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AR0135CS2M00SUEA0-DRBR1

Onsemi

AR0135CS2M00SUEA0-DRBR1 by Onsemi

Onsemi's AR0135CS2M00SUEA0-DRBR1 is a 1/3 inch CMOS image sensor with 1280x960 pixels, offering a dynamic range of 71.1 dB and operating at temperatures from -30 to 70°C. With a max supply voltage of 1.95V and output interface type of 2-WIRE INTERFACE, it is ideal for applications requiring high-resolution imaging at up to 54 fps.

Median Price

$25.118

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

AR0135CS2M00SUEA0-DRBR1 by Onsemi
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 871 parts In-Stock

1+ parts

-

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$21.760

1k+ parts

$19.470

10k+ parts

$18.320

871

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$21.760

$19.470

$18.320

Verical

USA . 871 parts In-Stock

1+ parts

-

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$28.475

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$25.475

10k+ parts

$23.975

871

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$28.475

$25.475

$23.975

Distributors (In-Stock)

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Digiode

USA . 641 parts In-Stock

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$24.111

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$24.111

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Vyrian

USA . 6,694 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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VNN

France . 901 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 146 parts In-Stock

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$2.800

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$2.800

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AZTECH Wire

Italy . 1,045 parts In-Stock

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$8.790

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1,045

$8.790

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Ampacity Inc.

Singapore . 421 parts In-Stock

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$21.570

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421

$21.570

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Corphita

USA . 217 parts In-Stock

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$22.842

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$22.842

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Corohmni

South Africa . 128 parts In-Stock

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$25.380

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128

$25.380

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SupplyDigital Components

Austria . 5,226 parts In-Stock

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TANS Electronics

Latvia . 4,578 parts In-Stock

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Continental Prestige Electronics

USA . 3,432 parts In-Stock

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Kulean Microsystems

USA . 3,326 parts In-Stock

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Argo Parts USA

USA . 2,941 parts In-Stock

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Problanco Electronics

Mexico . 2,636 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Perfect Parts

USA . 582 parts In-Stock

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UHIMA Technologies

Türkiye . 289 parts In-Stock

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Overview

Capture the world in stunning detail with the AR0135CS2M00SUEA0-DRBR1 by Onsemi. As a leading manufacturer of image sensors, Onsemi delivers top-notch quality and reliability. This sensor is perfect for a wide range of applications, from security cameras to automotive systems. With a high dynamic range and impressive pixel size, this sensor provides exceptional image clarity and performance. Trust Onsemi to bring cutting-edge technology to your projects and elevate your work to the next level.

Feature Benefit Bullets

Pixel Size (um): 3.75

The small pixel size allows for high resolution images to be captured with great detail, making this product ideal for high-quality imaging applications.

Maximum Supply Voltage: 1.95 V

The high maximum supply voltage ensures reliable and stable operation of the image sensor, making it suitable for various power supply configurations.

Master Clock: 50 MHz

The high master clock frequency enables fast data readout and processing, resulting in quick and efficient image capture.

Body Width: 9 inch

The compact body width of 9 inches allows for easy integration into different systems and devices without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

Being a CMOS image sensor, this product offers low power consumption, high sensitivity, and excellent noise performance for superior image quality.

Maximum Operating Temperature: 70 °C

The wide maximum operating temperature range of 70°C ensures reliable performance in various environmental conditions.

Horizontal Pixel: 1280

The high horizontal pixel count results in high-resolution images with sharp details and clarity, making this product ideal for imaging applications that require precise image capture.

Output Range: 0.40-1.50V

The wide output voltage range allows for flexibility in signal processing and compatibility with different types of image processing systems.

Output Type: DIGITAL VOLTAGE

The digital voltage output simplifies signal processing and integration with digital interfaces, making it easier to work with digital image processing systems.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30°C ensures reliable performance even in extreme cold conditions, making this product suitable for a wide range of applications.

Frame Rate: 54 fps

The high frame rate of 54 frames per second enables real-time image capture and video recording, making this product suitable for applications that require fast image processing.

Array Type: FRAME

The frame array type ensures efficient image capture and processing, resulting in high-quality images with accurate color reproduction and detail.

Technical Specifications

Image Sensors AR0135CS2M00SUEA0-DRBR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER; IT ALSO OPERATES AT ANALOG VOLTAGE OF 2.5 V TO 3.1 V

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.39 mm

Body Length/Diameter:

9 mm

Dynamic Range:

71.1 dB

Frame Rate:

54 fps

Horizontal Pixel:

1280

JESD-609 Code:

e1

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Current:

90 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.75

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

960

Trade Compliance

AR0135CS2M00SUEA0-DRBR1 Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.40.60.50

SB

8541.40.60.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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