Loading...

MT9M001C12STC-TP

Onsemi

MT9M001C12STC-TP by Onsemi

The Onsemi MT9M001C12STC-TP is a CMOS image sensor with 1280x1024 pixels, 5.2um pixel size, and 48MHz master clock. It operates at temperatures from 0 to 70°C and has a dynamic range of 68.2dB. Ideal for digital imaging applications requiring high-resolution and fast frame rates.

Median Price

$22.274

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$22.274

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$22.274

-

-

-

Vyrian

USA . 6,208 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,208

-

-

-

-

Digiode

USA . 351 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

351

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 4,876 parts In-Stock

1+ parts

$3.380

100+ parts

-

1k+ parts

-

10k+ parts

-

4,876

$3.380

-

-

-

AZTECH Wire

Italy . 783 parts In-Stock

1+ parts

$10.511

100+ parts

-

1k+ parts

-

10k+ parts

-

783

$10.511

-

-

-

Corohmni

South Africa . 170 parts In-Stock

1+ parts

$21.829

100+ parts

-

1k+ parts

-

10k+ parts

-

170

$21.829

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$22.274

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$22.274

-

-

-

Continental Prestige Electronics

USA . 453 parts In-Stock

1+ parts

$22.274

100+ parts

-

1k+ parts

-

10k+ parts

$21.829

453

$22.274

-

-

$21.829

Ampacity Inc.

Singapore . 1,160 parts In-Stock

1+ parts

$38.750

100+ parts

-

1k+ parts

-

10k+ parts

-

1,160

$38.750

-

-

-

Problanco Electronics

Mexico . 5,553 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,553

-

-

-

-

Kulean Microsystems

USA . 3,810 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,810

-

-

-

-

SupplyDigital Components

Austria . 1,799 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,799

-

-

-

-

Argo Parts USA

USA . 1,253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,253

-

-

-

-

TANS Electronics

Latvia . 851 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

851

-

-

-

-

Corphita

USA . 803 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

803

-

-

-

-

UHIMA Technologies

Türkiye . 568 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

568

-

-

-

-

Overview

Capture life's moments with crystal clarity using the MT9M001C12STC-TP image sensor by Onsemi. Known for their top-notch quality and cutting-edge technology, Onsemi delivers exceptional performance in every product. Ideal for a wide range of applications, this image sensor offers unparalleled value and benefits to customers. Whether you're capturing stunning visuals for security systems, medical imaging, or industrial automation, this sensor provides high-quality images with ease. Upgrade your project with the MT9M001C12STC-TP and experience the difference today.

Feature Benefit Bullets

Pixel Size (um): 5.2X5.2

Provides high resolution images with clear details.

Maximum Supply Voltage: 3.6 V

Allows for efficient power usage while providing adequate voltage for operation.

Master Clock: 48 MHz

Enables fast data processing and high frame rates.

Body Width: 14.22 inch

Compact size allows for easy integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensor technology offers high-quality images and low power consumption.

Package Shape or Style: SQUARE

Sleek design for modern applications and easy mounting.

Minimum Supply Voltage: 3 V

Operating at lower voltages can help extend battery life in portable devices.

Maximum Operating Temperature: 70 °C

Can withstand higher temperatures for reliable performance in various environments.

Horizontal Pixel: 1280

High pixel count provides detailed and sharp images.

Output Type: DIGITAL VOLTAGE

Efficient digital output for seamless integration with digital systems.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature conditions without issues.

Maximum Operating Current: 24 mA

Low current consumption for energy-efficient operation.

Housing: CERAMIC

Durable ceramic housing for long-term reliability.

Dynamic Range: 68.2 dB

Wide dynamic range for capturing both bright and dark areas in the same image.

Vertical Pixel: 1024

High vertical resolution for detailed images.

Body Length/Diameter: 14.22 mm

Compact dimensions for easy integration and space-saving design.

Optical Format (inch): 1/2

Common optical format for compatibility with various lenses and imaging systems.

Termination Type: SOLDER

Secure solder termination for reliable connections.

Output Interface Type: 2-WIRE INTERFACE

Simple 2-wire interface for easy connectivity.

Frame Rate: 30 fps

High frame rate for smooth video capture and real-time imaging.

Array Type: FRAME

Frame array design for efficient image capture and processing.

Mounting Feature: SURFACE MOUNT

Convenient surface mount installation for easy integration into devices.

Technical Specifications

Image Sensors MT9M001C12STC-TP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Body Width:

14.22 inch

Body Height:

2.25 mm

Body Length/Diameter:

14.22 mm

Dynamic Range:

68.2 dB

Frame Rate:

30 fps

Horizontal Pixel:

1280

Housing:

CERAMIC

Master Clock:

48 MHz

Mounting Feature:

Maximum Operating Current:

24 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Optical Format (inch):

1/2

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

5.2X5.2

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Vertical Pixel:

1024

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19