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NOIX1SN012KB-LTI1

Onsemi

NOIX1SN012KB-LTI1 by Onsemi

NOIX1SN012KB-LTI1 by Onsemi is an Image Sensor with 3.2x3.2 um pixel size, 32.4 MHz master clock, and 4096 horizontal pixels. It operates b/w -40 to 85 °C and outputs digital voltage via I2C/SPI interface. Ideal for applications requiring high-resolution imaging at a fast frame rate of 90 fps in a compact surface-mount package.

Median Price

$390.252

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10 parts In-Stock

1+ parts

$346.890

100+ parts

$326.080

1k+ parts

$305.260

10k+ parts

-

10

$346.890

$326.080

$305.260

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Verical

USA . 10 parts In-Stock

1+ parts

$433.613

100+ parts

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10

$433.613

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DigiKey

USA . 86 parts In-Stock

1+ parts

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86

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Mouser Electronics

USA . 4 parts In-Stock

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4

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Flip Electronics (Authorized)

USA . 2 parts In-Stock

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Digiode

USA . 2,360 parts In-Stock

1+ parts

$465.680

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2,360

$465.680

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Vyrian

USA . 7,652 parts In-Stock

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7,652

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Flip Electronics

USA . 86 parts In-Stock

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86

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Distributors (Availability)

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Corohmni

South Africa . 232 parts In-Stock

1+ parts

$440.040

100+ parts

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232

$440.040

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Corphita

USA . 1,442 parts In-Stock

1+ parts

$441.171

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1,442

$441.171

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TANS Electronics

Latvia . 4,578 parts In-Stock

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4,578

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Kulean Microsystems

USA . 4,086 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Problanco Electronics

Mexico . 1,600 parts In-Stock

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1,600

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UHIMA Technologies

Türkiye . 901 parts In-Stock

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901

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SupplyDigital Components

Austria . 79 parts In-Stock

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GreenTree Electronics

Israel . 63 parts In-Stock

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Perfect Parts

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Overview

Experience the cutting-edge technology of the NOIX1SN012KB-LTI1 by Onsemi, a premium image sensor that promises top-notch quality and reliability. With a wide range of applications in various industries, this product boasts superior performance and precision, ensuring crystal-clear imaging every time. The innovative design and advanced features set it apart from the competition, providing customers with exceptional value and unmatched benefits. Discover the difference with the NOIX1SN012KB-LTI1 and elevate your projects to new heights.

Feature Benefit Bullets

Pixel Size (um): 3.2X3.2

Small pixel size allows for high resolution, detailed images to be captured.

Maximum Supply Voltage: 1.3 V

Efficient power usage with a low maximum supply voltage.

Master Clock: 32.4 MHz

High master clock frequency enables fast data processing.

Body Width: 19.9 inch

Compact size for easy integration into various imaging systems.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS technology offers high sensitivity and low noise performance.

Body Height: 2.54 mm

Low profile design for flexibility in installation and space-saving.

Package Shape or Style: RECTANGULAR

Standardized package shape for easy compatibility and mounting.

Minimum Supply Voltage: 1.1 V

Operates efficiently with a low minimum supply voltage.

Maximum Operating Temperature: 85 °C

Wide temperature range for versatile use in various environments.

Horizontal Pixel: 4096

High horizontal pixel count for sharp, detailed image capture.

Output Range: 0.4-1.5V

Digital voltage output range for easy interfacing with other components.

Output Type: DIGITAL VOLTAGE

Digital output type for precise and accurate image data transmission.

Minimum Operating Temperature: -40 °C

Wide operating temperature range for reliable performance in extreme conditions.

Maximum Operating Current: 240 mA

Low operating current for energy-efficient operation.

Housing: CERAMIC, METAL-SEALED COFIRED

Durable housing materials for long-lasting performance and protection.

Dynamic Range: 68 dB

Wide dynamic range for capturing both bright and dark image details accurately.

Vertical Pixel: 3072

High vertical pixel count for detailed image resolution.

Body Length/Diameter: 20.88 mm

Compact body size for easy integration and installation.

Spectral Response (nm): 300-1000

Wide spectral response range for capturing a variety of wavelengths.

Termination Type: SOLDER

Standard solder termination type for easy connectivity.

Output Interface Type: I2C/SPI INTERFACE

Multiple output interface options for versatile connectivity.

Frame Rate: 90 fps

High frame rate for capturing fast-moving subjects with clarity.

Array Type: FRAME

Frame array type for efficient image capture and processing.

Mounting Feature: SURFACE MOUNT

Easy surface mount installation for quick and secure mounting.

Technical Specifications

Image Sensors NOIX1SN012KB-LTI1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER; IT ALSO OPERATES AT ANALOG VOLTAGE OF 2.7 V TO 2.9V

Array Type:

FRAME

Body Width:

19.9 inch

Body Height:

2.54 mm

Body Length/Diameter:

20.88 mm

Dynamic Range:

68 dB

Frame Rate:

90 fps

Horizontal Pixel:

4096

Housing:

CERAMIC, METAL-SEALED COFIRED

Master Clock:

32.4 MHz

Mounting Feature:

Maximum Operating Current:

240 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1

Output Interface Type:

I2C/SPI INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.2X3.2

Sensors or Transducers Type:

Spectral Response (nm):

300-1000

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.1 V

Termination Type:

SOLDER

Vertical Pixel:

3072

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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