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NOIX1SE8000B-LTI

Onsemi

NOIX1SE8000B-LTI by Onsemi

NOIX1SE8000B-LTI by Onsemi is an Image Sensor with 3.2x3.2 um pixel size, 32.4 MHz master clock, and 4096 horizontal pixels. Ideal for digital imaging applications requiring a high dynamic range of 68 dB and a frame rate of 128 fps in a compact rectangular package suitable for surface mounting.

Median Price

$441.100

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 873 parts In-Stock

1+ parts

$352.880

100+ parts

$331.710

1k+ parts

$310.530

10k+ parts

-

873

$352.880

$331.710

$310.530

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DigiKey

USA . 873 parts In-Stock

1+ parts

$441.100

100+ parts

-

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873

$441.100

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-

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Verical

USA . 628 parts In-Stock

1+ parts

$441.100

100+ parts

$414.637

1k+ parts

$388.163

10k+ parts

-

628

$441.100

$414.637

$388.163

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,343 parts In-Stock

1+ parts

$389.196

100+ parts

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2,343

$389.196

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Vyrian

USA . 7,177 parts In-Stock

1+ parts

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7,177

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Flip Electronics

USA . 775 parts In-Stock

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775

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,092 parts In-Stock

1+ parts

$368.712

100+ parts

-

1k+ parts

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2,092

$368.712

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-

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Corohmni

South Africa . 323 parts In-Stock

1+ parts

$409.680

100+ parts

-

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10k+ parts

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323

$409.680

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TANS Electronics

Latvia . 4,659 parts In-Stock

1+ parts

-

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4,659

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Kulean Microsystems

USA . 4,347 parts In-Stock

1+ parts

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4,347

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SupplyDigital Components

Austria . 3,694 parts In-Stock

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3,694

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Problanco Electronics

Mexico . 2,779 parts In-Stock

1+ parts

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2,779

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UHIMA Technologies

Türkiye . 198 parts In-Stock

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198

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Overview

Discover the next level of imaging technology with the NOIX1SE8000B-LTI by Onsemi. As a leading manufacturer in the industry, Onsemi delivers unparalleled quality and innovation in image sensors. Ideal for a wide range of applications, this product offers crystal-clear images with a dynamic range of 68 dB. From capturing breathtaking landscapes to detailed medical imaging, this sensor provides exceptional value and performance. Elevate your projects with the superior capabilities of the NOIX1SE8000B-LTI - where quality meets precision.

Feature Benefit Bullets

Pixel Size (um) 3.2X3.2

Small pixel size allows for high resolution images with fine details.

Maximum Supply Voltage

Operating at a low voltage level helps in reducing power consumption and heat generation.

Master Clock 32.4 MHz

High clock frequency enables fast data processing and high frame rates.

Body Width 19.9 inch

Compact size allows for easy integration into various devices and systems.

Sensors or Transducers Type IMAGE SENSOR,CMOS

CMOS sensors offer low power consumption, high sensitivity, and faster readout speeds.

Minimum Supply Voltage 1.1 V

The ability to operate at low voltages supports energy-efficient designs.

Maximum Operating Temperature 85 °C

Wide temperature range allows for operation in various environmental conditions.

Vertical Pixel 2160

High vertical pixel count enables capturing high-quality, detailed images.

Technical Specifications

Image Sensors NOIX1SE8000B-LTI attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER; IT ALSO OPERATES AT ANALOG VOLTAGE OF 2.7 V TO 2.9V

Array Type:

FRAME

Body Width:

19.9 inch

Body Height:

2.54 mm

Body Length/Diameter:

20.88 mm

Dynamic Range:

68 dB

Frame Rate:

128 fps

Horizontal Pixel:

4096

Housing:

CERAMIC, METAL-SEALED COFIRED

Master Clock:

32.4 MHz

Mounting Feature:

Maximum Operating Current:

240 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/1.1

Output Interface Type:

I2C/SPI INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.2X3.2

Sensors or Transducers Type:

Spectral Response (nm):

300-1000

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.1 V

Termination Type:

SOLDER

Vertical Pixel:

2160

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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