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KAI-04022-FBA-CD-BA

Onsemi

KAI-04022-FBA-CD-BA by Onsemi

KAI-04022-FBA-CD-BA by Onsemi is an image sensor with 2048x2048 pixels, 7.4um pixel size, and 72dB dynamic range. Ideal for applications requiring high-resolution imaging in a compact form factor, such as industrial machine vision systems or scientific cameras.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 100,306 parts In-Stock

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Vyrian

USA . 8,732 parts In-Stock

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Digiode

USA . 932 parts In-Stock

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AZTECH Wire

Italy . 335 parts In-Stock

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$17.070

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335

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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SupplyDigital Components

Austria . 7,440 parts In-Stock

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Problanco Electronics

Mexico . 6,741 parts In-Stock

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Kulean Microsystems

USA . 6,701 parts In-Stock

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TANS Electronics

Latvia . 6,453 parts In-Stock

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Corphita

USA . 791 parts In-Stock

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Corohmni

South Africa . 322 parts In-Stock

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UHIMA Technologies

Türkiye . 157 parts In-Stock

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Overview

Capture stunning images with the KAI-04022-FBA-CD-BA by Onsemi, a high-quality image sensor perfect for a wide range of applications. Manufactured by Onsemi, a trusted leader in the industry, this CCD image sensor offers exceptional performance and reliability. Whether you're in the medical imaging, security, or industrial automation field, this sensor provides unmatched value with its impressive dynamic range and precise pixel size. Elevate your projects with the KAI-04022-FBA-CD-BA and experience unparalleled quality and clarity in every image captured.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Small pixel size allows for high resolution images with fine details.

Maximum Supply Voltage: 15.5 V

Higher supply voltage allows for better performance and signal amplification.

Body Width: 25.65 inch

Compact body width makes it suitable for a variety of applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors offer high quality, low noise imaging for accurate data capture.

Body Height: 4.95 mm

Low body height makes it easy to integrate into different systems and setups.

Package Shape or Style: RECTANGULAR

Rectangular shape allows for efficient packing and placement within devices.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage ensures energy efficiency and reliable operation.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures durability in various environmental conditions.

Horizontal Pixel: 2048

High horizontal pixel count enables detailed and clear imaging.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature ensures functionality in extreme cold conditions.

Housing: CERAMIC

Ceramic housing provides thermal stability and protection for sensitive components.

Dynamic Range: 72 dB

High dynamic range allows for better differentiation of light and dark areas in images.

Vertical Pixel: 2048

High vertical pixel count ensures sharp and detailed images in both horizontal and vertical dimensions.

Body Length/Diameter: 35.56 mm

Compact body length/diameter makes it easy to mount and integrate into different systems.

Optical Format (inch): 4/3

Standard optical format allows for compatibility and interchangeability with other components and systems.

Termination Type: SOLDER

Solder termination provides secure and reliable connections for stable performance.

Array Type: INTERLINE

Interline array type offers fast readout speed and high sensitivity for quick and accurate image capture.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature enables easy and secure installation in various devices and setups.

Technical Specifications

Image Sensors KAI-04022-FBA-CD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 33 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

25.65 inch

Body Height:

4.95 mm

Body Length/Diameter:

35.56 mm

Dynamic Range:

72 dB

Horizontal Pixel:

2048

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

4/3

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

2048

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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