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AR0135CS2C19SUEA0-DPBR1

Onsemi

AR0135CS2C19SUEA0-DPBR1 by Onsemi

The Onsemi AR0135CS2C19SUEA0-DPBR1 is a 1/3 inch CMOS image sensor with a square package. It features tin/silver/copper terminal finish, suitable for surface mount applications. With dimensions of 9mm x 9mm x 1.55mm, it is ideal for frame array imaging in various devices.

Median Price

$37.609

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

AR0135CS2C19SUEA0-DPBR1 by Onsemi
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 510 parts In-Stock

1+ parts

-

100+ parts

$33.430

1k+ parts

$29.910

10k+ parts

$28.150

510

-

$33.430

$29.910

$28.150

Verical

USA . 510 parts In-Stock

1+ parts

-

100+ parts

$41.788

1k+ parts

$37.388

10k+ parts

$35.188

510

-

$41.788

$37.388

$35.188

Distributors (In-Stock)

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Digiode

USA . 1,717 parts In-Stock

1+ parts

$35.378

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1,717

$35.378

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Vyrian

USA . 3,950 parts In-Stock

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3,950

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VNN

France . 950 parts In-Stock

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950

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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AZTECH Wire

Italy . 1,020 parts In-Stock

1+ parts

$12.480

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$12.480

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Ampacity Inc.

Singapore . 224 parts In-Stock

1+ parts

$31.650

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$31.650

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Corphita

USA . 1,107 parts In-Stock

1+ parts

$33.516

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$33.516

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Corohmni

South Africa . 50 parts In-Stock

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$37.240

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$37.240

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Problanco Electronics

Mexico . 7,109 parts In-Stock

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TANS Electronics

Latvia . 5,173 parts In-Stock

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Argo Parts USA

USA . 4,290 parts In-Stock

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Kulean Microsystems

USA . 4,040 parts In-Stock

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Continental Prestige Electronics

USA . 4,004 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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SupplyDigital Components

Austria . 1,366 parts In-Stock

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UHIMA Technologies

Türkiye . 159 parts In-Stock

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159

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Overview

Capture the world in stunning clarity with the AR0135CS2C19SUEA0-DPBR1 Image Sensor by Onsemi. Known for their top-notch quality and cutting-edge technology, Onsemi delivers exceptional performance in every product they create. Perfect for a wide range of applications, this image sensor provides crystal-clear images with vibrant colors and sharp details. Elevate your projects with the value, benefits, and advantages that only Onsemi can offer. Trust in the AR0135CS2C19SUEA0-DPBR1 to bring your vision to life.

Feature Benefit Bullets

Body Width: 9 inch

The 9-inch body width allows for a compact design, making it suitable for various applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

The CMOS image sensor type provides high-quality image capture and low power consumption, offering excellent performance for imaging applications.

Body Height: 1.55 mm

With a low body height of 1.55 mm, this image sensor can be integrated into thin devices without adding bulk, ideal for slim and compact designs.

Package Shape or Style: SQUARE

The square package shape provides efficient use of space and simplifies mounting in various orientations, enhancing flexibility in product design.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish with tin, silver, and copper ensures reliable solder connections, improving the durability and longevity of the image sensor.

Body Length/Diameter: 9 mm

The 9 mm body length/diameter offers a balanced size for easy integration and compatibility with standard mounting solutions, facilitating installation and replacement.

Optical Format (inch): 1/3

The 1/3-inch optical format delivers excellent image quality and sensitivity, making it suitable for a wide range of imaging applications where detailed and clear visuals are essential.

Termination Type: SOLDER

The solder termination type simplifies the assembly process and ensures secure connections, minimizing the risk of signal loss or disconnection during operation.

Array Type: FRAME

The frame array type allows for efficient data collection and processing, enabling faster image capture and analysis for real-time applications.

Mounting Feature: SURFACE MOUNT

The surface mounting feature offers easy and secure attachment to PCBs, saving space and allowing for automated assembly processes, increasing production efficiency.

Technical Specifications

Image Sensors AR0135CS2C19SUEA0-DPBR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.55 mm

Body Length/Diameter:

9 mm

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/3

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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