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AR0144ATSM20XUEA0-TPBR

Onsemi

AR0144ATSM20XUEA0-TPBR by Onsemi

Onsemi's AR0144ATSM20XUEA0-TPBR is a 1/4 inch CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 60 fps frame rate. Ideal for surface mount applications, it features a square package style and solder termination type.

Median Price

$16.176

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

AR0144ATSM20XUEA0-TPBR by Onsemi
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Distributors (Authorized)

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DigiKey

USA . 2,000 parts In-Stock

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$16.176

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Flip Electronics (Authorized)

USA . 180 parts In-Stock

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Vyrian

USA . 1,825 parts In-Stock

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$15.660

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Flip Electronics

USA . 2,180 parts In-Stock

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Digiode

USA . 1,378 parts In-Stock

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Native Components

USA . 361 parts In-Stock

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$1.676

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361

$1.676

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Northwest PG Solutions

USA . 2,149 parts In-Stock

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$1.844

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Corohmni

South Africa . 115 parts In-Stock

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$15.660

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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SupplyDigital Components

Austria . 8,319 parts In-Stock

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TANS Electronics

Latvia . 6,159 parts In-Stock

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Corphita

USA . 1,503 parts In-Stock

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Kulean Microsystems

USA . 929 parts In-Stock

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Problanco Electronics

Mexico . 513 parts In-Stock

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UHIMA Technologies

Türkiye . 164 parts In-Stock

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Overview

Unlock the power of visual technology with the AR0144ATSM20XUEA0-TPBR image sensor by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality sensors that are perfect for a wide range of applications. From security cameras to automotive systems, this image sensor offers unparalleled performance and reliability. With its advanced features and innovative design, customers can expect nothing but the best when they choose the AR0144ATSM20XUEA0-TPBR. Experience the difference with Onsemi today.

Feature Benefit Bullets

Pixel Size (um) 3X3

Smaller pixel size provides higher resolution and better image quality.

Body Width 7 inch

Compact size makes it easy to integrate into various devices without taking up much space.

Sensors or Transducers Type IMAGE SENSOR,CMOS

CMOS sensors offer low power consumption and high sensitivity, making them suitable for a wide range of applications.

Body Height 1.28 mm

Low profile design allows for slim device form factor and easy integration into small spaces.

Package Shape or Style SQUARE

Square shape provides a symmetrical design for easier placement and alignment during assembly.

Horizontal Pixel 1280

Higher horizontal pixel count allows for detailed and high-resolution image capture.

Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)

Multiple terminal finish options ensure good conductivity and durability for reliable performance.

Vertical Pixel 800

Generous vertical pixel count allows for capturing a wide field of view and detailed images.

Body Length/Diameter 7 mm

Compact body size facilitates easy mounting and integration into various devices.

Optical Format (inch) 1/4

Standard optical format ensures compatibility with a wide range of lenses and optical systems.

Termination Type SOLDER

Solder termination provides a secure and reliable electrical connection for consistent performance.

Output Interface Type 2-WIRE INTERFACE

2-wire interface simplifies connectivity and communication with other devices or systems.

Frame Rate 60 fps

High frame rate enables smooth and clear video recording and fast image capture.

Array Type SINGLE FRAME

Single frame array design simplifies image processing and data handling for improved efficiency.

Mounting Feature SURFACE MOUNT

Surface mount capability allows for easy and secure attachment to PCBs or other surfaces for stable operation.

Technical Specifications

Image Sensors AR0144ATSM20XUEA0-TPBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER

Array Type:

SINGLE FRAME

Body Width:

7 inch

Body Height:

1.28 mm

Body Length/Diameter:

7 mm

Frame Rate:

60 fps

Horizontal Pixel:

1280

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Pixel Size (um):

3X3

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

800

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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