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KAI-08670-AXA-JD-B2

Onsemi

KAI-08670-AXA-JD-B2 by Onsemi

Onsemi's KAI-08670-AXA-JD-B2 image sensor features 7.4x7.4 um pixel size, 40 MHz master clock, and 3600 horizontal pixels. Ideal for applications requiring high-quality imaging with a dynamic range of 82 dB, such as industrial machine vision systems or surveillance cameras.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,348 parts In-Stock

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Digiode

USA . 1,526 parts In-Stock

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AZTECH Wire

Italy . 865 parts In-Stock

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SupplyDigital Components

Austria . 7,971 parts In-Stock

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Problanco Electronics

Mexico . 7,142 parts In-Stock

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TANS Electronics

Latvia . 5,415 parts In-Stock

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Kulean Microsystems

USA . 5,137 parts In-Stock

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Corphita

USA . 1,935 parts In-Stock

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Corohmni

South Africa . 382 parts In-Stock

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UHIMA Technologies

Türkiye . 156 parts In-Stock

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Overview

Capture stunning images with the KAI-08670-AXA-JD-B2 image sensor by Onsemi. Renowned for their high-quality products, Onsemi delivers top-notch performance and reliability. Ideal for applications in surveillance, industrial imaging, and medical devices, this sensor offers exceptional value with its impressive dynamic range and high resolution. Elevate your imaging projects with the KAI-08670-AXA-JD-B2 and experience the superior quality and advanced technology that Onsemi is known for.

Feature Benefit Bullets

Pixel Size (um): 7.4x7.4

Smaller pixel size allows for higher resolution images to be captured, making this product suitable for applications requiring detailed image quality.

Maximum Supply Voltage: 15.5 V

Higher maximum supply voltage provides flexibility in power requirements and allows for stable operation under varying voltage conditions.

Master Clock: 40 MHz

High master clock frequency ensures fast data readout and processing, making this sensor suitable for applications requiring high-speed image capture.

Body Width: 45.34 inch

Compact body width enables easy integration into devices with limited space, making this sensor suitable for small form factor applications.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD sensors are known for their high-quality image capture, making this product a good choice for applications requiring professional-grade imaging.

Minimum Operating Temperature: -50 °C

Wide operating temperature range allows this sensor to be used in extreme environments, making it suitable for outdoor or industrial applications.

Dynamic Range: 82 dB

High dynamic range enables this sensor to capture both dark and bright areas in a scene accurately, making it suitable for challenging lighting conditions.

Array Type: INTERLINE

Interline array type reduces image lag and distortion, making this sensor suitable for applications requiring minimal image artifacts.

Technical Specifications

Image Sensors KAI-08670-AXA-JD-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS SENSITIVITY OF 33 AND 9.7 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

45.34 inch

Body Height:

3.3 mm

Body Length/Diameter:

47.24 mm

Dynamic Range:

82 dB

Frame Rate:

12 fps

Horizontal Pixel:

3600

Master Clock:

40 MHz

Mounting Feature:

Maximum Operating Current:

11 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1.26

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

2400

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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