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KAI-0340-FBA-CB-AA-SINGLE

Onsemi

KAI-0340-FBA-CB-AA-SINGLE by Onsemi

KAI-0340-FBA-CB-AA-SINGLE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 640x480 resolution, and 69 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.

Median Price

$112.510

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$16.260

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$16.260

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-

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Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$112.510

1k+ parts

$100.670

10k+ parts

$94.740

2

-

$112.510

$100.670

$94.740

DigiKey

USA . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2

-

-

-

-

Verical

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$181.537

1k+ parts

$169.950

10k+ parts

-

2

-

$181.537

$169.950

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,361 parts In-Stock

1+ parts

$15.447

100+ parts

-

1k+ parts

-

10k+ parts

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1,361

$15.447

-

-

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Vyrian

USA . 6,355 parts In-Stock

1+ parts

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100+ parts

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6,355

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 475 parts In-Stock

1+ parts

$14.634

100+ parts

-

1k+ parts

-

10k+ parts

-

475

$14.634

-

-

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Corohmni

South Africa . 71 parts In-Stock

1+ parts

$16.260

100+ parts

-

1k+ parts

-

10k+ parts

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71

$16.260

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Continental Prestige Electronics

USA . 2 parts In-Stock

1+ parts

$144.960

100+ parts

-

1k+ parts

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10k+ parts

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2

$144.960

-

-

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TANS Electronics

Latvia . 7,413 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,413

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Kulean Microsystems

USA . 5,955 parts In-Stock

1+ parts

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100+ parts

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5,955

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SupplyDigital Components

Austria . 5,044 parts In-Stock

1+ parts

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100+ parts

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5,044

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Problanco Electronics

Mexico . 5,004 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,004

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UHIMA Technologies

Türkiye . 109 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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109

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Overview

Looking for top-notch image sensors for your next project? Look no further than the KAI-0340-FBA-CB-AA-SINGLE by Onsemi. Known for their superior quality and reliability, Onsemi's image sensors are a game-changer in the industry. With a wide range of applications in various industries, this product offers unmatched value and benefits to customers. Upgrade your imaging capabilities with the KAI-0340-FBA-CB-AA-SINGLE and experience the difference it can make in your projects.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Small pixel size allows for high resolution images to be captured with fine details.

Maximum Supply Voltage: 15.25 V

Higher supply voltage allows for better performance and signal-to-noise ratio.

Body Width: 12.7 inch

Compact body width makes it suitable for space-constrained applications.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD sensors provide high-quality images with low noise levels.

Body Height: 5.15 mm

Low profile design enables easy integration into various devices.

Package Shape or Style: RECTANGULAR

Rectangular shape offers easy mounting and alignment within systems.

Minimum Supply Voltage: 14.75 V

Lower minimum supply voltage allows for power-efficient operation.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures performance in various environments.

Horizontal Pixel: 640

High horizontal pixel count results in detailed and sharp images.

Minimum Operating Temperature: -50 °C

Ability to operate in low temperatures makes it suitable for diverse applications.

Housing: CERAMIC

Ceramic housing provides durability and thermal stability for reliable operation.

Dynamic Range: 69 dB

High dynamic range allows for capturing a wide range of light intensities.

Vertical Pixel: 480

Vertical pixel count contributes to the overall image resolution and quality.

Body Length/Diameter: 15.87 mm

Compact body length ensures easy installation and integration into systems.

Optical Format (inch): 1/3

Optical format compatibility with 1/3-inch lenses for versatile imaging options.

Termination Type: SOLDER

Solder termination offers secure electrical connections for reliable performance.

Array Type: INTERLINE

Interline array design enables faster readout speeds and reduced image lag.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting provides secure attachment for stable and reliable operation.

Technical Specifications

Image Sensors KAI-0340-FBA-CB-AA-SINGLE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 30 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER; IT ALSO HAVE DYNAMIC RANGE 62 DB

Array Type:

INTERLINE

Body Width:

12.7 inch

Body Height:

5.15 mm

Body Length/Diameter:

15.87 mm

Dynamic Range:

69 dB

Horizontal Pixel:

640

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1/3

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.25 V

Minimum Supply Voltage:

14.75 V

Termination Type:

SOLDER

Vertical Pixel:

480

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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