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AR0220AT4C00XUEA2-DPBR

Onsemi

AR0220AT4C00XUEA2-DPBR by Onsemi

Onsemi's AR0220AT4C00XUEA2-DPBR is a 1/1.8 inch CMOS image sensor with 1828x948 resolution, offering digital output via a 2-wire interface at 60 fps. Ideal for surface mount applications in frame arrays, this sensor measures 9" x 12mm x 1.7mm and features Tin/Silver/Copper terminal finish for solder connections.

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1k+

AR0220AT4C00XUEA2-DPBR by Onsemi
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Vyrian

USA . 553 parts In-Stock

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Digiode

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Native Components

USA . 155 parts In-Stock

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$1.958

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Northwest PG Solutions

USA . 315 parts In-Stock

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SupplyDigital Components

Austria . 7,739 parts In-Stock

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Problanco Electronics

Mexico . 6,770 parts In-Stock

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TANS Electronics

Latvia . 4,232 parts In-Stock

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Corphita

USA . 1,620 parts In-Stock

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Kulean Microsystems

USA . 613 parts In-Stock

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Corohmni

South Africa . 380 parts In-Stock

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UHIMA Technologies

Türkiye . 181 parts In-Stock

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Overview

Elevate your imaging experience with the AR0220AT4C00XUEA2-DPBR by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in every product. This Image Sensor boasts a sleek rectangular design and impressive specifications like a high frame rate of 60 fps. Perfect for a wide range of applications, this sensor delivers crisp digital output with a 2-wire interface. Elevate your projects with the superior performance and value that only Onsemi can provide.

Feature Benefit Bullets

Body Width: 9 inch

The wide body width allows for greater surface area for the CMOS image sensor, potentially capturing more detailed and high-quality images.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption and high signal-to-noise ratio, which can result in clear and energy-efficient image capture.

Body Height: 1.7 mm

The low body height makes this image sensor suitable for compact designs and applications where space is limited.

Package Shape or Style: RECTANGULAR

The rectangular package shape allows for easy integration into various electronic devices and systems.

Horizontal Pixel: 1828

The high horizontal pixel count contributes to a detailed and sharp image output.

Output Type: DIGITAL OUTPUT

Digital output simplifies the process of transferring image data and allows for easy integration with digital devices.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The choice of terminal finish materials ensures good conductivity and durability for reliable performance.

Vertical Pixel: 948

The vertical pixel count complements the horizontal pixel count in capturing a balanced and high-resolution image.

Body Length/Diameter: 12 mm

The moderate body length/diameter allows for a good balance between compactness and functionality in various applications.

Optical Format (inch): 1/1.8

The optical format of 1/1.8 inch provides a good balance between sensor size and image quality, making it suitable for a wide range of applications.

Termination Type: SOLDER

The solder termination type ensures secure and reliable connections for long-term usage.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the integration of the image sensor with other components and systems.

Frame Rate: 60 fps

The high frame rate of 60 frames per second allows for smooth and real-time image capture, making it suitable for fast-moving subjects or applications.

Array Type: FRAME

The frame array type ensures efficient image capture and processing for high-quality output.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy and secure installation on various surfaces, enhancing the usability and versatility of the image sensor.

Technical Specifications

Image Sensors AR0220AT4C00XUEA2-DPBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

AEC-Q100, ROLLING SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.7 mm

Body Length/Diameter:

12 mm

Frame Rate:

60 fps

Horizontal Pixel:

1828

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/1.8

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

948

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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