type:

SOLDER

Vertical Pixel:

512

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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