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MT9M034I12STC-DPBR

Onsemi

MT9M034I12STC-DPBR by Onsemi

MT9M034I12STC-DPBR by Onsemi is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 115dB dynamic range. Ideal for applications requiring high-quality digital imaging at up to 60fps frame rate in a compact square package.

Median Price

$31.470

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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DigiKey

USA . 643 parts In-Stock

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-

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$31.470

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$31.470

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$31.470

643

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$31.470

$31.470

Flip Electronics (Authorized)

USA . 643 parts In-Stock

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643

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Component Electronics Inc.

Canada . 5 parts In-Stock

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$46.150

100+ parts

$34.620

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$30.000

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5

$46.150

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Vyrian

USA . 2,466 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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Flip Electronics

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Chip Stock

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325

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Digiode

USA . 275 parts In-Stock

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275

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Distributors (Availability)

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Ampacity Inc.

Singapore . 528 parts In-Stock

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$26.750

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528

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Corohmni

South Africa . 166 parts In-Stock

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Kulean Microsystems

USA . 7,697 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,313 parts In-Stock

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Problanco Electronics

Mexico . 7,285 parts In-Stock

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TANS Electronics

Latvia . 6,589 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 1,846 parts In-Stock

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Argo Parts USA

USA . 1,606 parts In-Stock

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Continental Prestige Electronics

USA . 1,496 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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SupplyDigital Components

Austria . 710 parts In-Stock

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S.R.D Solutions

India . 100 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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UHIMA Technologies

Türkiye . 49 parts In-Stock

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Overview

Capture every detail with the Onsemi MT9M034I12STC-DPBR image sensor, a cutting-edge technology that delivers unparalleled quality and precision. Manufactured by Onsemi, a trusted leader in the industry, this sensor is perfect for a wide range of applications such as security cameras, industrial imaging, and automotive systems. With its high-performance capabilities and advanced features, this product offers customers exceptional value, reliability, and performance. Upgrade your imaging experience with the MT9M034I12STC-DPBR and see the world in a whole new light.

Feature Benefit Bullets

Pixel Size (um): 3.75X3.75

Small pixel size allows for high resolution and detail in images captured by the sensor.

Maximum Supply Voltage: 1.95 V

Higher supply voltage allows for better performance and functionality of the image sensor.

Master Clock: 50 MHz

High master clock frequency enables fast and efficient image processing.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS technology ensures low power consumption and high-quality image output.

Package Shape or Style: SQUARE

Square package shape makes it easy to mount and integrate the image sensor into different devices.

Dynamic Range: 115 dB

Wide dynamic range allows the sensor to capture both bright and dark areas in the same image with high accuracy.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies the connectivity and communication with other electronic devices.

Frame Rate: 60 fps

High frame rate ensures smooth and real-time imaging for various applications.

Technical Specifications

Image Sensors MT9M034I12STC-DPBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

DUAL OUTPUT

Array Type:

FRAME

Body Width:

10 inch

Body Height:

1.25 mm

Body Length/Diameter:

10 mm

Dynamic Range:

115 dB

Frame Rate:

60 fps

Horizontal Pixel:

1280

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Current:

115 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.75X3.75

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

960

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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